首頁 無線連線 低耗電 2.4GHz 產品
首頁
無線連線
低耗電 2.4GHz 產品

CC2340R2

現行

具有 256kB 快閃記憶體的 SimpleLink™ 32 位元 Arm® Cortex®-M0+ 2.4GHz 無線 MCU

立即訂購
產品規格表
使用指南
勘誤表

CC2340R2

現行
產品規格表 立即訂購

產品詳細資料

Technology Bluetooth® LE, Proprietary 2.4 GHz Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 256 RAM (kByte) 28, 36 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12, 26 Security Cryptographic acceleration Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 125 TX power (max) (dBm) 8 Cryptographic accelerators AES, RNG Edge AI enabled No
Technology Bluetooth® LE, Proprietary 2.4 GHz Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 256 RAM (kByte) 28, 36 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12, 26 Security Cryptographic acceleration Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 125 TX power (max) (dBm) 8 Cryptographic accelerators AES, RNG Edge AI enabled No
VQFN (RGE) 24 16 mm² 4 x 4 VQFN (RKP) 40 25 mm² 5 x 5

Wireless microcontroller

  • Optimized 48MHz Arm Cortex-M0+ processor
  • Up to 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode on CC2340R52
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth LE
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4
  • Zigbee®
  • Thread
  • Proprietary systems

High-performance radio

  • –102dBm sensitivity for Bluetooth® LE Coded 125kbps
  • –96.5dBm sensitivity for Bluetooth® LE 1Mbps
  • –98dBm sensitivity for IEEE 802.15.4 (2.4GHz)
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • Up to 26 I/O pads
    • Two IO pads SWD, muxed with GPIOs
    • Two IO pads LFXT, muxed with GPIOs
    • Up to 22 DIOs (analog or digital IOs)
  • Up to 3 × 16-bit and 1× 24-bit general-purpose timers with quadrature decode mode and IR generation mode
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, up to 12 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +125°C

RoHS-compliant package

  • 5mm × 5mm RKP QFN40
  • 4mm × 4mm RGE QFN24
  • 2.2mm × 2.6mm YBG WCSP

Wireless microcontroller

  • Optimized 48MHz Arm Cortex-M0+ processor
  • Up to 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode on CC2340R52
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth LE
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4
  • Zigbee®
  • Thread
  • Proprietary systems

High-performance radio

  • –102dBm sensitivity for Bluetooth® LE Coded 125kbps
  • –96.5dBm sensitivity for Bluetooth® LE 1Mbps
  • –98dBm sensitivity for IEEE 802.15.4 (2.4GHz)
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • Up to 26 I/O pads
    • Two IO pads SWD, muxed with GPIOs
    • Two IO pads LFXT, muxed with GPIOs
    • Up to 22 DIOs (analog or digital IOs)
  • Up to 3 × 16-bit and 1× 24-bit general-purpose timers with quadrature decode mode and IR generation mode
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, up to 12 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +125°C

RoHS-compliant package

  • 5mm × 5mm RKP QFN40
  • 4mm × 4mm RGE QFN24
  • 2.2mm × 2.6mm YBG WCSP

The CC2340R SimpleLink™ family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy, Zigbee, Thread, and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf), and Personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the earlier Bluetooth LE specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Zigbee® protocol stack support in the SimpleLink™ Low Power F3 software development kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100-percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.

The CC2340R SimpleLink™ family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy, Zigbee, Thread, and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf), and Personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the earlier Bluetooth LE specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Zigbee® protocol stack support in the SimpleLink™ Low Power F3 software development kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100-percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.
filter 尋找其它 低耗電 2.4GHz 產品
下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 6
重要文件 類型 標題 格式選項 日期
* Data sheet CC2340R SimpleLink™ Family of 2.4GHz Wireless MCUs datasheet (Rev. F) PDF | HTML 2025年 11月 7日
* Errata CC2340R2 SimpleLink™ Wireless MCU Device Revision B (Rev. A) PDF | HTML 2024年 8月 23日
* User guide CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 2024年 8月 7日
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025年 11月 18日
Product overview 無線 MCU 和 Zigbee ZBOSS 軟體讓高品質 RF 設計更加經濟 實惠 PDF | HTML 2024年 7月 18日
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022年 2月 25日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-EM-CC2340R5 — 適用於 SimpleLink™ Bluetooth® 5.3 低耗能 MCU 的 CC2340R5 LaunchPad™ 開發套件

此 LaunchPad 開發套件可藉由支援 Bluetooth 5 低耗能 (LE) 及 2.4-GHz 專利通訊協定的 SimpleLink Bluetooth 低耗能 MCU 加快開發速度。軟體支援由 SimpleLink 低功率 F3 軟體開發套件 (SDK) 提供。

