產品詳細資料

CPU 1 Arm Cortex-A53, 2 Arm Cortex-A53, 4 Arm Cortex-A53 Frequency (MHz) 1400 Coprocessors 1 Arm Cortex-M4F Protocols Ethernet, TSN Features Vision Analytics Operating system Linux Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution TPS65219 Operating temperature range (°C) -40 to 125 Edge AI enabled No
CPU 1 Arm Cortex-A53, 2 Arm Cortex-A53, 4 Arm Cortex-A53 Frequency (MHz) 1400 Coprocessors 1 Arm Cortex-M4F Protocols Ethernet, TSN Features Vision Analytics Operating system Linux Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution TPS65219 Operating temperature range (°C) -40 to 125 Edge AI enabled No

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm® Cortex®-M4F MCU at up to 400MHz
    • 256KB SRAM with SECDED ECC
  • Dedicated Device/Power Manager

Multimedia:

  • Display subsystem
    • Dual display support
    • 1920x1080 @ 60fps for each display
    • 1x 2048x1080 + 1x 1280x720
    • Up to 165MHz pixel clock support with Independent PLL for each display
    • OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
    • Support safety feature such as freeze frame detection and MISR data check
  • 3D Graphics Processing Unit
    • 1 pixel per clock or higher
    • Fillrate greater than 500Mpixels/sec
    • >500MTexels/s, >8GFLOPs
    • Supports at least 2 composition layers
    • Supports up to 2048x1080 @60fps
    • Supports ARGB32, RGB565 and YUV formats
    • 2D graphics capable
    • OpenGL ES 3.1, Vulkan 1.2
  • One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
    • MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA

Memory Subsystem:

  • Up to 816KB of On-chip RAM
    • 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-Bit data bus with inline ECC
    • Supports speeds up to 1600MT/s
    • Max addressable range
      • 8GBytes with DDR4
      • 4GBytes with LPDDR4

Functional Safety:

  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TUV SUD planned
  • AEC - Q100 qualified

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

PRU Subsystem:

  • Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333MHz
  • Intended for driving GPIO for cycle accurate protocols such as additional:
    • General Purpose Input/Output (GPIO)
    • UARTs
    • I2C
    • External ADC
  • 16KByte program memory per PRU with SECDED ECC
  • 8KB data memory per PRU with SECDED ECC
  • 32KB general purpose memory with SECDED ECC
  • CRC32/16 HW accelerator
  • Scratch PAD memory with 3 banks of 30 x 32-bit registers
  • 1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
  • 1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time sensitive networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 3x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
    • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low power modes supported by Device/Power Manager
    • Partial IO support for CAN/GPIO/UART wakeup
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling for Cortex-A53

Optimal Power Management Solution:

  • Recommended TPS65219 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • Serial NAND Flash
  • SD Card
  • eMMC
  • USB (host) boot from Mass Storage device
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16nm technology
  • 13mm x 13mm, 0.5mm pitch, 425-pin FCCSP BGA (ALW)
  • 17.2mm x 17.2mm, 0.8mm pitch, 441-pin FCBGA (AMC)

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm® Cortex®-M4F MCU at up to 400MHz
    • 256KB SRAM with SECDED ECC
  • Dedicated Device/Power Manager

Multimedia:

  • Display subsystem
    • Dual display support
    • 1920x1080 @ 60fps for each display
    • 1x 2048x1080 + 1x 1280x720
    • Up to 165MHz pixel clock support with Independent PLL for each display
    • OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
    • Support safety feature such as freeze frame detection and MISR data check
  • 3D Graphics Processing Unit
    • 1 pixel per clock or higher
    • Fillrate greater than 500Mpixels/sec
    • >500MTexels/s, >8GFLOPs
    • Supports at least 2 composition layers
    • Supports up to 2048x1080 @60fps
    • Supports ARGB32, RGB565 and YUV formats
    • 2D graphics capable
    • OpenGL ES 3.1, Vulkan 1.2
  • One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
    • MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA

Memory Subsystem:

  • Up to 816KB of On-chip RAM
    • 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-Bit data bus with inline ECC
    • Supports speeds up to 1600MT/s
    • Max addressable range
      • 8GBytes with DDR4
      • 4GBytes with LPDDR4

Functional Safety:

  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TUV SUD planned
  • AEC - Q100 qualified

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

PRU Subsystem:

  • Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333MHz
  • Intended for driving GPIO for cycle accurate protocols such as additional:
    • General Purpose Input/Output (GPIO)
    • UARTs
    • I2C
    • External ADC
  • 16KByte program memory per PRU with SECDED ECC
  • 8KB data memory per PRU with SECDED ECC
  • 32KB general purpose memory with SECDED ECC
  • CRC32/16 HW accelerator
  • Scratch PAD memory with 3 banks of 30 x 32-bit registers
  • 1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
  • 1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time sensitive networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 3x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
    • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low power modes supported by Device/Power Manager
    • Partial IO support for CAN/GPIO/UART wakeup
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling for Cortex-A53

Optimal Power Management Solution:

  • Recommended TPS65219 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • Serial NAND Flash
  • SD Card
  • eMMC
  • USB (host) boot from Mass Storage device
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16nm technology
  • 13mm x 13mm, 0.5mm pitch, 425-pin FCCSP BGA (ALW)
  • 17.2mm x 17.2mm, 0.8mm pitch, 441-pin FCBGA (AMC)

The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development. With scalable Arm® Cortex®-A53 performance and embedded features, such as dual-display support and 3D graphics acceleration, along with an extensive set of peripherals, making the AM62x device well-suited for a broad range of industrial and automotive applications while offering intelligent features and optimized power architecture.

