產品詳細資料

CPU core Arm® Cortex®-M4 Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -105 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4 Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -105 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7
  • Microcontroller
    • Powerful 48MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352kB of in-system programmable flash
    • 256kB of ROM for protocols and library functions
    • 8kB of cache SRAM (alternatively available as general-purpose RAM)
    • 80kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4kB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to eight channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Low power
    • Active mode RX: 6.9mA
    • Active mode TX 0dBm: 7.3mA
    • Active mode TX 5dBm: 9.6mA
    • Active mode TX at +10dBm: 22mA
    • Active mode TX at +20dBm: 85mA
    • Active mode MCU 48MHz (CoreMark): 3.4mA (71µA/MHz)
    • Sensor controller, low power-mode, 2MHz, running infinite loop: 30.1µA
    • Sensor controller, active mode, 24MHz, running infinite loop: 808µA
    • Standby: 0.94µA (RTC on, 80kB RAM and CPU retention)
    • Shutdown: 150nA (wakeup on external events)
  • Radio section
    • 2.4GHz RF transceiver compatible with Bluetooth 5.2 low energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: –100dBm for 802.15.4 (2.4GHz), –105dBm for Bluetooth 125kbps (LE Coded PHY)
    • Output power up to +20dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • Microcontroller
    • Powerful 48MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352kB of in-system programmable flash
    • 256kB of ROM for protocols and library functions
    • 8kB of cache SRAM (alternatively available as general-purpose RAM)
    • 80kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4kB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to eight channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Low power
    • Active mode RX: 6.9mA
    • Active mode TX 0dBm: 7.3mA
    • Active mode TX 5dBm: 9.6mA
    • Active mode TX at +10dBm: 22mA
    • Active mode TX at +20dBm: 85mA
    • Active mode MCU 48MHz (CoreMark): 3.4mA (71µA/MHz)
    • Sensor controller, low power-mode, 2MHz, running infinite loop: 30.1µA
    • Sensor controller, active mode, 24MHz, running infinite loop: 808µA
    • Standby: 0.94µA (RTC on, 80kB RAM and CPU retention)
    • Shutdown: 150nA (wakeup on external events)
  • Radio section
    • 2.4GHz RF transceiver compatible with Bluetooth 5.2 low energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: –100dBm for 802.15.4 (2.4GHz), –105dBm for Bluetooth 125kbps (LE Coded PHY)
    • Output power up to +20dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

The SimpleLink™ CC2652P device is a multiprotocol 2.4GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 low energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater and entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Wide flexibility of protocol stack support in the SimpleLink™ LOWPOWER F2 Software Development Kit (SDK).
  • Enable long-range and low-power applications using integrated +20dBm high-power amplifier with best-in-class transmit current consumption at 85mA
  • Coin-cell operation at +10dBm with transmit current consumption of 22mA
  • Longer battery life wireless applications with low standby current of 0.94µA with full RAM retention
  • Industrial temperature ready with lowest standby current of 5µA at 85°C
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1Hz ADC sampling at 1µA system current.
  • Low SER (Soft Error Rate) FIT (failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–105dBm for 125kbps LE Coded PHY).

The CC2652P device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs. The CC2652P is part of a scalable portfolio with flash sizes from 32kB to 704kB with pin-to-pin compatible package options and share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing a high degree of code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2652P device is a multiprotocol 2.4GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 low energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater and entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Wide flexibility of protocol stack support in the SimpleLink™ LOWPOWER F2 Software Development Kit (SDK).
  • Enable long-range and low-power applications using integrated +20dBm high-power amplifier with best-in-class transmit current consumption at 85mA
  • Coin-cell operation at +10dBm with transmit current consumption of 22mA
  • Longer battery life wireless applications with low standby current of 0.94µA with full RAM retention
  • Industrial temperature ready with lowest standby current of 5µA at 85°C
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1Hz ADC sampling at 1µA system current.
  • Low SER (Soft Error Rate) FIT (failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–105dBm for 125kbps LE Coded PHY).