TI.com 無法提供
開發板

DREAM-3P-CC2340 — DreamLNK CC2340 Bluetooth 模組

DL-CC2340-A 和 DL-CC2340-B Buetooth 低耗能模組都是以 TI SimpleLink CC2340R5 Bluetooth 低耗能裝置為基礎進行設計，該裝置使用 48MHz Cortex-M0+ 核心，最多可整合 512KB 快閃記憶體、36KB SRAM，以及多達 26 個通用 I/O 介面。此外，這些 Bluetooth 低耗能模組均配備內建 48-MHz 10-ppm 外部高速時脈及 32.768-kHz 外部低速時脈。

DL-CC2340-A Bluetooth 低耗能模組可針對 CC2340R5 晶片的所有 I/O 連接埠使用各種通用周邊設備，包括 (...)

從：Shenzhen DreamLNK Technology Co., Ltd.
造訪合作夥伴網站
子卡

BDE-3P-LE2340 — BDE LE2340 無線模組

BDE-3P-LE2340 modules are Bluetooth® 5.3 Low Energy wireless modules based on the CC2340R. With their low cost and exceptional RF and power consumption performance, these modules are ideal for applications that are cost-sensitive and require extended battery life. Multiple variants are available to (...)

從：BDE Technology Inc.
View Options
偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

使用指南: PDF
TI.com 無法提供
開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

TI.com 無法提供
開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

TI.com 無法提供
開發套件

BTV-3P-FMC — TI M0 居家健身器材自我供電控制與通訊解決方案

BTV-3P FMC 解決方案為居家健身器材提供控制與通訊功能，包括兩個功能模組：自我供電控制模組和藍牙通訊控制模組。
此解決方案專為居家健身器材（如划船機和健身腳踏車）所設計，可透過人體產生的動能驅動發電機，為整個系統供電，並控制運動阻力等級、測量運動指標參數，以及和手機/平板電腦/雲端通訊。

從：Beijing Touchvision Technology Co., Ltd
View Options
開發套件

TTC-3P-BLUETOOTH-MODULES — TTC 藍牙低耗能模組

HY-23400XP 整合 Bluetooth 低耗能應用所需的所有功能，這是一款適合低功耗智慧裝置與 loT 應用之高度整合的 Bluetooth 5.3 模組。

HY-234001P 也爲低功耗產品應用提供 10 個可編程 GPIO，並提供 PCB 天線選擇。

HY-23400XP 提供了所有 Bluetooth 低耗能功能：無線電、堆疊、設定檔和客戶應用程式的應用空間。此模組也提供了連接感測器的彈性硬體介面。

HY-23400XP 可以直接利用標準 3-V 鈕釦型單芯電池或一對 AAA 電池供電。在最低功率關機模式下，只消耗 0.15-µA，並在幾微秒內喚醒。

HY-234001P 傳輸距離爲 (...)

從：Shenzhen Shengrun Technology Co., Ltd.
View Options
軟體開發套件 (SDK)

DSR-3P-ZBOSS — ZBOSS 是獨立、可攜式、高性能的 Zigbee 軟體通訊協定堆疊

ZBOSS 是由 DSR Corporation 開發的 Zigbee PRO 軟體通訊協定堆疊。ZBOSS 可協助公司針對其 Zigbee 解決方案，克服互通性、移植、自訂、測試及最佳化的相關挑戰。Zigbee 是開放且互通的完整堆疊 IoT 技術，適用於包含平台、產品與支援的多元生態系統。ZBOSS Zigbee PRO 2023 支援所有角色、多種叢集資料庫，以及領導級的 Zigbee 智慧住宅生態系統。ZBOSS 具備跨平台支援、多工處理、固定記憶體用量、無作業系統配置，以及易於使用的 API。
從：DSR Corporation
View Options
軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

支援產品和硬體

支援產品和硬體
瀏覽 下載選項
快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支援產品和硬體

支援產品和硬體
開始使用
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
線上培訓

SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
支援產品和硬體

支援產品和硬體
瀏覽
軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

支援產品和硬體

支援產品和硬體
啟動 下載選項
支援軟體

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

支援產品和硬體

支援產品和硬體
下載選項
計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx and CC23xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
支援產品和硬體

支援產品和硬體
下載選項
設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

支援產品和硬體

支援產品和硬體
下載
Gerber 檔案

LP-EM-CC2340r5-RGE-4x4-IS24 Design Files (Rev. A)

SWRR189A.ZIP (6417 KB)
下載
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGE) 24 Ultra Librarian
VQFN (RKP) 40 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片