The TDA4VH and TDA4AH SoCs are
targeted for automotive applications and aim to meet the complex processing
needs of modern embedded products. They are designed as a high performance and
highly integrated device architecture, providing significant levels of
processing power, graphics capability, video and imaging processing,
virtualization, and coherent memory support.
Key distinguishing device
features:
- 64-bit architecture with
virtualization and coherent memory support, which leverages full
processing capability of 64-bit Arm® Cortex® -A72
- Integration of vision
hardware processing accelerators to facilitate extensive processing
requirements in low power budget for automotive ADAS ,
autonomous mobile robot, and edge AI applications
- Integration of multiple
general-purpose microcontroller unit (MCU) clusters with a dual Arm®
Cortex®-R5F MCU subsystem available for general purpose use as either
two separate cores operating in lockstep, intended to help customers
achieve functional safety goals for their end products
- Integration of multiple fixed and
floating-point C71x Digital Signal Processors (DSP) that
significantly boost
power over a broad range of general signal processing tasks for both
general applications and automotive functions which also incorporate advanced techniques
to improve control code efficiency and ease of programming such as
branch prediction, protected pipeline, precise exception and virtual
memory management
- Multiple tightly
coupled Matrix Multiplication Accelerators (MMA) that extend the C71x DSP
architecture's scalar and vector facilities enabling deep learning and
enhance vision, analytics and wide range of general applications. The
achieved total TOPS (Tera Operations Per Second) performance
significantly differentiates the device for single board computer in
machine vision and deep learning applications
- Multi-display support,
including flexibility to interface with different panel types (eDP, DSI,
DPI) with multi-layer hardware composition
- Integration of hardware
features that help applications to achieve functional safety
mechanisms
- Robust security
architecture with sandboxed Security Controller managing all secure
configurations with high performance client-server messaging scheme
between secure Security Controller and all cores
- Simplified solution for
power supply management, enabling lower cost system solution (on-die
bias LDOs and power good comparators for minimal power sequencing
requirements consistent with low cost supply design)
Processor cores:
- Up to Four C7x floating point, vector DSP, up to 1.0 GHz, 320 GFLOPS, 1024
GOPS
- Up to Four Deep-learning matrix multiply accelerator (MMA), up to 32 TOPS
(8b) at 1.0 GHz
- TwoVision Processing Accelerators (VPAC) with Image Signal Processor (ISP)
and multiple vision assist accelerators
- Depth and Motion Processing
Accelerators (DMPAC)
- Eight Arm®Cortex®-A72 microprocessor subsystem at up to 2.0 GHz
- 2MB shared L2 cache per quad-core Cortex®-A72 cluster
- 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core
- Eight Arm®Cortex®-R5F MCUs at up to 1.0 GHz
- 16K I-Cache, 16K D-Cache, 64K L2 TCM
- Two Arm®Cortex®-R5F MCUs in isolated MCU subsystem
- Six Arm®Cortex®-R5F MCUs in general compute
partition
- GPU IMG BXS-64-4, 256kB Cache, up to 800 MHz, 50 GFLOPS, 4 GTexels/s
- Custom-designed interconnect
fabric supporting near max processing entitlement
Memory subsystem:
- Up to 8MB of on-chip L3 RAM with ECC and coherency
- ECC error protection
- Shared coherent cache
- Supports internal DMA engine
- Up to Four External Memory Interface (EMIF) module with ECC
- Supports LPDDR4 memory types
- Supports speeds up to 4266 MT/s
- Up to 4x32-b bus with inline ECC up to 68 GB/s
Functional Safety:
- Functional Safety-Compliant targeted (on select
part numbers)
- Developed for
functional safety applications
- Documentation
available to aid ISO 26262 functional safety system design up to
ASIL-D/SIL-3 targeted
- Systematic capability
up to ASIL-D/SIL-3 targeted
- Hardware integrity up
to ASIL-D/SIL-3 targeted for MCU Domain
- Hardware integrity up
to ASIL-B/SIL-2 targeted for Main Domain
- Safety-related
certification
- AEC-Q100 qualilfied on part number variants ending in Q1
Device security (on select part
numbers):
- Secure boot with secure
runtime support
- Customer programmable root
key, up to RSA-4K or ECC-512
- Embedded hardware security
module
- Crypto hardware accelerators
– PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial
interfaces:
- Integrated ethernet switch
supporting up to 8 (TDA4xH) or 4 (TDA4xP) external ports
- Two ports support
5Gb, 10Gb USXGMII or 5Gb XFI
- All ports support
1Gb, 2.5Gb SGMII
- All ports can support
QSGMII. A maximum of 2 (TDA4xH) or 1 (TDA4xP) QSGMII can be enabled
and uses all 8 or 4 internal lanes
- Up to 4x2-L/2x4L (TDA4xH) or 2x2L/1x4L (TDA4xP) PCI-Express® (PCIe) Gen3 controllers
- Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with
auto-negotiation
- One USB 3.0 dual-role device (DRD) subsystem
- Enhanced SuperSpeed Gen1 Port
- Supports Type-C switching
- Independently configurable as USB host, USB peripheral, or USB
DRD
- Three CSI2.0 4L RX plus Two
CSI2.0 4L TX
Ethernet
- Two RGMII/RMII interfaces
Automotive interfaces:
- Twenty Modular Controller
Area Network (MCAN) modules with full CAN-FD support
Display subsystem:
- Two DSI 4L TX (up to
2.5k)
- One eDP/DP interface with
Multi-Display Support (MST)
- One DPI
Audio interfaces:
- Five Multichannel Audio
Serial Port (MCASP) modules
Video
acceleration:
- H.264/H.265 Encode/Decode, up
to 960MP/s (TDA4xH) or 480MP/s (TDA4xP)
Flash memory
interfaces:
- Embedded MultiMediaCard
Interface ( eMMC™ 5.1)
- One Secure Digital®
3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
- Universal Flash Storage (UFS 2.1)
interface with two lanes
- Two simultaneous flash
interfaces configured as
- One OSPI or HyperBus™
or QSPI flash
interfaces, and
- One QSPI flash
interface
System-on-Chip (SoC) architecture:
- 16-nm FinFET technology
- 31 mm × 31 mm, 0.8-mm pitch,
1414-pin FCBGA (ALY), enables IPC class 3 PCB routing
TPS6594-Q1 Companion Power
Management ICs (PMIC):
- Functional Safety-Compliant support up to ASIL-D
- Flexible mapping to support different use cases