The CC2652P device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs. The CC2652P is part of a scalable portfolio with flash sizes from 32kB to 704kB with pin-to-pin compatible package options and share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing a high degree of code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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CC2652P7 現行 SimpleLink™ Arm® Cortex®-M4F 多協定 2.4-GHz 無線 MCU、704-kB 快閃記憶體、整合式功率放大器 Pin-to-pin upgrade with increased flash and RAM.
CC2652R 現行 具有 352kB 快閃記憶體的 SimpleLink™ 32 位元 Arm Cortex-M4F 多協定 2.4 GHz 無線 MCU This product does not have integrated power amplifer (+20-dBm output power).
CC2652RB 現行 具有無晶體震盪 BAW 諧振器的 SimpleLink™ 32 位元 ARM Cortex-M4F 多協定 2.4 GHz 無線 MCU This product helps lower the system price with an integrated BAW resonator and removes the integrated power amplifer.

技術文件

star =TI 所選的此產品重要文件
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重要文件 類型 標題 格式選項 日期
* Data sheet CC2652P SimpleLink™ Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier datasheet (Rev. C) PDF | HTML 2024年 4月 3日
* Errata CC2652P SimpleLink™ Wireless MCU Device Revision E Silicon Errata PDF | HTML 2019年 10月 29日
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 2024年 6月 27日
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025年 11月 18日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024年 5月 2日
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022年 10月 20日
Application note How to Do RF Radio Test With Your Bluetooth Product (Rev. A) PDF | HTML 2022年 8月 4日
Application note 2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P PDF | HTML 2022年 4月 5日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022年 2月 25日
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021年 12月 20日
Technical article How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic PDF | HTML 2021年 7月 23日
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 2021年 6月 4日
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 2021年 5月 13日
Technical article An FAQ about the Matter connectivity standard PDF | HTML 2021年 5月 11日
White paper Dynamic Multi-Protocol (DMM) Performance 2021年 4月 21日
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 2021年 4月 12日
Application note Optimizing the SimpleLink CC1352P for Coin Cell Operation at 10 dBm Output Power (Rev. C) PDF | HTML 2020年 12月 8日
Technical article How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 2020年 9月 21日
Technical article Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy PDF | HTML 2020年 8月 20日
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020年 7月 17日
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 2020年 6月 5日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 2020年 3月 31日
Application note Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 2020年 2月 5日
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020年 1月 28日
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 2020年 1月 27日
Technical article Extending 2.4 GHz without compromising performance in a connected world PDF | HTML 2019年 11月 14日
Application note Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 2019年 9月 23日
More literature Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 2019年 6月 17日
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 2019年 6月 6日
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 2019年 5月 29日
Application note Z-Stack End Dev Pwr Cons Measuremen w/ the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 2019年 5月 17日
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 2019年 4月 15日
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 2019年 1月 10日
Application note RF PCB Simulation Cookbook 2019年 1月 9日
Technical article Unlock every door with the SimpleLink™ platform PDF | HTML 2018年 9月 19日
Technical article How to create a robust building security system with TI’s SimpleLink MCU platform PDF | HTML 2018年 3月 7日
Application note Low-Power ADC Solution for CC13x2 and CC26x2 2018年 3月 2日
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 2018年 2月 27日
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 2018年 2月 27日
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017年 3月 5日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LAUNCHXL-CC1352P — 適用 SimpleLink™ 多頻帶無線 MCU 的 CC1352P LaunchPad™ 開發套件

此 LaunchPad 可加速在具備整合式功率放大器和多頻帶無線電支援的裝置上進行開發,可同時進行 Sub-1Ghz 與 2.4-GHz 操作。支援的通訊協定包括 Bluetooth® 低耗能、Sub-1 GHz、Thread、Zigbee、802.15.4 和搭載相容 CC13x2-CC26x2 SDK 的專利 RF。提供具不同 RF 配對網路與功率等級的變化。

LAUNCHXL-CC1352P1:868/915 MHz 高達 20 dBm、2.4 GHz 高達 5 dBm

LAUNCHXL-CC1352P-2*:868/915 MHz 高達 14 dBm、2.4 GHz 高達 20 dBm

(...)

