无线微控制器
低功耗
无线协议支持
高性能无线电
法规遵从性
MCU 外设
信息安全机制
开发工具和软件
工作温度范围
符合 RoHS 标准的封装
CC2340R SimpleLink™ 系列器件为 2.4GHz 无线微控制器 (MCU)，面向低功耗 Bluetooth®5.3、Zigbee、Thread 和专有 2.4GHz 应用。这些器件针对低功耗无线通信进行了优化，并支持无线下载 (OAD) 功能，适用于楼宇自动化（无线传感器、照明控制、信标）、资产跟踪、医疗、零售 EPOS（电子销售终端）、ESL（电子货架标签）和个人电子产品（玩具、HID、触控笔）市场。该器件的突出特性包括：
CC2340R 系列器件是 SimpleLink™ MCU 平台的一部分，该平台包括 Wi-Fi、低功耗蓝牙、Thread、Zigbee、Sub-1GHz MCU 和主机 MCU，它们共用一个通用、易于使用的开发环境，其中包含单核软件开发套件 (SDK) 和丰富的工具集。借助一次性集成的 SimpleLink™ 平台，可以将产品组合中的任何器件组合添加至您的设计中，从而在设计要求变更时实现 100% 的代码重用。有关更多信息，请访问 SimpleLink™ MCU 平台。
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
该 LaunchPad 开发套件可借助支持低功耗 (LE) 蓝牙 5 和 2.4GHz 专有协议的 SimpleLink 低功耗蓝牙 MCU 加快开发速度。SimpleLink 低功耗 F3 软件开发套件 (SDK) 提供软件支持。
LP-XDS110ET LaunchPad 开发套件调试器工具可用于对德州仪器 (TI) 微控制器、微处理器和 DSP XDS 兼容器件进行编程和调试。LP-XDS110ET 可通过 20 引脚边缘连接器直接连接到分离式 Launchpad 开发套件，也可用于调试其他使用 XDS110 OUT 连接器的 LaunchPad 开发套件和 XDS 兼容器件。LP-XDS110ET 添加了用于功率测量的电路，用于支持 EnergyTrace™ 软件。
DL-CC2340-A 和 DL-CC2340-B 低功耗蓝牙模块均基于 TI SimpleLink CC2340R5 低功耗蓝牙器件而设计，采用 48MHz Cortex-M0+ 内核，集成高达 512KB 闪存、36KB SRAM，并具有多达 26 个通用 I/O 接口。此外，这些低功耗蓝牙模块还配备了内置 48MHz 10ppm 外部高速时钟和 32.768kHz 外部低速时钟。
DL-CC2340-A 低功耗蓝牙模块可以对 CC2340R5 芯片的所有 I/O 端口使用各种通用外设，包括 UART、SPI、I2C、计时器、温度传感器、电池电压检测、内置模拟比较器和 12 位 ADC (...)
Beijing Jia An Electronics Technology Co., Ltd. 的 Cansec Wireless 品牌无线和物联网 (IoT) 模块。AN2340SA-B 模块是基于 CC2340 SimpleLink™ 32 位 Arm® Cortex®-M0+ 低功耗 Bluetooth® 无线微控制器 (MCU) 的 2.4GHz 低功耗 Bluetooth® 5.3 小尺寸物联网软件和硬件解决方案。该器件针对低功耗无线通信进行了优化，支持片上双映像无线下载 (OAD)。AN1352P7-915PUA-2.4SA 是一款基于 (...)
BDE-3P-LE2340 modules are Bluetooth® 5.3 Low Energy wireless modules based on the CC2340R. With their low cost and exceptional RF and power consumption performance, these modules are ideal for applications that are cost-sensitive and require extended battery life. Multiple variants are available to (...)
TTC 多年来一直专注于无线通信技术及应用、专注于产品协议栈的应用，如 BLE、WiFi、NFC、Zigbee、Thread、系统兼容性、多器件互连、全面的角色应用以及复杂的定位算法。
HY-234014P 是一款基于 TI CC2340 的 SimpleLink 2.4GHz Beacon 产品，支持低功耗 Bluetooth®5.3。它集成了高性能 ARM Cortex-M0+ 处理器，具有 512KB 闪存、36KB 超低泄漏 SRAM 和板载工业级 48MHz 晶体振荡器。
此 Beacon 器件可用于资产跟踪、库存管理和工人安全监控。
Tuya BDU is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (CC2340R5), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and rich library functions.
BDU consists of a low-power 32-bit MCU, a (...)
德州仪器 (TI) 的 XDS110 是一款适用于 TI 嵌入式处理器的新型调试探针（仿真器）。XDS110 取代了 XDS100 系列，同时在单个仓体中支持更广泛的标准（IEEE1149.1、IEEE1149.7、SWD）。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 Arm® 和 DSP 处理器，所有 XDS 调试探针均支持核心和系统跟踪。 对于引脚上的内核跟踪，则需要使用 XDS560v2 PRO TRACE。
德州仪器 (TI) 的 XDS110 通过 TI 20 引脚连接器（带有适合 TI 14 引脚、Arm 10 引脚和 Arm 20 引脚的多个适配器）连接到目标板，通过 (...)
