产品详细信息

CPU C28x Frequency (MHz) 150 Flash memory (KB) 512 RAM (KB) 68 ADC resolution 12-bit Total processing (MIPS) 150 Features FPU32 UART 3 CAN (#) 2 PWM (Ch) 12
CPU C28x Frequency (MHz) 150 Flash memory (KB) 512 RAM (KB) 68 ADC resolution 12-bit Total processing (MIPS) 150 Features FPU32 UART 3 CAN (#) 2 PWM (Ch) 12
CPGA (GB) 181 HLQFP (PTP) 176 576 mm² 24 x 24
  • High-Performance Static CMOS Technology
    • Up to 150 MHz for TC = –55°C to 125°C
      and Up to 100 MHZ for TC = 210°C
    • 1.9-V Core, 3.3-V I/O Design
  • High-Performance 32-Bit CPU
    • IEEE-754 Single-Precision Floating-Point Unit (FPU))
    • 16 × 16 and 32 × 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • Six Channel DMA Controller (for ADC, McBSP,
    ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • Over 2M × 16 Address Reach
  • On-Chip Memory
    • 256K × 16 Flash, 34K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN,
      I2C, McBSP, XINTF, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • GPIO0 to GPIO63 Pins Can Be Connected to One
    of the Eight External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block
    That Supports All 58 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/RAM Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 18 PWM Outputs
    • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
    • Up to 6 Event Capture Inputs
    • Up to 2 Quadrature Encoder Interfaces
    • Up to 8 32-bit/Nine 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • One SPI Module
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 80-ns Conversion Rate
    • 2 × 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Internal or External Reference
  • Up to 88 Individually Programmable, Multiplexed
    GPIO Pins With Input Filtering
  • JTAG Boundary Scan Support IEEE Standard 1149.1-1990
    Standard Test Access Port and Boundary Scan Architecture
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Support Includes
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio IDE
    • DSP/BIOS
    • Digital Motor Control and Digital Power
      Software Libraries
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Option
    • Ceramic Pin Grid Array (GB)
    • HLQFP (PTP)
  • Temperature Range:
    • GB Package: –55°C to 210°C (GB)
    • PTP Package: –55°C to 150°C (PTP)
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extreme (–55°C/210°C)
      Temperature Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
    • Texas Instruments high temperature products utilize
      highly optimized silicon (die) solutions with design
      and process enhancements to maximize performance over
      extended temperatures.

(1) Custom temperature ranges available

  • High-Performance Static CMOS Technology
    • Up to 150 MHz for TC = –55°C to 125°C
      and Up to 100 MHZ for TC = 210°C
    • 1.9-V Core, 3.3-V I/O Design
  • High-Performance 32-Bit CPU
    • IEEE-754 Single-Precision Floating-Point Unit (FPU))
    • 16 × 16 and 32 × 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • Six Channel DMA Controller (for ADC, McBSP,
    ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • Over 2M × 16 Address Reach
  • On-Chip Memory
    • 256K × 16 Flash, 34K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN,
      I2C, McBSP, XINTF, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • GPIO0 to GPIO63 Pins Can Be Connected to One
    of the Eight External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block
    That Supports All 58 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/RAM Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 18 PWM Outputs
    • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
    • Up to 6 Event Capture Inputs
    • Up to 2 Quadrature Encoder Interfaces
    • Up to 8 32-bit/Nine 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • One SPI Module
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 80-ns Conversion Rate
    • 2 × 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Internal or External Reference
  • Up to 88 Individually Programmable, Multiplexed
    GPIO Pins With Input Filtering
  • JTAG Boundary Scan Support IEEE Standard 1149.1-1990
    Standard Test Access Port and Boundary Scan Architecture
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Support Includes
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio IDE
    • DSP/BIOS
    • Digital Motor Control and Digital Power
      Software Libraries
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Option
    • Ceramic Pin Grid Array (GB)
    • HLQFP (PTP)
  • Temperature Range:
    • GB Package: –55°C to 210°C (GB)
    • PTP Package: –55°C to 150°C (PTP)
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extreme (–55°C/210°C)
      Temperature Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
    • Texas Instruments high temperature products utilize
      highly optimized silicon (die) solutions with design
      and process enhancements to maximize performance over
      extended temperatures.

(1) Custom temperature ranges available

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335.

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335.