使用指南: PDF
開發板

ALGO-3P-UISP1-TI — 適用於德州儀器裝置的 Algocraft μISP1 編程器

μISP 可以連接到主機 PC (內建 RS-232、USB、LAN 連接) 或獨立模式工作。

在單機模式下,只要按下「開始」按鈕或透過一些 TTL 控制線,就可以執行編程週期。

其緊湊的尺寸和多功能性可輕鬆整合到生產環境、手動和自動化程序中。

從:Algocraft
偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別,適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列,可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時,所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤,則需要 XDS560v2 PRO TRACE

德州儀器 XDS110 透過 TI 20 針腳連接器(具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器)連接到目標電路板,並透過 USB2.0 (...)

使用指南: PDF
TI.com 無法提供
偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)

TI.com 無法提供
偵錯探測器

LB-3P-TRACE32-WIRELESS — 適用於無線連線的 Lauterbach TRACE32® 偵錯系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件,可讓開發人員分析、最佳化及認證 TI 許多無線連線晶片。全球知名的嵌入式系統偵錯解決方案是完美的解決方案,適用於從早期的矽前 (pre-silicon) 開發,到產品認證和現場故障排除等所有開發階段:   完整的晶片內建斷點支援;執行階段記憶體存取;快閃記憶體編程和基準計數器。所有內容都是可編寫指令碼,使開發人員能夠一再地重複相同的測試順序。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能,以及可隨需求變化而調整和成長的系統。經認證的工具資格認證支援套件 (TQSK) 提供便利的全方位方式,鑒定 (...)

開發套件

BOOSTXL-ULPSENSE — SimpleLink™ ULP Sense BoosterPack™

若要開始,請造訪 dev.ti.com/BOOSTXL-ULPSENSE

ULP Sense BoosterPack 套件的設計用途可輕鬆展示 CC13x2 CC26x2 RF SoC 中所含感測器控制器的超低功耗功能。 

此類應用範例包括:機械式流量計的測量(基於簧片開關或感應原理)、電容式觸控按鈕,以及超低功耗的加速度計處理(例如跌倒偵測)。

電路板也包含類比光源感測器和電位計,可用於 ADC 測試案例。ULP Sense Studio 中的許多軟體範例都會使用 ULP Sense BoosterPack 做為硬體平台。

使用指南: PDF
TI.com 無法提供
開發套件

RFSTAR-3P-CC2652-MODULES — 以 CC2652R CC2652R7 CC2652P CC2652P7 為基礎的 RFSTAR 多協定無線模組

RF-star 超過十年來均是 TI 的無線連線模組第三方 IDH,專門供應以 TI 產品為基礎的各種無線模組及解決方案,例如 BLE、Matter、ZigBee、Thread、Wi-Fi、Sub-1G 與 Wi-SUN。 
RF-BM-2652B1 無線模組是以 CC2652R 為基礎、RF-BM-2652B2 是以 CC2652R7 為基礎、RF-BM-2652P2(I) 系列是以 CC2652P為基礎,而 RF-BM-2652P4(I) 則是以 CC2652P7 為基礎,這些 SimpleLink 多協定 2.4 GHz 無線模組均支援 Matter (僅限 (...)

開發套件

TTC-3P-ZIGBEE-MODULES — TTC Zigbee 模組

HY-52PX01 PC 是以 SimpleLink™ CC2652P 為基礎而開發。它是一種多協定 2.4-GHz 無線微控制器 (MCU),其支援 Thread、Zigbee®、Bluetooth® 5.2 低耗能、IEEE 802.15.4 和智慧型物件,支援 IPv6 (6LoWPAN)、專有系統,包括 TI 15.4 堆疊 (2.4 GHz),以及透過動態多協定管理員 (DMM) 驅動程式的並存多協定。本裝置針對建築安全系統、HVAC、醫療、有線網路、可攜式電子產品、家庭劇院與娛樂,以及連線週邊設備市場中的低功耗無線通訊和高階感測進行最佳化。

