产品详细信息

Protocols Bluetooth 5.2 Low Energy Features LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), Advertising extension, Channel select algorithm, Direction finding, Bluetooth mesh Type Wireless MCU RAM (KB) 88 GPIO 31 Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Debug security, Device identity, Software IP protection Sensitivity (best) (dBm) -97 Operating temperature range (C) -40 to 105 Rating Automotive
Protocols Bluetooth 5.2 Low Energy Features LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), Advertising extension, Channel select algorithm, Direction finding, Bluetooth mesh Type Wireless MCU RAM (KB) 88 GPIO 31 Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Debug security, Device identity, Software IP protection Sensitivity (best) (dBm) -97 Operating temperature range (C) -40 to 105 Rating Automotive
VQFNP (RTC) 48 49 mm² 7 x 7
  • Qualified for automotive applicationsg
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40 °C to +105 °C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • Clock speed up to 48 MHz
    • 352KB of in-system Programmable Flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air upgrade (OTA)
  • RoHS-compliant package
    • 7-mm x 7-mm VQFN48 with wettable flanks
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.1 low energy and earlier specifications
    • Excellent receiver sensitivity: –105 dBm for Bluetooth 125-kbps (LE coded PHY) –97 dBm for 1-Mbps PHY
    • Output power up to +5 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations:
      • EN 300 328 (Europe)
      • EN 300 440 Category 2 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Low power
    • Wide supply voltage range: 1.8 V to 3.63 V
    • Active mode RX: 6.9 mA
    • Active mode TX 0 dBm: 7.3 mA
    • Active mode TX 5 dBm: 9.6 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low-power mode, 2 MHz, running infinite loop: 31.9 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808.5 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Peripherals
    • 31 GPIOs, digital peripherals can be routed to any GPIO
    • 4 × 32-bit or 8 × 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-time clock (RTC)
    • AES 128-bit and 256-bit crypto accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Ultra-low power sensor controller with 4KB of SRAM
    • Operation independent from system CPU
    • Sample, store, and process sensor data
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.1 Low Energy controller in ROM for optimized application size
  • Development Tools and Software
  • Qualified for automotive applicationsg
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40 °C to +105 °C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • Clock speed up to 48 MHz
    • 352KB of in-system Programmable Flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air upgrade (OTA)
  • RoHS-compliant package
    • 7-mm x 7-mm VQFN48 with wettable flanks
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.1 low energy and earlier specifications
    • Excellent receiver sensitivity: –105 dBm for Bluetooth 125-kbps (LE coded PHY) –97 dBm for 1-Mbps PHY
    • Output power up to +5 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations:
      • EN 300 328 (Europe)
      • EN 300 440 Category 2 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Low power
    • Wide supply voltage range: 1.8 V to 3.63 V
    • Active mode RX: 6.9 mA
    • Active mode TX 0 dBm: 7.3 mA
    • Active mode TX 5 dBm: 9.6 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low-power mode, 2 MHz, running infinite loop: 31.9 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808.5 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Peripherals
    • 31 GPIOs, digital peripherals can be routed to any GPIO
    • 4 × 32-bit or 8 × 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-time clock (RTC)
    • AES 128-bit and 256-bit crypto accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Ultra-low power sensor controller with 4KB of SRAM
    • Operation independent from system CPU
    • Sample, store, and process sensor data
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.1 Low Energy controller in ROM for optimized application size
  • Development Tools and Software

The SimpleLink™ CC2642R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS) and remote keyless entry (RKE), battery management systems (BMS), car sharing, piloted parking, cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth ® 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, CSA#2, as well as backwards compatibility and support for key features from the Bluetooth ® 5 and earlier Low Energy specifications.
  • Fully-qualified Bluetooth ® 5.1 software protocol stack included with the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK), which enables Angle of Arrival (AoA).
  • Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
  • AEC-Q100 qualified at the Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards, such as real-time localization (RTLS) technologies.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125-kbps LE Coded PHY).