LP-XDS110 LaunchPad 开发套件调试器工具可用于对德州仪器 (TI) 微控制器、微处理器和 DSP XDS 兼容器件进行编程和调试。LP-XDS110 可通过 20 引脚边缘连接器直接连接到分离式 Launchpad，也可用于调试其他使用 XDS110 OUT 连接器的 LaunchPad 和 XDS 兼容器件。
十多年来，RF-star 作为 TI 无线连接模块的 3P IDH，致力于提供基于 TI 产品的各种无线模块和解决方案，例如 BLE、Matter、ZigBee、Thread、Wi-Fi、Sub-1GHz 和 Wi-SUN。
RF-BM-2340Xx 系列无线模块均基于 CC2340R5 SimpleLink 无线 MCU。
RF-BM-2340B1（PCB 天线）和 RF-BM-2340B1I（IPEX 版本）彼此 P2P 兼容。提供的 24 个 GPIO 可实现快速开发，还能作为医疗、汽车、新能源、工业等领域 I2C、SPI 和 UART 外设应用的 MCU 模块。
(...)
HY-23400XP 集成了低功耗蓝牙应用所需的所有功能，是一款专用于低功耗智能器件和物联网应用的高度集成式蓝牙 5.3 模块。
此外，HY-234001P 为低功耗产品应用提供了 10 个可编程 GPIO，并提供了多种 PCB 天线。
HY-23400XP 提供面向客户应用的所有低功耗蓝牙功能：无线电、堆栈、配置文件和应用空间。该模块还提供用于连接传感器的灵活硬件接口。
HY-23400XP 可由标准 3V 纽扣电池或一对 AAA 电池直接供电。在超低功耗关断模式下，该模块仅消耗 0.15µA 电流，并且在几微秒内即可唤醒。
HY-234001P 的传输距离大于等于 80 (...)
HY-52PX01 PC 是基于 SimpleLink™ CC2652P 进行开发的。它是一款多协议 2.4GHz 无线微控制器 (MCU)，支持以下协议：Thread、Zigbee®、低功耗 Bluetooth® 5.2、IEEE 802.15.4、支持 IPv6 (6LoWPAN) 的智能对象、专有系统（包括 2.4GHz 的 TI 15.4-Stack）和通过动态多协议管理器 (DMM) 驱动程序实现的并发多协议。该器件经过优化，可在楼宇安防系统、HVAC、医疗、有线网络、便携式电子产品、家庭影院和娱乐以及联网外设市场中实现低功耗无线通信和高级检测。
The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)
The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)
The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)
The SimpleLink Connect mobile app is an example Bluetooth® Low Energy application for mobile devices that works with:
The app provides a baseline for users to quickly build their (...)
当前工具 (ARM-CGT-CLANG) 从开源 Clang 编译器及其支持的 LLVM 基础架构衍生而来。旧版专有 (ARM-CGT) 工具处于维护状态，将根据需要收到错误修复。请参阅所使用的软件开发套件 (SDK) 的文档，以确认支持哪些编译器。通常，基于 Clang 的编译器用于新产品。
Code Composer Studio™ 是适用于 TI 嵌入式器件的集成开发环境 (IDE)。开始开发时，建议先下载 Code (...)
Code Composer Studio 提供直观的用户界面，可指导用户完成应用开发的每个步骤。它包含了用于优化的 C/C++ 编译器、源代码编辑器、工程编译环境、调试器、分析工具以及多种其他功能。熟悉的工具和界面让您能够轻松简单地开始开发。
Code Composer Studio 将 Eclipse® Theia (...)
UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.
UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)
SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)
SmartRF Studio 支持以下 TI 器件：
SmartRF Studio 8
SmartRF Studio 7
The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)
申请审查 2.4GHz 硬件设计前，应在我们的 E2E 论坛上提交一般设计问题。
请确保您已准备好所需的文档，随硬件设计审查申请表一起发送：
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| VQFN (RGE) | 24 | Ultra Librarian |
| VQFN (RKP) | 40 | Ultra Librarian |
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。
Compressed source file archive
Compressed source file archive
SmartRF Studio 8 is an application tool that allows users to configure, test and evaluate Simplelink RF devices from Texas Instruments. The application helps RF designers to easily evaluate the radio at an early stage in the design process. SmartRF Studio can be used either as a standalone application or together with supported evaluation boards or debug probes for the RF device.
Apple App Store
Google App Store
The SimpleLink Connect Mobile app is an example Bluetooth® Low Energy application for mobile devices that works with:
The app provides a baseline for users to quickly build their own mobile apps, using iOS or Android. Source code is provided enabling easy customization.
Features:
SimpleLink Zephyr Release
Texas Instruments Zephyr GitHub repository is the downstream fork Zephyr and is the starting point for developers wanting to start developing Zephyr applications. The SimpleLink™ downstream Zephyr releases are intended as an additional demo platform and eventually where the production grade TI SimpleLink™ Zephyr SDKs will be hosted. The team is also working on upstreaming this content to mainline Zephyr.
UniFlash is a standalone tool used to program on-chip and external flash memory on TI MCUs and on-board flash memory for Sitara processors. UniFlash has a GUI, command line, and scripting interface. UniFlash is available free of charge.
This release adds the Power Estimator for CC23xx devices
Initial release of CC23xx academy
None
The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:
All of the above are provided in one easy-to-use software package along with example applications and documentation.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.
This is version 9.10.00.83 of the SimpleLink Low Power F3 SDK.
Supported Features and Limitations
CC23xx
CC27xx
LAES & HSM Limitations
The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.
For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle or will return a NULL handle (AESGCM, ECC, RNG Drivers). If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.
For drivers that support running operations on both hardware accelerators, for primarily AES drivers, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding of each key, part of the input parameters to drivers’ APIs, holes the value of the engine-of-choice.
NOTE:
Hardware Design Review Request Form for SimpleLink 2.4GHz Devices
Link to LP-EM-CC2340R5 Reference-Only CE & FCC Certification Reports
This page provides access to the CC23XX certiification reports for teh CC23XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.