硬體程式設計工具

ALGO-3P-WRITENOW — Algocraft WriteNow!程式設計工具

WriteNow! 系統內編程器系列是可編程產業的一大突破。此編程器支援多家製造商的眾多裝置 (例如微控制器、記憶體、CPLD 與其他可編程裝置)。其尺寸精巧,便於整合至 ATE 與固定裝置。編程器可單機運作,或透過內建的 RS-232、LAN 與 USB 連接埠與主機電腦連線,並隨附操作簡易的工具軟體。

從:Algocraft
軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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軟體開發套件 (SDK)

SIMPLELINK-TI-OPENTHREAD-SDK SimpleLink™ family of devices OpenThread software

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

ARM-CGT Arm® code generation tools -- compiler

The TI Arm® code generation (compiler) tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the open-source Clang compiler and its supporting LLVM (...)

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IDE、配置、編譯器或偵錯程式

ARM-CGT-CLANG Arm® code generation tools - compiler

The TI Arm® code generation (compiler) tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the open-source Clang compiler and its supporting LLVM (...)

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IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

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IDE、配置、編譯器或偵錯程式

SENSOR-CONTROLLER-STUDIO Sensor Controller Studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

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IDE、配置、編譯器或偵錯程式

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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線上培訓

SIMPLELINK-ACADEMY-CC13XX-CC26XX SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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軟體程式設計工具

FLASH-PROGRAMMER-2 SmartRF Flash Programmer v2

SmartRF Flash Programmer 2 can be used to program the flash memory in Texas Instruments ARM based low-power RF wireless MCUs over the debug and serial interfaces. Check the list of supported products for compatibility. Uniflash can also be used to program any SimpleLink product.

SmartRF Flash (...)

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軟體程式設計工具

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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支援軟體

RF-RANGE-ESTIMATOR RF Range Estimator

This tool is used to calculate a range estimate for indoor and outdoor RF links using TI wireless devices. The outdoor calculation is based upon Line-of-Sight (LOS). For the indoor estimation, construction materials can be selected that are between the Tx and Rx unit. The greater the attenuation (...)
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計算工具

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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計算工具

ZIGBEE-POWER-CALC — Z-Stack™ 功率計算機工具

此工具讓 SimpleLink™ Z-Stack™ 軟體使用者可在 Zigbee 應用中分析休眠終端裝置的系統電源設定檔。此計算機可讓使用者評估系統電池的潛在使用壽命,並透過配置系統設定、堆疊參數、有效載荷設定檔和使用參數來最佳化電池壽命,從而透過模擬系統設計選擇來實現預期的性能目標。
設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

第三方無線模組搜尋工具協助開發人員識別符合其終端設備規格的產品,並採購可投入生產的無線模組。搜尋工具中包含的第三方模組供應商是獨立的第三方公司,擁有使用 TI 無線連接產品設計與製造無線模組的專業知識。
設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — SimpleLink™ CC2xxx 裝置的硬體設計審核

SimpleLink 硬體設計審核流程提供一對一接觸的方式,並由主題內容專家協助審查您的設計,提供您寶貴的意見。一個簡單的三步驟流程用於請求審查,以及相關技術文件和資源的連結,可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中,然後才能要求 2.4 GHz 硬體設計審查。

請確實備妥下列必要文件,隨硬體設計審查申請表一起傳送:

  • 確認產品頁上提供的所有硬體文件均已經過審查,例如產品規格表、設計指南、使用指南和其他硬體資源
  • 電路圖的可攜式文件格式 (PDF) 版本可供檢閱
  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
Gerber 檔案

LAUNCHXL-CC1352P-2 Design Files (Rev. A)

SWRC350A.ZIP (5945 KB)
Gerber 檔案

CC1352PEM-XD7793-XD24-PA24 Design Files

SWRC363.ZIP (1651 KB)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGZ) 48 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

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