軟體開發套件 (SDK)
AM62D-AWE-SDK — AudioWeaver Audio SDK for AM62D
AudioWeaver Audio SDK for AM62D
產品規格表
AM62D-Q1
Processor Cores:
- Up to Quad Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
- Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
- Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
- Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
- 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
- 512KB SRAM with SECDED ECC
- Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
- 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
- DSP with Matrix Multiplication Accelerator based on single-core C7x
- C7x floating point, up to 40GFLOPS, 256-bit Vector DSP at 1.0GHz
- Matrix Multiply Accelerator (MMA), up to 2TOPS (8b) at 1.0GHz
- 64KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
- 1.25MB of L2 SRAM with SECDED ECC
Memory Subsystem:
- Up to 2.29MB of On-chip RAM
- 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
- 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
- 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
- 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
- 1.25MB of L2 SRAM with SECDED ECC in C7xDSP with Matrix Multiplication Accelerator
- DDR Subsystem (DDRSS)
- Supports LPDDR4
- 32-bit data bus with inline ECC
- Supports speeds up to 3733MT/s
- Max addressable range of 8GBytes
Functional Safety:
- Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation will be available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL D targeted
- Hardware integrity up to ASIL B targeted
- Safety-related certification
- ISO 26262 certification by TÜV SÜD planned
- AEC - Q100 qualified [Automotive]
Security:
- Secure boot supported
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
- Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
- Secure storage support
- Replay Protected Memory Block (RPMB) support
- Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
- Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Supports cryptographic cores
- AES – 128-/192-/256-Bit key sizes
- SHA2 – 224-/256-/384-/512-Bit key sizes
- DRBG with true random number generator
- PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Debugging security
- Secure software controlled debug access
- Security aware debugging
High-Speed Interfaces:
- Integrated Ethernet switch supporting (total 2 external ports)
- RMII(10/100) or RGMII (10/100/1000)
- IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority based flow control
- Time Sensitive Networking (TSN) support
- Four CPU H/W interrupt Pacing
- IP/UDP/TCP checksum offload in hardware
- Two USB2.0 Ports
- Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
- Integrated USB VBUS detection
- One Camera Serial interface (CSI-2) Receiver with 4-Lane D-PHY
- High Speed External Processor Data Receive Interface over CSI-2 and MIPI D-PHY
General Connectivity:
- 9x Universal Asynchronous Receiver-Transmitters (UART)
- 5x Serial Peripheral Interface (SPI) controllers
- 6x Inter-Integrated Circuit (I2C) ports
- 3x Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50MHz
- Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
- 3x enhanced PWM modules (ePWM)
- 3x enhanced Quadrature Encoder Pulse modules (eQEP)
- 3x enhanced Capture modules (eCAP)
- General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
- 3x Controller Area Network (CAN) modules with CAN-FD support
- Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
- Full CAN-FD support (up to 64-data bytes)
- Parity/ECC check for Message RAM
- Speed up to 8Mbps
Media and Data Storage:
- 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
- 1x 8-bit eMMC interface up to HS200 speed
- 2x 4-bit SD/SDIO interface up to UHS-I
- Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
- 1× General-Purpose Memory Controller (GPMC) up to 133MHz
- Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
- Uses BCH code to support 4-, 8-, or 16-bit ECC
- Uses Hamming code to support 1-bit ECC
- Error Locator Module (ELM)
- Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
- Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
- OSPI/QSPI with DDR / SDR support
- Support for Serial NAND and Serial NOR Flash devices
- 4GBytes memory address support
- XIP mode with optional on-the-fly encryption
Power Management:
- Low-power modes supported by Device/Power Manager
- Partial IO support for CAN/GPIO/UART wakeup
Boot Options:
- UART
- I2C EEPROM
- OSPI/QSPI Flash
- GPMC NOR/NAND Flash
- Serial NAND Flash
- SD Card
- eMMC
- USB (host) Mass Storage device
- USB (slave) boot from external host (DFU mode)
- Ethernet
Technology / Package:
- 16-nm FinFET technology
- 18mm x 18mm, 0.8mm pitch full-array, 484-pin FCCSP (ANF)
The AM62D processor from the Sitara™ MPU family is targeted for applications needing high-performance Digital Signal Processing. Some of these applications include:
- Audio: Automotive premium amplifier and professional audio
- Radar and Radio: Aerospace and Defense
- Sonar: Marine equipments
- Ultrasound: Medical equipments
- Instrumentation: Current, Voltage, other signals: Test and Measurement
Key cores on the device include the Arm® Cortex®-A53 and C7000™ (“C7x”) scalar and vector DSP core from Texas Instruments, a dedicated Matrix Multiplication Accelerator (MMA), along with an isolated MCU island. All protected by industrial and automotive grade safety and security hardware accelerators.
DSP Core Overview: the C7504 core from C7x family provides up to 40GFLOPS of DSP compute. It achieves 4x to 8x or more performance compared to the previous generation C66x DSP core. Some of the key features includes:
- 256-bit fixed- and floating-point DSP vector core
- Single-cycle latency to access L2 memory via Streaming Engine
- Improved control code efficiency
- True 64-bit machine with 64-bit memory addressing and single-cycle 64-bit base arithmetic operations
Integration Overview: along with C7x DSP core, the AM62D SoC integrates up to Quad Arm® Cortex®-A53 providing additional 16.8KDMIPS compute and HLOS flexibility of Linux or Real-Time Operating System (RTOS). Up to two Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm® Cortex®-A53 and DSP core’s unencumbered for applications. Integrated diagnostics and safety features support operations up to SIL-2 and ASIL-B levels while the integrated security features protect data against modern day attacks. The AM62D device also offers a 3-port Gigabit Ethernet switch with Time-Sensitive Networking (TSN) to enable audio networking features such as, Ethernet Audio Video Bridging (eAVB) and Dante, while peripherals like the McASP, enable multi-channel I2S and TDM Audio inputs and outputs.
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偵錯探測器
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Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件，可讓開發人員分析、最佳化及認證各種 Arm® 架構微控制器和處理器。全球知名的嵌入式系統和 SoC 偵錯和追蹤解決方案是完美的解決方案，適用於從早期的矽前 (pre-silicon) 開發，到產品認證和現場故障排除等所有開發階段。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能，以及可隨需求變化而調整和成長的系統。藉由 TRACE32® 偵錯器，開發人員也可透過單一偵錯介面，同時偵錯和控制 SoC 中的任何 C28x/C29x/C6x/C7x DSP 核心及所有其他 Arm (...)
應用軟體及架構
AM62D-RESTRICTED-DOCS-SAFETY — AM62D safety content
This folder contains materials for customers who intend to implement functional safety mechanisms into production.
支援產品和硬體
快速入門
TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud
From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支援產品和硬體
IDE、配置、編譯器或偵錯程式
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.
(...)
支援產品和硬體
IDE、配置、編譯器或偵錯程式
K3-RESOURCE-CONFIGURATION — Resource partitioning tool for multi core SOCs
Also known as the k3-respart-tool, the Resource Configuration tool allows for configuration of various system level parameters and generate the necessary data to be fed into software components
支援產品和硬體
IDE、配置、編譯器或偵錯程式
SYSCONFIG — Standalone desktop version of SysConfig
SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.
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作業系統 (OS)
GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS
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作業系統 (OS)
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計算工具
AM62D-PET-CALC — AM62D Power Estimation Tool
AM62D PET provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not guaranteed within a specified precision.
支援產品和硬體
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| FCCSP (ANF) | 484 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。