LP-CC2651R3SIPA
CC2651R3SIPA SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件
LP-CC2651R3SIPA
概述
此 LaunchPad™ 开发套件用于加快 SimpleLink™ 多标准 CC2651R3SIPA 无线系统级封装模块的开发，该模块具有集成天线 MCU，支持低功耗 (LE) Bluetooth® 5 和基于 IEEE 802.15.4 的协议，包括 ZigBee® 和 Tl 15.4 应用。CC13XX-CC26XX 软件开发套件 (SDK) 提供软件支持。
特性
- 通过 BoosterPack™ 插件模块连接器访问所有 I/O 信号
- 通过智能手机上的低功耗 Bluetooth® 将 LaunchPad™ 开发套件连接到云
- 通过 SimpleLink Starter 应用程序实现 LaunchPad 开发套件固件无线升级
- Micro USB 电缆
- 快速入门指南
多协议产品
立即订购并开发
LP-CC2651R3SIPA — CC2651R3SIPA LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module
SIMPLELINK-CC13XX-CC26XX-SDK — SimpleLink™ CC13xx and CC26xx software development kit (SDK)
CC26XX-REPORTS — CC26xx 监管认证报告
产品
蓝牙产品
多协议产品
硬件开发
评估板
文档
Link to FCC, ISED, CE, & Japan Certification Reports
Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports
发布信息
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
最新信息
- Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
- Updated CC2652RSIPMOT CE with missing safety report
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13xx and CC26xx devices
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13xx and CC26xx devices
产品
蓝牙产品
低于 1GHz 产品
Wi-SUN 产品
多协议产品
硬件开发
评估板
发布信息
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
Features:
- Supports proprietary Sub-1 GHz and 2.4 GHz applications using basic RX and TX examples
- TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz and 2.4 GHz bands
- Certified Wi-SUN® FAN 1.0 compliant Sub-1 GHz mesh stack (learn more at TI.com/wisun or download the Wi-SUN software brief)
- Bluetooth® Low Energy (BLE) software protocol stack supporting Bluetooth 5.2 and Bluetooth mesh (learn more at TI.com/ble)
- Matter 1.0 and Thread 1.3 networking protocol based on open-source Matter project and Openthread (learn more at TI.com/matter)
- Zigbee software protocol stack (Z-stack - learn more at TI.com/Zigbee)
- Supports concurrent operation of BLE + Sub-1 GHz (TI 15.4-Stack or proprietary Sub-1 GHz) and BLE + Zigbee using the Dynamic Multi-Protocol
- Supports Amazon Sidewalk Sub-1 GHz FSK and Bluetooth Low Energy
最新信息
- Full support for CC13x4 devices.
- TI's 15.4 & RF-Proprietary stacks now support the use of secure key storage and cryptographic services provided by TF-M Trusted Execution Environment for CC13x4 devices.
- MCUBoot support added for CC13x4/CC26x4 & CC13x2x7/CC26x2x7 devices.
- Zigbee PHY/MAC (Certified Version: TI 15.4 Core Stack 6.10) completed on CC13x4/CC26x4 devices.
- BLE5 Stack certification (Bluetooth Core Specification 5.3) completed on CC13x4/CC26x4 devices.
- Amazon Sidewalk Software Component support on CC1352R7 & CC2652R7 devices.
- Wi-SUN Over the Air Download (OAD) support.
- Optimized RF settings added for CC1312PSIP.
设计文件
技术文档
| 类型 | 标题 | 下载最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 证书 | LP-CC2651R3SIPA UK DoC | 2022年 7月 11日 | ||||
| 证书 | LP-CC2651R3SIPA CE DoC | 2022年 7月 11日 | ||||
| 更多文献资料 | LP-CC2651R3SIPA Quick Start Guide | 2021年 11月 9日 | ||||
| 证书 | LP-CC2651R3SIPA DoC | 2021年 11月 9日 |