LP-CC2651R3SIPA
CC2651R3SIPA SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件
LP-CC2651R3SIPA
概述
此 LaunchPad™ 开发套件用于加快 SimpleLink™ 多标准 CC2651R3SIPA 无线系统级封装模块的开发，该模块具有集成天线 MCU，支持低功耗 (LE) Bluetooth® 5 和基于 IEEE 802.15.4 的协议，包括 ZigBee® 和 Tl 15.4 应用。CC13XX-CC26XX 软件开发套件 (SDK) 提供软件支持。
特性
- 通过 BoosterPack™ 插件模块连接器访问所有 I/O 信号
- 通过智能手机上的低功耗 Bluetooth® 将 LaunchPad™ 开发套件连接到云
- 通过 SimpleLink Starter 应用程序实现 LaunchPad 开发套件固件无线升级
- Micro USB 电缆
- 快速入门指南
低功耗 2.4GHz 产品
立即订购并开发
LP-CC2651R3SIPA — CC2651R3SIPA LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module
SIMPLELINK-CC13XX-CC26XX-SDK — SimpleLink™ CC13xx and CC26xx software development kit (SDK)
SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy
产品
汽车类无线连接产品
低功耗 2.4GHz 产品
Sub-1GHz 无线 MCU
硬件开发
发布信息
Initial release of the SimpleLink CC13xx CC26xx Academy
CC26XX-REPORTS — CC26xx 监管认证报告
产品
低功耗 2.4GHz 产品
硬件开发
评估板
文档
Link to FCC, ISED, CE, & Japan Certification Reports
Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports
发布信息
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
最新信息
- Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
- Updated CC2652RSIPMOT CE with missing safety report
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices
产品
低功耗 2.4GHz 产品
Sub-1GHz 无线 MCU
汽车类无线连接产品
硬件开发
评估板
开发套件
发布信息
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI's 15.4 Stack, TI Wi-SUN FAN Stack, Amazon Sidewalk examples, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU.
Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the following wireless solutions: Please refer to their respective repositories for resources and more information.
- The Matter standard: https://github.com/TexasInstruments/matter
- Thread 1.1.1 networking stack based on OpenThread: (https://github.com/TexasInstruments/ot-ti)
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This SDK is also available on GitHub at https://github.com/TexasInstruments/simplelink-lowpower-f2-sdk
最新信息
- S-NS (tfm_xx) examples in Proprietary RF and TI 15.4 stack have been migrated to TFMv1.8
- FreeRTOS source is now included in the SDK installer
- Advanced features in Wi-SUN stack including network join time improvement
设计文件
技术文档
| 类型 | 标题 | 下载最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 证书 | LP-CC2651R3SIPA UK DoC | 2022年 7月 11日 | ||||
| 证书 | LP-CC2651R3SIPA CE DoC | 2022年 7月 11日 | ||||
| 更多文献资料 | LP-CC2651R3SIPA Quick Start Guide | 2021年 11月 9日 | ||||
| 证书 | LP-CC2651R3SIPA DoC | 2021年 11月 9日 |