选择版本

选择版本

未找到结果。请清除搜索,并重试。

SIMPLELINK-LOWPOWER-F2-SDK

SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

选择版本
未找到结果。请清除搜索,并重试。
最新版本
版本: 7.10.01.24
发布日期: 22 六月 2023

Windows Installer for SimpleLink CC13XX CC26XX SDK

MD5 校验和

Linux Installer for SimpleLink CC13XX CC26XX SDK

MD5 校验和

Mac OS Installer for SimpleLink CC13XX CC26XX SDK

MD5 校验和

Windows Zipfile for SimpleLink CC13XX CC26XX SDK

MD5 校验和

Linux Zipfile for SimpleLink CC13XX CC26XX SDK

MD5 校验和

Mac OS Zipfile for SimpleLink CC13XX CC26XX SDK

MD5 校验和
产品
蓝牙产品
CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2642R-Q1 符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2652RB 具有无晶振 BAW 谐振器的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU
低于 1GHz 产品
CC1311P3 具有 352KB 闪存和集成 +20dBm PA 的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1311R3 具有 352kB 闪存的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1312R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 无线 MCU CC1314R10 具有 1MB 闪存和高达 296kB SRAM 的 SimpleLink™ Arm® Cortex®-M33 Sub-1GHz 无线 MCU
Wi-SUN 产品
CC1312R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU
多协议产品
CC1352P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU CC1352P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 和 2.4GHz 无线 MCU CC1352R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU CC2651P3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2651R3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2652P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU、704kB 闪存 CC2652PSIP 具有集成式功率放大器的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU CC2652RSIP 具有 352KB 内存的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2651R3SIPA 具有集成天线的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2674R10 具有 1MB 闪存的 SimpleLink™ Arm® Cortex®-M33 多协议 2.4GHz 无线 MCU CC2674P10 具有 1MB 闪存和功率放大器的 SimpleLink™ Arm® Cortex®-M33 多协议 2.4GHz 无线 MCU
硬件开发
LAUNCHXL-CC1312R1 CC1312R LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352P CC1352P LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC1352R1 CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC26X2R1 CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LP-CC1312R7 CC1312R7 LaunchPad™ development kit for SimpleLink™ multi-standard wireless MCU LP-CC1352P7 CC1352P7 LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LP-CC2652PSIP CC2562PSIP SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件 LP-CC2652R7 CC2652R7 LaunchPad™ development kit for SimpleLink™ multi-standard wireless MCU LP-CC2652RB CC2652RB LaunchPad™ development kit for BAW multi-protocol 2.4-GHz SimpleLink™ wireless MCU LP-CC2652RSIP CC2652RSIP LaunchPad™ development kit for SimpleLink™ multi-protocol wireless MCU LPSTK-CC1352R SimplElink™ 多频带 CC1352R 无线 MCU LaunchPad™ SensorTag 套件
评估板
LP-CC2651R3SIPA CC2651R3SIPA SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件
开发套件
LP-EM-CC1314R10 CC1314R10 SimpleLink™ Sub-1GHz 无线 MCU LaunchPad™ 开发套件

发布信息

The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

Features:

  • Supports proprietary  Sub-1 GHz and 2.4 GHz applications using basic RX and TX examples
  • TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz and 2.4 GHz bands
  • Certified Wi-SUN® FAN 1.0 compliant Sub-1 GHz mesh stack (learn more at TI.com/wisun or download the Wi-SUN software brief)
  • Bluetooth® Low Energy (BLE) software protocol stack supporting Bluetooth 5.2 and Bluetooth mesh (learn more at TI.com/ble)
  • Matter 1.0 and Thread 1.3 networking protocol based on open-source Matter project and Openthread (learn more at TI.com/matter)
  • Zigbee software protocol stack (Z-stack - learn more at TI.com/Zigbee)
  • Supports concurrent operation of BLE + Sub-1 GHz (TI 15.4-Stack or proprietary Sub-1 GHz) and BLE + Zigbee using the Dynamic Multi-Protocol
  • Supports Amazon Sidewalk Sub-1 GHz FSK and Bluetooth Low Energy

最新动态

  • Added device support and characterized settings for CC2674R10 and CC2674P10
  • Updated CC2642R-Q1 device PA tables to correct TX output power setting