The CC2642R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2642R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS) and remote keyless entry (RKE), battery management systems (BMS), car sharing, piloted parking, cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth ® 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, CSA#2, as well as backwards compatibility and support for key features from the Bluetooth ® 5 and earlier Low Energy specifications.
  • Fully-qualified Bluetooth ® 5.1 software protocol stack included with the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK), which enables Angle of Arrival (AoA).
  • Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
  • AEC-Q100 qualified at the Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards, such as real-time localization (RTLS) technologies.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125-kbps LE Coded PHY).

The CC2642R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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CC2642R 正在供货 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU This product offers lower operating temperature (105 C).
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技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 CC2642R-Q1 SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 数据表 (Rev. A) 2020年 10月 26日
* 勘误表 CC2642R-Q1 SimpleLink™ Wireless MCU Device Revision E Silicon Errata 2020年 1月 30日
* 用户指南 CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference Manual (Rev. D) 2019年 9月 30日
应用手册 如何认证您的蓝牙产品 (Rev. G) 下载英文版本 (Rev.G) 2021年 9月 30日
应用手册 CC26xx 和 CC13xx 系列无线 MCU 的晶体振荡器和晶体选型 (Rev. I) 下载英文版本 (Rev.I) 2021年 9月 9日
应用手册 硬件从 CC26x0 迁移到 CC26x2R (Rev. D) 下载英文版本 (Rev.D) 2021年 9月 9日
应用手册 CC2538/CC26x0/CC26x2 串行引导加载程序接口 (Rev. D) 下载英文版本 (Rev.D) 2021年 9月 7日
应用手册 低功耗蓝牙、基本速率/增强型数据速率–方法混淆配对漏洞 下载英文版本 2021年 7月 19日
白皮书 SimpleLink™ CC13x2 and CC26x2 Software Development Kit 2021年 4月 12日
白皮书 Wired vs. Wireless Communications In EV Battery Management... 2020年 11月 4日
白皮书 电动汽车电池管理中的有线与无线通信 下载英文版本 2020年 11月 4日
应用手册 Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) 2020年 7月 17日
应用手册 CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. E) 2020年 6月 19日
应用手册 Variable Time Tag Comparison on SimpleLink™ Devices 2020年 6月 5日
技术文章 Exploring connectivity trends for Bluetooth® Low Energy in the car 2020年 2月 19日
技术文章 Three questions to ask about wireless BMS for hybrid and electric vehicles 2020年 2月 18日
应用手册 Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs 2020年 1月 28日
应用手册 Getting Started With the CC13xx and CC26xx Sensor Controller (Rev. B) 2020年 1月 27日
白皮书 Simple and efficient software development with the SimpleLink™ MCU platform (Rev. E) 2019年 12月 6日
应用手册 Running Bluetooth® Low Energy on CC2640 Without 32 kHz Crystal (Rev. C) 2019年 9月 23日
技术文章 Bluetooth®︎ Low Energy shifts gears for car access 2019年 7月 15日
应用手册 Bluetooth® Low Energy tree structure network 2019年 5月 29日
应用手册 Bluetooth® Angle of Arrival (AoA) Antenna Design 2019年 5月 6日
应用手册 Secure boot in SimpleLink™ CC13x2/CC26x2 wireless MCUs 2019年 4月 15日
应用手册 Measuring Bluetooth Low Energy Power Consumption (Rev. D) 2019年 1月 10日
应用手册 RF PCB Simulation Cookbook 2019年 1月 9日
白皮书 Migrating your proprietary solution to the SimpleLink™ WMCU 2018年 11月 7日
技术文章 An out-of-the-box Internet of Things: building a seamless and secure smart home network 2018年 6月 12日
应用手册 Software SAR ADC using the CC2642R1 sensor controller 2018年 3月 2日
应用手册 Meet the SimpleLink™ Sensor Controller 2018年 2月 27日
白皮书 Bluetooth® low energy and the automotive transformation 2017年 9月 25日
白皮书 Sensor-to-cloud applications impel a change in the ultra-low-power microcontroll 2017年 7月 19日
白皮书 RTOS Power Management Emerges as a Key for MCU-based IoT Nodes (Rev. A) 2017年 5月 11日
应用手册 Sensor sequencing using the CC2642R1 sensor controller 2017年 3月 5日
用户指南 TI-RTOS 2.16 for CC13xx/CC26xx SimpleLink Getting Started Guide (Rev. D) 2016年 6月 17日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

