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CC2652RB

現行

具有無晶體震盪 BAW 諧振器的 SimpleLink™ 32 位元 ARM Cortex-M4F 多協定 2.4 GHz 無線 MCU

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CC2652RB

現行
產品規格表 立即訂購

產品詳細資料

CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Cryptographic accelerators RNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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CC2652P 現行 具有整合式功率放大器的 SimpleLink™ ARM Cortex-M4F 多協定 2.4 GHz 無線 MCU This product offers an integrated power amplifier but does not offer BAW resonator solution.
CC2652R 現行 具有 352kB 快閃記憶體的 SimpleLink™ 32 位元 Arm Cortex-M4F 多協定 2.4 GHz 無線 MCU This product does not include the BAW resonator and requires an external 48MHz crystal.

技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. D) PDF | HTML 2021年 2月 16日
* Errata CC2652RB SimpleLink™ Multiprotocol 2.4-GHz MCU Device Revision E Silicon Errata (Rev. A) 2019年 12月 4日
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 2024年 6月 27日
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025年 11月 18日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024年 5月 2日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022年 2月 25日
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021年 12月 20日
More literature Bluetooth® Low Energy connectivity solutions for automotive applications 2021年 12月 15日
Application note Hardware Migration From CC26x0 to CC26x2R (Rev. D) 2021年 8月 23日
Technical article How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic PDF | HTML 2021年 7月 23日
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 2021年 5月 13日
White paper Dynamic Multi-Protocol (DMM) Performance 2021年 4月 21日
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 2021年 4月 12日
Technical article Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy PDF | HTML 2020年 8月 20日
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020年 7月 17日
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 2020年 6月 5日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 2020年 3月 31日
Application note Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 2020年 2月 5日
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020年 1月 28日
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 2020年 1月 27日
Application note Minimizing Frequency Error Due to Soldering Process on CC2652RB Crystal-Less MCU 2020年 1月 15日
Technical article Testing TI BAW resonator technology in mechanical shock and vibration environments PDF | HTML 2020年 1月 9日
Technical article Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin PDF | HTML 2020年 1月 2日
White paper Exploring IoT wireless connectivity in mechanical shock and vibration environme 2019年 11月 7日
Technical article VIDEO: TI Bulk Acoustic Wave (BAW) resonator technology with Bluetooth 5 PDF | HTML 2019年 9月 26日
Application note Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 2019年 9月 23日
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 2019年 6月 6日
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 2019年 5月 29日
Application note Debugging Communication Range (Rev. A) PDF | HTML 2019年 5月 23日
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 2019年 4月 15日
Technical article Top 5 things to know about TI BAW resonator technology PDF | HTML 2019年 2月 27日
Application note Getting Started With CC2652RB for Crystal-less BAW Operation 2019年 2月 20日
White paper SimpleLink Crystal-Less Wireless MCU based on TI BAW technology 2019年 2月 18日
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 2019年 1月 10日
Application note RF PCB Simulation Cookbook 2019年 1月 9日
User guide LP-CC2652RB quick start guide 2018年 12月 21日
Application note Low-Power ADC Solution for CC13x2 and CC26x2 2018年 3月 2日
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 2018年 2月 27日
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 2018年 2月 27日
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017年 3月 5日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日

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軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK — TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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ARM-CGT — Arm® code generation tools -- compiler

The TI Arm® code generation (compiler) tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the open-source Clang compiler and its supporting LLVM (...)

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ARM-CGT-CLANG — Arm® code generation tools - compiler

The TI Arm® code generation (compiler) tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the open-source Clang compiler and its supporting LLVM (...)

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CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

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SENSOR-CONTROLLER-STUDIO — Sensor Controller Studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

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SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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線上培訓

SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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軟體程式設計工具

FLASH-PROGRAMMER-2 — SmartRF Flash Programmer v2

SmartRF Flash Programmer 2 can be used to program the flash memory in Texas Instruments ARM based low-power RF wireless MCUs over the debug and serial interfaces. Check the list of supported products for compatibility. Uniflash can also be used to program any SimpleLink product.

SmartRF Flash (...)

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軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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RF-RANGE-ESTIMATOR — RF Range Estimator

This tool is used to calculate a range estimate for indoor and outdoor RF links using TI wireless devices. The outdoor calculation is based upon Line-of-Sight (LOS). For the indoor estimation, construction materials can be selected that are between the Tx and Rx unit. The greater the attenuation (...)
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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
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PACKET-SNIFFER-2 — SmartRF Packet Sniffer 2

The SmartRF Packet Sniffer is a PC software application that can display and store radio packets captured by a listening RF device. The capture device is connected to the PC via USB. Various RF protocols are supported. The Packet Sniffer filters and decodes packets and displays them in a convenient (...)

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SMARTRF-STUDIO-7 — SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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計算工具

ZIGBEE-POWER-CALC — Z-Stack™ 功率計算機工具

此工具讓 SimpleLink™ Z-Stack™ 軟體使用者可在 Zigbee 應用中分析休眠終端裝置的系統電源設定檔。此計算機可讓使用者評估系統電池的潛在使用壽命，並透過配置系統設定、堆疊參數、有效載荷設定檔和使用參數來最佳化電池壽命，從而透過模擬系統設計選擇來實現預期的性能目標。
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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — SimpleLink™ CC2xxx 裝置的硬體設計審核

SimpleLink 硬體設計審核流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。一個簡單的三步驟流程用於請求審查，以及相關技術文件和資源的連結，可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中，然後才能要求 2.4 GHz 硬體設計審查。

請確實備妥下列必要文件，隨硬體設計審查申請表一起傳送：

  • 確認產品頁上提供的所有硬體文件均已經過審查，例如產品規格表、設計指南、使用指南和其他硬體資源
  • 電路圖的可攜式文件格式 (PDF) 版本可供檢閱
  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
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Gerber 檔案

SimpleLink Crystal-less BAW CC2652RB multiprotocol 2.4GHz wireless MCU dev kit (Rev. A)

SWRC357A.ZIP (8491 KB)
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配置圖

SimpleLink™ Wi-Fi® CC323x + BLE CC26x2 Coexistence Hardware Design Files

SWRR174.ZIP (21816 KB)
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VQFN (RGZ) 48 Ultra Librarian
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