RM57L843
- High-Performance Microcontroller for Safety-Critical Applications
- Dual-Core Lockstep CPUs With ECC-Protected Caches
- ECC on Flash and RAM Interfaces
- Built-In Self-Test (BIST) for CPU, High-End Timers, and On-Chip RAMs
- Error Signaling Module (ESM) With Error Pin
- Voltage and Clock Monitoring
- ARM Cortex - R5F 32-Bit RISC CPU
- 1.66 DMIPS/MHz With 8-Stage Pipeline
- FPU With Single- and Double-Precision
- 16-Region Memory Protection Unit (MPU)
- 32KB of Instruction and 32KB of Data Caches With ECC
- Open Architecture With Third-Party Support
- Operating Conditions
- Up to 330-MHz CPU Clock
- Core Supply Voltage (VCC): 1.14 to 1.32 V
- I/O Supply Voltage (VCCIO): 3.0 to 3.6 V
- Integrated Memory
- 4MB of Program Flash With ECC
- 512KB of RAM With ECC
- 128KB of Data Flash for Emulated EEPROM With ECC
- 16-Bit External Memory Interface (EMIF)
- Hercules Common Platform Architecture
- Consistent Memory Map Across Family
- Real-Time Interrupt (RTI) Timer (OS Timer)
- Two 128-Channel Vectored Interrupt Modules (VIMs) With ECC
Protection on Vector Table
- VIM1 and VIM2 in Safety Lockstep Mode
- Two 2-Channel Cyclic Redundancy Checker (CRC) Modules
- Direct Memory Access (DMA) Controller
- 32 Channels and 48 Peripheral Requests
- ECC Protection for Control Packet RAM
- DMA Accesses Protected by Dedicated MPU
- Frequency-Modulated Phase-Locked Loop (FMPLL) With Built-In Slip Detector
- Separate Nonmodulating PLL
- IEEE 1149.1 JTAG, Boundary Scan, and ARM CoreSight Components
- Advanced JTAG Security Module (AJSM)
- Trace and Calibration Capabilities
- ETM, RTP, DMM, POM
- Multiple Communication Interfaces
- 10/100 Mbps Ethernet MAC (EMAC)
- IEEE 802.3 Compliant (3.3-V I/O Only)
- Supports MII, RMII, and MDIO
- Four CAN Controller (DCAN) Modules
- 64 Mailboxes, Each With ECC Protection
- Compliant to CAN Protocol Version 2.0B
- Two Inter-Integrated Circuit (I2C) Modules
- Five Multibuffered Serial Peripheral Interface (MibSPI) Modules
- MibSPI1: 256 Words With ECC Protection
- Other MibSPIs: 128 Words With ECC Protection
- Four UART (SCI) Interfaces, Two With Local Interconnect Network (LIN 2.1) Interface Support
- 10/100 Mbps Ethernet MAC (EMAC)
- Two Next Generation High-End Timer (N2HET) Modules
- 32 Programmable Channels Each
- 256-Word Instruction RAM With Parity
- Hardware Angle Generator for Each N2HET
- Dedicated High-End Timer Transfer Unit (HTU) for Each N2HET
- Two 12-Bit Multibuffered Analog-to-Digital Converter (MibADC) Modules
- MibADC1: 32 Channels Plus Control for up to 1024 Off-Chip Channels
- MibADC2: 25 Channels
- 16 Shared Channels
- 64 Result Buffers Each With Parity Protection
- Enhanced Timing Peripherals
- 7 Enhanced Pulse Width Modulator (ePWM) Modules
- 6 Enhanced Capture (eCAP) Modules
- 2 Enhanced Quadrature Encoder Pulse (eQEP) Modules
- Three On-Die Temperature Sensors
- Up to 145 Pins Available for General-Purpose I/O (GPIO)
- 16 Dedicated GPIO Pins With External Interrupt Capability
- Packages
- 337-Ball Grid Array (ZWT) [Green]
All trademarks are the property of their respective owners.
The RM57L843 device is part of the Hercules RM series of high-performance ARM® Cortex®-R-based MCUs. Comprehensive documentation, tools, and software are available to assist in the development of IEC 61508 functional safety applications. Start evaluating today with the Hercules RM57x LaunchPad Development Kit. The RM57L843 device has on-chip diagnostic features including: dual CPUs in lockstep, Built-In Self-Test (BIST) logic for CPU, the N2HET coprocessors, and for on-chip SRAMs; ECC protection on the L1 caches, L2 flash, and SRAM memories. The device also supports ECC or parity protection on peripheral memories and loopback capability on peripheral I/Os.
The RM57L843 device integrates two ARM Cortex-R5F floating-point CPUs, operating in lockstep, which offer an efficient 1.66 DMIPS/MHz, and can run up to 330 MHz providing up to 547 DMIPS. The device supports the little-endian [LE] format.
The RM57L843 device has 4MB of integrated flash and 512KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory, implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (the same level as the I/O supply) for all read, program, and erase operations. The SRAM supports read and write accesses in byte, halfword, and word modes.