评估板

BOOSTXL-ULPSENSE — SimpleLink™ ULP 传感器 BoosterPack™

To get started visit dev.ti.com/BOOSTXL-ULPSENSE

The ULP Sense BoosterPack is a kit designed to make it easy to demonstrate the ultra-low power features of the sensor controller included in the CC13x2/CC26x2 RF SoCs. 

Examples of applications that will greatly benefit from this are measurement on (...)

现货
数量限制: 3
评估板

LAUNCHXL-CC26X2R1 — SimpleLink™ 多标准 CC26x2R 无线 MCU LaunchPad™ 开发套件

开始使用 LaunchPad 来进行开发:
第 1 步:购买 CC26X2R1 LaunchPad
第 2 步:下载 SimpleLink CC13x2 和 CC26x2 SDK
第 3 步:开始使用 SimpleLink Academy

重要说明:

该套件支持评估 SimpleLink 低功耗 Bluetooth® CC2642R 无线 MCUSimpleLink 多标准 CC2652R 无线 MCU

CC26x2R 器件是 SimpleLink™ 微控制器 (MCU) 平台的一部分,该平台包括 Wi-Fi®、低功耗 Bluetooth®、低于 1GHz、Thread、Zigbee®、802.15.4 (...)

评估板

LPSTK-CC1352R — SimpleLink™ multi band CC1352R wireless MCU Launchpad™ SensorTag kit

TI LaunchPad™ SensorTag 套件包含集成式环境和运动传感器、多频带无线连接功能和易于使用的软件,可用于对互联应用进行原型设计。只需一个套件,开发人员即可轻松创建互联应用,在 2.4GHz 和低于 1GHz 频率下灵活支持低功耗 Bluetooth®、蓝牙网状网络、Zigbee、Thread 以及专有协议。

这一新型产品在 TI LaunchPad 生态系统 (...)

调试探针

TMDSEMU110-ETH — XDS110 EnergyTrace™ 高动态范围 (ETHDR) 调试探针插件

德州仪器 (TI) XDS110 EnergyTrace™ 高动态范围 (ETHDR) 是 XDS110 调试探针(仿真器)的一个附件,可增加 Energy Trace 功能的动态范围。这允许在所有的 Simplelink 无线 MCU 上执行非常精确的功耗测量,同时仍使用同样众所周知的用户界面。这使得 XDS110 ETHDR 成为一种可满足所有设计人员对功耗监控的需求的解决方案。

XDS110 ETHDR (...)

现货
数量限制: 1
调试探针

TMDSEMU110-U — XDS110 JTAG 调试探针

The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all ARM and (...)

调试探针

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针(仿真器)的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器)连接到目标板,而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 PC 上运行,还需要 Code Composer Studio™ IDE 许可证。

(...)

