OPA704
- RAIL-TO-RAIL INPUT AND OUTPUT
- WIDE SUPPLY RANGE:
Single Supply: 4V to 12V
Dual Supplies: ±2 to ±6 - LOW QUIESCENT CURRENT: 160uA
- FULL-SCALE CMRR: 90dB
- LOW OFFSET: 160uV
- HIGH SPEED:
OPA703: 1MHz, 0.6V/us
OPA704: 3MHz, 3V/us - MicroSIZE PACKAGES:
SOT23-5, MSOP-8, TSSOP-14 - LOW INPUT BIAS CURRENT: 1pA
- APPLICATIONS
- AUTOMOTIVE APPLICATIONS:
Audio, Sensor Applications, Security Systems - PORTABLE EQUIPMENT
- ACTIVE FILTERS
- TRANSDUCER AMPLIFIER
- TEST EQUIPMENT
- DATA ACQUISITION
- AUTOMOTIVE APPLICATIONS:
The OPA703 and OPA704 series op amps are optimized for applications requiring rail-to-rail input and output swing. Single, dual, and quad versions are offered in a variety of packages. While the quiescent current is less than 200uA per amplifier, the OPA703 still offers excellent dynamic performance (1MHz GBW and 0.6V/us SR) and unity-gain stability. The OPA704 is optimized for gains of 5 or greater and provides 3MHz GBW and 3V/us slew rate.
The OPA703 and OPA704 series are fully specified and guaranteed over the supply range of ±2V to ±6V. Input swing extends 300mV beyond the rail and the output swings to within 40mV of the rail.
The single versions (OPA703 and OPA704) are available in the MicroSIZE SOT23-5 and in the standard SO-8 surface-mount, as well as the DIP-8 packages. Dual versions (OPA2703 and OPA2704) are available in the MSOP-8, SO-8, and DIP-8 packages. The quad OPA4703 and OPA4704 are available in the TSSOP-14 and SO-14 packages. All are specified for operation from \x9640°C to +85°C.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | OPA703, 2703, 4703, 704, 2704, 4704: CMOS, Rail-to-Rail, I/O Op Amp 数据表 (Rev. A) | 2001年 2月 8日 | |||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 | |||
| 应用手册 | OPA703, OPA2703, OPA4703, OPA704, OPA2704, OPA4704 EMI Immunity Performance (Rev. A) | 2012年 11月 2日 | ||||
| 应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 | ||||
| 应用手册 | 高速数据转换 | 英语版 | 2008年 10月 16日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点