OPA404

正在供货

四通道高速精密 Difet® 运算放大器

产品详情

Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 10 Vos (offset voltage at 25°C) (max) (mV) 1 Offset drift (typ) (µV/°C) 3 Input bias current (max) (pA) 8 GBW (typ) (MHz) 6.4 Slew rate (typ) (V/µs) 35 Rail-to-rail No Iq per channel (typ) (mA) 9.3 Vn at 1 kHz (typ) (nV√Hz) 15 CMRR (typ) (dB) 100 Rating Catalog Operating temperature range (°C) 0 to 70 Iout (typ) (A) 0.027 Architecture FET Input common mode headroom (to negative supply) (typ) (V) 4 Input common mode headroom (to positive supply) (typ) (V) -2 Output swing headroom (to negative supply) (typ) (V) 1.2 Output swing headroom (to positive supply) (typ) (V) -1.8
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 10 Vos (offset voltage at 25°C) (max) (mV) 1 Offset drift (typ) (µV/°C) 3 Input bias current (max) (pA) 8 GBW (typ) (MHz) 6.4 Slew rate (typ) (V/µs) 35 Rail-to-rail No Iq per channel (typ) (mA) 9.3 Vn at 1 kHz (typ) (nV√Hz) 15 CMRR (typ) (dB) 100 Rating Catalog Operating temperature range (°C) 0 to 70 Iout (typ) (A) 0.027 Architecture FET Input common mode headroom (to negative supply) (typ) (V) 4 Input common mode headroom (to positive supply) (typ) (V) -2 Output swing headroom (to negative supply) (typ) (V) 1.2 Output swing headroom (to positive supply) (typ) (V) -1.8
CDIP_SB (JD) 14 138.9395 mm² 18.55 x 7.49 PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (DW) 16 106.09 mm² 10.3 x 10.3
下载

您可能感兴趣的相似产品

open-in-new 比较替代产品
功能与比较器件相同,且具有相同引脚
OPA4140 正在供货 具有轨到轨输出的四通道、11MHz、低噪声 36V JFET 精密运算放大器 This product offers higher DC Precision, lower noise, higher GBW and lower 1/5 the IQ but higher IB.

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 1
类型 标题 下载最新的英语版本 日期
* 数据表 Quad High Speed Precision Difet® Operational Amplifier 数据表 2000年 9月 27日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训