现货
数量限制: 3
软件开发套件 (SDK)

SIMPLELINK-CC13X2-26X2-SDK — SimpleLink™ CC13x2 和 CC26x2 软件开发套件 (SDK)

SimpleLink CC13x2 和 CC26x2 软件开发套件 (SDK) 为低于 1GHz 和 2.4GHz 应用的开发提供了综合性软件包,包括支持 SimpleLink CC13x2 和 CC26x2 无线 MCU 上的低功耗 Bluetooth®、Zigbee®、Thread、基于 802.15.4 的专有解决方案和多协议解决方案。

开始使用

第 1 步:购买 LaunchPad
第 2 步:下载 CC13x2 和 CC26x2 SDK
第 3 步:开始使用 SimpleLink Academy


SimpleLink CC13X2 和 26X2 SDK

 

IDE、配置、编译器或调试器

ARM-CGT — Arm® 代码生成工具 - 编译器

TI Arm® 代码生成工具支持开发适用于 TI Arm 平台的应用,尤其是采用 TI Arm Cortex-M 和 Cortex-R 系列器件的应用。目前有两个 TI Arm® C/C++ 编译器工具链,它们均可用于编译和链接 C/C++ 和汇编源文件,以构建可在 Arm® Cortex-M 和 Cortex-R 系列器件上加载和运行的静态可执行应用程序。将根据器件系列推荐特定的编译器工具链。请参阅器件的 SDK 或软件包,以获取有关使用哪个工具链的信息。
  • 全新的 TI Arm® Clang 编译器工具 (ARM-CGT-CLANG-X) 是从开源的 clang 编译器及其支持的 LLVM 基础架构衍生出来的。今后所有新功能的开发都将在 TI Arm® Clang 编译器工具中完成。
  • 必要时将继续维护 TI Arm® C/C++ 编译器工具 (ARM-CGT-XX)。但是,旧版 TI Arm® C/C++ 编译器工具的 v20.2.x.LTS 维护版本中将仅提供漏洞修复。
Code Composer Studio 是适用于 TI 嵌入式器件的集成开发环境 (...)
IDE、配置、编译器或调试器

CCSTUDIO-WCS — 适用于无线连接的 Code Composer Studio (CCS) 集成开发环境 (IDE)

Download the latest version of Code Composer Studio

Code Composer Studio™ - Integrated Development Environment for SimpleLink™ Wireless Connectivity Solutions

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to (...)

IDE、配置、编译器或调试器

SENSOR-CONTROLLER-STUDIO — TBD SENSOR CONTROLLER STUDIO

Sensor Controller Studio 用于编写、测试和调试 CC26xx/CC13xx 传感器控制器的代码,以便设计超低功耗应用。

该工具生成传感器控制器接口驱动程序,这是一组编译到系统 CPU (ARM Cortex-M3/M4) 应用的 C 源文件。这些源文件包含传感器控制器固件映像和关联的定义以及允许系统 CPU 应用控制传感器控制器并交换数据的通用函数。

传感器控制器是小型的 CPU 内核,针对低功耗和高效外设运行进行了高度优化。传感器控制器位于 CC26xx/CC13xx 辅助 (AUX) 电源/时钟域中,可以独立于系统 CPU 和 MCU 域电源状态自主执行简单的后台任务。此类任务包括但不限于:

  • 使用 ADC 或比较器进行模拟传感器轮询
  • 使用 SPI、I2C 或其他协议进行数字传感器轮询
  • 使用电流源、比较器和时数转换 (TDC) 进行电容式感应

传感器控制器是可由用户使用语法与 C 类似的简单编程语言进行编程。这就允许将传感器轮询和其他任务指定为顺序算法,而不是复杂外设模块、计时器、DMA、寄存器可编程状态机甚至路由等的静态配置。主要优点为:

  • 灵活性
  • 动态重复使用硬件资源
  • 无需专用硬件即可执行简单数据处理
  • 可观察性和调试选项

资源

插件

SIMPLELINK-SDK-PLUGIN-FOR-HOMEKIT — 适用于 HomeKit 的 SimpleLink™ 软件开发套件 (SDK) 插件

借助这组包括用户指南、集成指南和驱动程序的 SimpleLink™ SDK 插件,MFi 获许可人员能使用 SimpleLink Wi-Fi® CC32XX SDKSimpleLink CC13x2-CC26x2 SDK 以及分别通过 Apple MFi 认证的器件开发 Apple HomeKit 应用。
软件编程工具

