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CC2755P20

現行

2.4GHz 多協定 MCU，具有晶片內建 HSM、邊緣 AI、2MB 快閃記憶體、+20dBm、<1µA 待機

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CC2755P20

現行
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產品詳細資料

CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 2048 RAM (kByte) 288 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Cryptographic accelerators AES, TRNG Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125
CPU Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 2048 RAM (kByte) 288 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Cryptographic accelerators AES, TRNG Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125
VQFN (RHA) 40 36 mm² (6 mm × 6 mm)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • 2MB of in-system programmable flash
  • 288KB of SRAM
  • 36KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs have wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.2mA
  • TX current at 0dBm: 7.7mA
  • TX current at +5dBm: 10.6mA
  • TX current at +20dBm: 132mA
  • Active mode MCU 96MHz (CoreMark): 6.7mA
  • Standby: 1.1µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160.8nA
  • Matter
  • Thread
  • Zigbee®
  • Bluetooth Low Energy Core 6.0 Qualified with support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Proprietary 2.4GHz systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • IEEE 802.15.4 (2.4GHz): –103dBm
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • 2MB of in-system programmable flash
  • 288KB of SRAM
  • 36KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs have wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.2mA
  • TX current at 0dBm: 7.7mA
  • TX current at +5dBm: 10.6mA
  • TX current at +20dBm: 132mA
  • Active mode MCU 96MHz (CoreMark): 6.7mA
  • Standby: 1.1µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160.8nA
  • Matter
  • Thread
  • Zigbee®
  • Bluetooth Low Energy Core 6.0 Qualified with support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Proprietary 2.4GHz systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • IEEE 802.15.4 (2.4GHz): –103dBm
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks

The SimpleLink™ CC2755x20 family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.0 and the upcoming versions), Zigbee (4.0 and the upcoming versions), Matter (1.5 and the upcoming versions), Thread (1.4 and the upcoming versions), and other 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.x and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Supports an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
  • Arm Custom Datapath Extension (CDE) instruction support for machine learning acceleration
  • Matter stack available on https://github.com/TexasInstruments/matter
  • Thread protocol stack available on https://github.com/TexasInstruments/ot-ti
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 288KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with very low standby current
  • Integrated balun and integrated RF switch to support both transmit and receive operations on the same RF pin, even at +20dBm transmit power; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy and IEEE 802.15.4

The CC2755x20 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2755x20 family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.0 and the upcoming versions), Zigbee (4.0 and the upcoming versions), Matter (1.5 and the upcoming versions), Thread (1.4 and the upcoming versions), and other 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.x and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Supports an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation
    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
  • Arm Custom Datapath Extension (CDE) instruction support for machine learning acceleration
  • Matter stack available on https://github.com/TexasInstruments/matter
  • Thread protocol stack available on https://github.com/TexasInstruments/ot-ti
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 288KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with very low standby current
  • Integrated balun and integrated RF switch to support both transmit and receive operations on the same RF pin, even at +20dBm transmit power; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy and IEEE 802.15.4

The CC2755x20 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC2755x20 SimpleLink Family of 2.4GHz High Performance Wireless MCUs datasheet (Rev. B) PDF | HTML 2026/6/15
* 使用指南 CC2755P20 SimpleLink Wireless MCU Technical Reference Manual PDF | HTML 2026/6/18
* 勘誤表 CC2755P20 SimpleLink Wireless MCU Errata PDF | HTML 2026/6/18

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

CC2745R10-CS-EVM — CC2745R10 通道探測評估模組

使用指南: PDF | HTML
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開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-ZEPHYR-SDK — Zephyr® Platform support for the SimpleLink™ Low Power family of devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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軟體開發套件 (SDK)

SIMPLELINK-MATTER — SimpleLink™ family of devices Matter software

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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軟體開發套件 (SDK)

SIMPLELINK-TI-OPENTHREAD-SDK — SimpleLink™ family of devices OpenThread software

This Texas Instruments OpenThread GitHub repository (ot-ti) contains all the software development components and tools that enable engineers to develop Thread based products.
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CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
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EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio 是一系列圖形和命令行工具，旨在加速 TI 處理器、微控制器和雷達感測器上的邊緣 AI 開發。不管是使用來自 TI Model Zoo 的模型，還是
運用您自己的模型來開發概念驗證，Edge AI Studio 都能提供您所需的工具。

Edge AI Studio 圖形使用者介面提供完全整合的解決方案，用於收集和註釋資料、訓練和編譯模型，以在即時開發平台上部署。從 TI Model Zoo 中的各種預先訓練的模型中選擇，並可選擇透過自訂資料重新訓練，以提升準確度和性能。Edge AI Studio (...)

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SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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支援軟體

SMARTRF-STUDIO-8 — 適用於 CC23xx 和 CC27xx 裝置以及 CC140xP 收發器的 SmartRF Studio 8 應用軟體

SmartRF™ Studio 是一款 Windows 應用程式，功用在於協助射頻系統的設計人員在為所有 TI CC1xxx 及 CC2xxx 低功耗射頻裝置設計過程中，能在早期階段輕鬆評估無線電。此程式簡化了配置暫存器值和命令的產生，以及射頻系統的實際測試和除錯。

SmartRF Studio 支援下列 TI 裝置：

 

資源

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認證

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

SimpleLink 硬體設計審核流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。一個簡單的三步驟流程用於請求審查，以及相關技術文件和資源的連結，可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中，然後才能要求 2.4 GHz 硬體設計審查。

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  • 確認產品頁上提供的所有硬體文件均已經過審查，例如產品規格表、設計指南、使用指南和其他硬體資源
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  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
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