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CC2755R10

現行

具有 EdgeAI 支援，安全性， 1µA 待機電流的 SimpleLink™ Arm® Cortex® -M33 無線 MCU

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CC2755R10

現行
產品規格表 立即訂購

產品詳細資料

CPU core Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, TRNG Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
CPU core Arm® Cortex®-M33 Technology 2.4 GHz, 2.4 GHz proprietary, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee Flash memory (kByte) 1024 RAM (kByte) 162 Peripherals 1 Watchdog timer, 1 comparator, 2 SPI, 2 UART, 4 GP Timers, I2C, I2S, Real-time clock (RTC) Features Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee Coordinator, Zigbee network processor Number of GPIOs 23 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure firmware & software update, Secure storage Operating system FreeRTOS, Zephyr RTOS Type Wireless MCU Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, TRNG Hardware accelerators CDE NPU Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RHA) 40 36 mm² 6 x 6
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Matter
  • Zigbee 3.0 Certified
  • Thread
  • Proprietary systems
  • Multi-protocol
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm
    • IEEE 802.15.4 (2.4GHz): –103dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • 3.5mm × 3.4mm WCSP (Preview)

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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重要文件 類型 標題 格式選項 日期
* Data sheet CC2755x10 SimpleLink Family of 2.4GHz High Performance Wireless MCUs datasheet (Rev. D) PDF | HTML 2025年 12月 12日
* Errata Errata CC2755x10 SimpleLink™ Wireless MCU Device Revision F PDF | HTML 2025年 7月 11日
* User guide CC27xx Technical Reference Manual (Rev. A) PDF | HTML 2025年 5月 19日
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 2026年 2月 4日
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025年 11月 18日
Technical article 以低功率無線 MCU 解決關鍵無線連線網路安全挑戰 (Rev. A) PDF | HTML 2024年 12月 19日
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 2024年 2月 27日
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022年 2月 25日

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開發板

LP-EM-CC2745R10-Q1 — 適用 SimpleLink™ 2.4 GHz 無線 MCU 的 CC2745R10-Q1 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件可加速開發具備整合式功率放大器與無線電支援以進行 2.4GHz 操作的裝置。LaunchPad 配備符合 AEC-Q100 規範的無線微控制器 (MCU)，可支援汽車應用的 Bluetooth® 低功耗（5.3 與即將推出的版本）。這是一款分離式 LaunchPad™ 開發套件，因此不包含 XDS 偵錯器。建議的偵錯器爲 LP-XDS110 或 LP-XDS110ET。

使用指南: PDF | HTML
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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

使用指南: PDF
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開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-ZEPHYR-SDK — Zephyr® Platform support for the SimpleLink™ Low Power family of devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

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EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers and radar sensors. Whether developing a proof of concept using a model from the TI Model Zoo or leveraging your own model, Edge AI Studio provides the (...)

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SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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外掛程式

SIMPLELINK-SDK-EDGEAI-PLUGIN — Edge AI Plugin and application support for SimpleLink™ family of devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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支援軟體

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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