Functional safety requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all be isolated from the rest of the AM62x processor.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) capable. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM62x enable system-level connectivity, such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications.

Products in the AM62x processor family:

  • AM625 – Human-machine Interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual-display
  • AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
  • AM623 – Internet of Things (IoT) and Gateway SoC with Arm® Cortex®-A53-based object and gesture recognition
  • AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X systems

The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development. With scalable Arm® Cortex®-A53 performance and embedded features, such as dual-display support and 3D graphics acceleration, along with an extensive set of peripherals, making the AM62x device well-suited for a broad range of industrial and automotive applications while offering intelligent features and optimized power architecture.

Functional safety requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all be isolated from the rest of the AM62x processor.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) capable. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM62x enable system-level connectivity, such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications.

Products in the AM62x processor family:

  • AM625 – Human-machine Interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual-display
  • AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
  • AM623 – Internet of Things (IoT) and Gateway SoC with Arm® Cortex®-A53-based object and gesture recognition
  • AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X systems

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 AM62x Sitara™ Processors datasheet (Rev. C) PDF | HTML 2025/10/31
* 使用指南 AM62x Sitara Processors Technical Reference Manual (Rev. D) PDF | HTML 2026/11/3
* 勘誤表 AM62x Sitara Errata (Rev. G) PDF | HTML 2025/10/30
應用說明 Integrating CDD DMA in AUTOSAR Environment PDF | HTML 2026/10/23
應用說明 Debug Application on AM243x/AM64x Device With SEGGER J-Link PDF | HTML 2026/10/21
應用說明 AM62x Power Consumption (Rev. A) PDF | HTML 2026/10/14
使用指南 AM62x, AM62Ax, AM62D-Q1 and AM62Px Processor Families, Supported Peripherals and Schematic Design Guidelines (Rev. J) PDF | HTML 2026/10/9
白皮書 CRA Roles Across the Embedded Processor Supply Chain PDF | HTML 2026/10/1
應用說明 Bad Block Management for Serial NAND Flash on Sitara Devices (Rev. A) PDF | HTML 2026/9/29
應用說明 Linux Board Porting on AM62x Devices (Rev. B) PDF | HTML 2026/9/29
應用說明 AM62x Audio Design Guide (Rev. A) PDF | HTML 2026/8/24
應用說明 QSPI Addressing Mode Considerations for AM62Ax Devices PDF | HTML 2026/8/20
應用說明 DDR Inline ECC Error Address Decoding on Jacinto™ 7 and Sitara™ Processors PDF | HTML 2026/8/20
應用說明 DDR Inline ECC Error Injection and Validation Guide for Jacinto™ 7 and Sitara™ Processors PDF | HTML 2026/8/19
白皮書 Securing the Future: Cyber Resilience Act (EU-CRA) Compliance with TI’s Jacinto and Sitara Processors PDF | HTML 2026/4/24
應用說明 Custom Board Design and Simulation Guidelines for Processor High Speed Parallel Interfaces (Rev. A) PDF | HTML 2026/2/12
應用說明 Linux Audio on Sitara Socs PDF | HTML 2025/12/12
功能安全資訊 AM62x TÜV SÜD Functional Safety Certificate 2025/12/1
應用說明 Getting Started with Sysconfig Tool PDF | HTML 2025/11/21
使用指南 Hardware Design Considerations for Custom Board Using AM625, AM623, AM620-Q1, AM625-Q1, AM625SIP Processor (Rev. E) PDF | HTML 2025/10/24
應用說明 Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. H) PDF | HTML 2025/10/17
使用指南 AM625, AM623, AM620-Q1, AM625-Q1, AM625SIP Processor Family Schematic, Design Guidelines and Review Checklist (Rev. B) PDF | HTML 2025/9/16
應用說明 AM62x, AM62Ax, AM62Px, AM62Lx Spread-Spectrum Clocking PDF | HTML 2025/9/8
應用說明 Powering the AM62x with the TPS65219 PMIC (Rev. C) PDF | HTML 2025/8/18
功能安全資訊 AM6x, AM24x Software Diagnostics Library TÜV SÜD Functional Safety Certificate for 9.2.0 SDK (Rev. A) 2025/7/17
應用說明 AM62x, AM62Lx DDR Board Design and Layout Guidelines (Rev. C) PDF | HTML 2025/3/5
應用說明 MCAN Debug Guide PDF | HTML 2025/2/18
應用說明 Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 2025/1/28
應用說明 Basic Ethernet Interface Debug With Linux PDF | HTML 2024/10/11
功能安全資訊 AM62, AM62A AUTOSAR MCAL Drivers Functional Safety Certificate 2024/8/16
Application brief Keyword Spotting Using AI at the Edge With Sitara Processors PDF | HTML 2023/9/28
白皮書 Time Sensitive Networking for Industrial Automation (Rev. C) PDF | HTML 2023/7/31
應用說明 High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023/2/24
應用說明 AM62x (AMC) PCB Escape Routing PDF | HTML 2022/9/22
應用說明 AM62x Extended Power-On Hours PDF | HTML 2022/5/13
應用說明 AM62x Power Estimation Tool PDF | HTML 2022/4/8

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