OPA334
- LOW OFFSET VOLTAGE:5 µV (max)
- ZERO DRIFT: 0.05 µV/°C (max)
- QUIESCENT CURRENT: 285 µA
- SINGLE-SUPPLY OPERATION
- SINGLE AND DUAL VERSIONS
- SHUTDOWN
- MicroSIZE PACKAGES
- APPLICATIONS
- TRANSDUCER APPLICATIONS
- TEMPERATURE MEASUREMENT
- ELECTRONIC SCALES
- MEDICAL INSTRUMENTATION
- BATTERY-POWERED INSTRUMENTS
- HANDHELD TEST EQUIPMENT
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The OPA334 and OPA335 series of CMOS operational amplifiers use auto-zeroing techniques to simultaneously provide very low offset voltage (5µV max), and near zero drift over time and temperature. These miniature, high-precision, low quiescent current amplifiers offer high input impedance and rail-to-rail output swing. Single or dual supplies as low as +2.7V (±1.35V) and up to +5.5V (±2.75V) may be used. These op amps are optimized for low-voltage, single-supply operation.
The OPA334 family includes a shutdown mode. Under logic control, the amplifiers can be switched from normal operation to a standby current of 2µA. When the Enable pin is connected high, the amplifier is active. Connecting Enable low disables the amplifier, and places the output in a high impedance state.
The OPA334 (single version with shutdown) comes in MicroSIZE SOT23-6. The OPA335 (single version without shutdown) is available in SOT23-5, and SO-8. The OPA2334 (dual version with shutdown) comes in MicroSIZE MSOP-10. The OPA2335 (dual version without shutdown) is offered in the MSOP-8 and SO-8 packages. All versions are specified for operation from 40°C to +125°C.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | 0.05uV/C max, Single-Supply CMOS Op Amps Zero-Drift 数据表 (Rev. D) | 2003年 6月 12日 | |||
| 应用简报 | 失调电压校正方法:激光修整、e-Trim™ 和斩波器 (Rev. D) | PDF | HTML | 英语版 (Rev.D) | PDF | HTML | 2024年 12月 18日 | |
| 应用简报 | 零漂移放大器:特性和优势 (Rev. C) | PDF | HTML | 英语版 (Rev.C) | 2021年 5月 25日 | ||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 | |||
| 应用手册 | OPA334, OPA2334, OPA335, OPA2335 EMI Immunity Performance (Rev. A) | 2012年 10月 31日 | ||||
| 应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 | ||||
| 应用手册 | 高速数据转换 | 英语版 | 2008年 10月 16日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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