FLASH-PROGRAMMER — SmartRF 闪存编程器

SmartRF 闪存编程器 2 可用于通过调试和串行接口对德州仪器 (TI) 基于 ARM 的低功耗射频无线 MCU 中的闪存进行编程。

SmartRF 闪存编程器 可用于对德州仪器 (TI) 基于 8051 的低功耗射频无线 MCU 中的闪存进行编程,还可用于升级 SmartRF05 评估板、SmartRF 收发器评估板 (TrxEB) 和 CC 调试器上的固件和引导加载程序。

SmartRF 闪存编程器和 SmartRF 闪存编程器 2 都包含图形用户界面和命令行界面。

软件编程工具

UNIFLASH — UniFlash stand-alone flash tool for microcontrollers, Sitara™ processors and SimpleLink™ family

支持的器件:CC13xx、CC25xx、CC26xx、CC3x20、CC3x30、CC3x35、Tiva、C2000、MSP43x、Hercules、PGA9xx、IWR12xx、IWR14xx、IWR16xx、IWR18xx、IWR68xx、AWR12xx、AWR14xx、AWR16xx、AWR18xx。  仅限命令行:AM335x、AM437x、AM571x、AM572x、AM574x、AM65XX、K2G

CCS Uniflash 是一个独立工具,用于编程 TI MCU 的片上闪存内存和 Sitara 处理器的板载闪存内存。Uniflash 具有 GUI、命令行和脚本接口。CCS Uniflash 免费提供。

计算工具

3P-WIRELESS-MODULES — Third party wireless module search tool

Engineers looking to incorporate wireless connectivity technology into their IoT design can use the third party wireless module search tool to identify products that meet their end equipment specifications, procure production ready wireless modules, and help accelerate their development and time to (...)
计算工具

BT-POWER-CALC — 蓝牙功耗计算工具

该工具用于计算 TI 蓝牙器件各种用例的低功耗蓝牙功耗估计值。该计算器包括广播和外设用例,可为不同用例的配置文件配置参数。计算器输出预期电池寿命的估算值。
计算工具

RF-RANGE-ESTIMATOR — TI 射频范围评估器

该工具用于完成使用 TI 无线器件的室内和室外射频链路的距离估算。室外计算基于视线 (LOS)。对于室内估算,可以选择介于 Tx 和 Rx 单元之间的建筑材料。Tx 和 Rx 单元之间复合材料的衰减越大,距离就越短。
计算工具

SMARTRFTM-STUDIO — SmartRF Studio Download

SmartRF™ Studio 是一种 Windows 应用,可用于评估和配置德州仪器 (TI (...)
光绘文件

LAUNCHXL-CC26x2R1 Design Files (Rev. A)

SWRC346A.ZIP (7301 KB)
光绘文件

CC26x2REM-7ID design files

SWRC359.ZIP (1235 KB)
光绘文件

CC26x2REM-7ID-Q1 Design Files

SWRC366.ZIP (1176 KB)
参考设计

TIDA-020032 — Car access Bluetooth® low energy + CAN satellite module reference design

此卫星模块参考设计适用于低功耗 Bluetooth® 无钥匙进入及启动 (PEPS) 和手机即钥匙/数字钥匙汽车门禁系统。该设计说明了如何利用我们的蓝牙无线 MCU,为需要更高带宽车载网络通信的系统实现控制局域网灵活数据速率 (CAN-FD) 通信功能。其他优势包括:降低睡眠状态的功耗,CAN 自动寻址技术可简化制造,连接监视器功能可提高蓝牙定位精度,而且紧凑的印刷电路板 (PCB) 能测量蓝牙到达角 (AoA) 和接收信号强度指数 (RSSI)。
封装 引脚 下载
VQFN (RTC) 48 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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支持与培训

视频