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技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 Digital Signal Controller (DSC) . 数据表 (Rev. E) 2014年 1月 31日
* 勘误表 TMS320F2833x, TMS320F2823x DSCs Silicon Errata (Rev. M) 2020年 9月 28日
* 辐射与可靠性报告 SM320F28335GBS Reliability Report 2012年 9月 12日
应用手册 Serial Flash Programming of C2000 Microcontrollers (Rev. D) 2020年 10月 27日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

评估板

TMDSPREX28335 — C2000 外设开发者套件

TMDSPREX28335 是一款基于 DIMM100 controlCARD 的评估和开发工具,适用于 C2000™ F2833x MCU 系列。此外设学习套件对诸如扩展坞 (TMDSDOCK28335) 的试验电路板进行了扩展,可更好地访问关键外设。

MathWorks MATLAB & Simulink 示例模型包括以下内容:

 

 

   

现货
数量限制: 1
调试探针

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针(仿真器)的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器)连接到目标板,而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 PC 上运行,还需要 Code Composer Studio™ IDE 许可证。

(...)

现货
数量限制: 3
调试探针

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)

现货
数量限制: 1
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)

现货
数量限制: 1
硬件编程工具

C2000-GANG — 多器件 C2000 编程器

C2000 Gang 编程器是一个 C2000 器件编程器,可以同时对多达八个完全相同的 C2000 器件进行编程。C2000 Gang 编程器可使用标准的 RS-232 或 USB 连接与主机 PC 相连,并提供灵活的编程选项,允许用户完全自定义流程。

C2000 Gang 编程器配有扩展板,即“群组分离器”,可在 C2000 Gang 编程器和多个目标器件间实施互连。还提供 8 条电缆,可扩展接口与 8 个目标器件相连(通过 JTAG 或 Spy-Bi-Wire 连接器)。编程可借助 PC 或作为独立设备实现。还提供基于 DLL 的 PC 端图形用户界面。

特色软件文件

驱动程序或库

SFRA — 软件频率响应分析器 (SFRA)

TI 的软件频率响应分析器 (SFRA) 通过在 C2000™ 实时微控制器上实现控制回路,使开发人员能够快速测量数字功率转换器的频率响应。用户可在基于 PC 的 GUI 上查看电厂和功率转换器的开环频率响应。所有的频率响应数据都被导出到 Excel 电子表格中,然后用于设计补偿回路。 
IDE、配置、编译器或调试器

CCSTUDIO-C2000 — 适用于 C2000 MCU 的 Code Composer Studio (CCS) 集成开发环境 (IDE)

Download the latest version of Code Composer Studio

Code Composer Studio™ - Integrated Development Environment for C2000 32-bit Real-time Control MCUs

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop (...)

软件编程工具

UNIFLASH — UniFlash stand-alone flash tool for microcontrollers, Sitara™ processors and SimpleLink™ family

支持的器件:CC13xx、CC25xx、CC26xx、CC3x20、CC3x30、CC3x35、Tiva、C2000、MSP43x、Hercules、PGA9xx、IWR12xx、IWR14xx、IWR16xx、IWR18xx、IWR68xx、AWR12xx、AWR14xx、AWR16xx、AWR18xx。  仅限命令行:AM335x、AM437x、AM571x、AM572x、AM574x、AM65XX、K2G

CCS Uniflash 是一个独立工具,用于编程 TI MCU 的片上闪存内存和 Sitara 处理器的板载闪存内存。Uniflash 具有 GUI、命令行和脚本接口。CCS Uniflash 免费提供。

支持软件

MATHW-3P-SLEC — MathWorks Simulink and Embedded Coder

Embedded Coder Hardware Support Package for TI C2000™: Save design time and get into production faster with C2000 MCU’s using MathWorks software tools.

MATLAB Coder™, Simulink Coder™, and Embedded Coder® generate ANSI/ISO C/C++ code that can be compiled and executed on Texas (...)

由 MathWorks, Inc. 提供
设计工具

C2000-3P-SEARCH — 3P search tool

TI 与多家公司携手推出适用于 TI C2000 器件的各种解决方案和服务。这些公司可使用 C2000 器件加速您的量产流程。下载此搜索工具,快速浏览第三方详细信息,并寻找合适的第三方来满足您的需求。

该工具分为两大类 - 应用及闪存编程解决方案和服务。

“应用”类:

  1. 培训/研讨会
  2. 建模工具
  3. 电机控制
  4. 数字电源
  5. 软件栈
  6. 功能安全
  7. 信息安全
  8. 硬件服务
  9. 软件服务
封装 引脚 下载
(KGD) 0 了解详情
CPGA (GB) 181 了解详情
HLQFP (PTP) 176 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

推荐产品的参数、评估模块或参考设计可能与此 TI 产品相关

支持与培训

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