DRA78x 处理器采用 367 焊球、15mm×15mm、0.65mm 焊球间距(0.8mm 间距规则可用于信号)(通过 Channel™ 阵列 (VCA) 技术实现)、球栅阵列 (FCBGA) 封装。
此架构旨在昨用经济高效的解决方案,为汽车协处理、混合无线电和放大器应用提供高性能并发性 , 实现 DRA75x(“Jacinto 6 EP”和“Jacinto 6 Ex”)、DRA74x“Jacinto 6”、DRA72x“Jacinto 6 Eco”和 DRA71x“Jacinto 6 Entry”信息娱乐处理器系列的全面可扩展性。
此外,德州仪器 (TI) 提供一整套针对 Arm 和 DSP 的开发工具,其中包括 C 语言编译器和一个实现源代码执行可视化的调试接口。
DRA78x Jacinto 6 RSP(无线电音频处理器)系列器件符合 AEC-Q100 标准。
该器件 采用 简化的电源轨映射,这使得低成本电源管理集成电路 (PMIC) 解决方案得以实现。
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (S-PBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors, including voice, HMI, multimedia and smartphone projection mode capabilities.
Additionally, TI provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
DRA78x 处理器采用 367 焊球、15mm×15mm、0.65mm 焊球间距(0.8mm 间距规则可用于信号)(通过 Channel™ 阵列 (VCA) 技术实现)、球栅阵列 (FCBGA) 封装。
此架构旨在昨用经济高效的解决方案,为汽车协处理、混合无线电和放大器应用提供高性能并发性 , 实现 DRA75x(“Jacinto 6 EP”和“Jacinto 6 Ex”)、DRA74x“Jacinto 6”、DRA72x“Jacinto 6 Eco”和 DRA71x“Jacinto 6 Entry”信息娱乐处理器系列的全面可扩展性。
此外,德州仪器 (TI) 提供一整套针对 Arm 和 DSP 的开发工具,其中包括 C 语言编译器和一个实现源代码执行可视化的调试接口。
DRA78x Jacinto 6 RSP(无线电音频处理器)系列器件符合 AEC-Q100 标准。
该器件 采用 简化的电源轨映射,这使得低成本电源管理集成电路 (PMIC) 解决方案得以实现。
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (S-PBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors, including voice, HMI, multimedia and smartphone projection mode capabilities.
Additionally, TI provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.