The RM57L843 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors with up to 64 total I/O terminals.
The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information or drive actuators with complex and accurate time pulses. The High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.
The Enhanced Pulse Width Modulator (ePWM) module can generate complex pulse width waveforms with minimal CPU overhead or intervention. The ePWM is easy to use and supports both high-side and low-side PWM and deadband generation. With integrated trip zone protection and synchronization with the on-chip MibADC, the ePWM is ideal for digital motor control applications.
The Enhanced Capture (eCAP) module is essential in systems where the accurately timed capture of external events is important. The eCAP can also be used to monitor the ePWM outputs or for simple PWM generation when not needed for capture applications.
The Enhanced Quadrature Encoder Pulse (eQEP) module directly interfaces with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating machine as used in high-performance motion and position-control systems.
The device has two 12-bit-resolution MibADCs with 41 total channels and 64 words of parity-protected buffer RAM. The MibADC channels can be converted individually or by group for special conversion sequences. Sixteen channels are shared between the two MibADCs. Each MibADC supports three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired. One of the channels in MibADC1 and two of the channels in MibADC2 can be used to convert temperature measurements from the three on-chip temperature sensors.
The device has multiple communication interfaces: Five MibSPIs; four UART (SCI) interfaces, two with LIN support; four CANs; two I2C modules; and one Ethernet controller. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The LIN supports the Local Interconnect standard (LIN 2.1) and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for applications operating in noisy and harsh environments (for example, automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The Ethernet module supports MII, RMII, and Management Data I/O (MDIO) interfaces. The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C module supports speeds of 100 and 400 kbps.
The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module multiplies the external frequency reference to a higher frequency for internal use. The Global Clock Module (GCM) manages the mapping between the available clock sources and the internal device clock domains.
The device also has two External Clock Prescaler (ECP) modules. When enabled, the ECPs output a continuous external clock on the ECLK1 and ECLK2 balls. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.
The Direct Memory Access (DMA) controller has 32 channels, 48 peripheral requests, and ECC protection on its memory. An MPU is built into the DMA to protect memory against erroneous transfers.
The Error Signaling Module (ESM) monitors on-chip device errors and determines whether an interrupt or external Error pin/ball (nERROR) is triggered when a fault is detected. The nERROR signal can be monitored externally as an indicator of a fault condition in the microcontroller.
The External Memory Interface (EMIF) provides a memory extension to asynchronous and synchronous memories or other slave devices.
A Parameter Overlay Module (POM) is included to enhance the debugging capabilities of application code. The POM can reroute flash accesses to internal RAM or to the EMIF, thus avoiding the reprogramming steps necessary for parameter updates in flash. This capability is particularly helpful during real-time system calibration cycles.
Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built-in ARM Cortex-R5F CoreSight debug features, the Embedded Cross Trigger (ECT) supports the interaction and synchronization of multiple triggering events within the SoC. An External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or minimal impact on the program execution time of the application code.
With integrated safety features and a wide choice of communication and control peripherals, the RM57L843 device is an ideal solution for high-performance real-time control applications with safety-critical
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Hercules RM57L843 經 TÜV SÜD 認證,可實現 IEC 61508 SIL 3,協助簡化功能安全應用的開發。立即下載認證。
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LAUNCHXL2-RM57L — Hercules RM57Lx LaunchPad 開發套件
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HET_IDE — 高階計時器 (HET)
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SAFETI_CQKIT — 安全編譯器資格套件
開發安全編譯器資格認證套件是為了協助客戶對 TI ARM、C6000、C7000 或 C2000/CLA C/C++ 編譯器的使用進行認證,以確保符合功能安全標準,如 IEC 61508 和 ISO 26262。
安全編譯器資格認證套件:
- 對 TI 客戶免費
- 不需要使用者進行資格測試
- 支援編譯器覆蓋範圍分析*
- * 覆蓋範圍資料收集的說明可從每個 QKIT 下載頁面下載。
- 不包括 Validas 諮詢
如需存取安全編譯器資格認證套件,請按一下上面其中一個索取按鈕。
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HERCULES_SAFETY_MCU_DEMOS — Hercules Software Kit (v4.0.0)
NHET-ASSEMBLER — TMS570 NHET Assembler Software (v2.0.1)
TI's Enhanced High-End Timer (NHET) module provides sophisticated timing functions for real-time control applications.
The NHET Assembler translates programs written in the NHET assembly language into multiple output formats for use in code-generation tools such as TI's Code Composer Studio.
NOWECC — TMS570 nowECC v2.22.00
FMZPLL_CALCULATOR — FMzPLL 配置工具
- OSCIN speed
- multiplier setting
- divider settings
- frequency modulation settings
- PLL/OSC fail options
TIDM-HAHSCPTO — 高可用性高速計數器 (HSC) 和脈衝串輸出 (PTO) 參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| NFBGA (ZWT) | 337 | Ultra Librarian |
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