CC1311P3

現行

具有 352KB 快閃記憶體及整合式 +20dBm 功率放大器的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 無線 MCU

產品詳細資料

Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 26 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 26 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63mA active mode, CoreMark
    • 55µA/MHz running CoreMark
    • 0.7µA standby mode, RTC, 32KB RAM
    • 0.1µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4mA RX at 868MHz
    • 24.9mA TX at +14dBm at 868MHz
    • 65mA TX at +20dBm at 915MHz

Wireless protocol support

High-performance radio

  • -121dBm for 2.5kbps long-range mode
  • -120dBm at 4.8kbps narrowband mode, 433MHz
  • -118dBm at 9.6kbps narrowband mode, 868MHz
  • -110dBm at 50kbps, 802.15.4, 868MHz
  • Output power up to +20dBm with temperature compensation
  • Down to 4kHz receiver filter bandwidth

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40 to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63mA active mode, CoreMark
    • 55µA/MHz running CoreMark
    • 0.7µA standby mode, RTC, 32KB RAM
    • 0.1µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4mA RX at 868MHz
    • 24.9mA TX at +14dBm at 868MHz
    • 65mA TX at +20dBm at 915MHz

Wireless protocol support

High-performance radio

  • -121dBm for 2.5kbps long-range mode
  • -120dBm at 4.8kbps narrowband mode, 433MHz
  • -118dBm at 9.6kbps narrowband mode, 868MHz
  • -110dBm at 50kbps, 802.15.4, 868MHz
  • Output power up to +20dBm with temperature compensation
  • Down to 4kHz receiver filter bandwidth

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40 to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1311P3 device is a multiprotocol Sub-1GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The CC1311P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics, and medical applications.

The CC1311P3 has a software-defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143MHz to 176MHz, 287MHz to 351MHz, 359MHz to 527-MHz, 861MHz to 1054MHz, and 1076MHz to 1315MHz frequency bands. The CC1311P3 has an efficient built-in PA that supports +14dBm TX at 24.9mA and +20dBm TX at 65mA. In RX, it has -121dBm sensitivity and 88dB blocking ±10MHz in SimpleLink™ long-range mode with 2.5kbps data rate.

The CC1311P3 has a low sleep current of 0.7µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1GHz MCUs, and host MCUs. CC1311P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool support migration between devices in the portfolio. A comprehensive number of software stacks, application examples, and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™CC1311P3 device is a multiprotocol Sub-1GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The CC1311P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics, and medical applications.

The CC1311P3 has a software-defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143MHz to 176MHz, 287MHz to 351MHz, 359MHz to 527-MHz, 861MHz to 1054MHz, and 1076MHz to 1315MHz frequency bands. The CC1311P3 has an efficient built-in PA that supports +14dBm TX at 24.9mA and +20dBm TX at 65mA. In RX, it has -121dBm sensitivity and 88dB blocking ±10MHz in SimpleLink™ long-range mode with 2.5kbps data rate.

The CC1311P3 has a low sleep current of 0.7µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1GHz MCUs, and host MCUs. CC1311P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool support migration between devices in the portfolio. A comprehensive number of software stacks, application examples, and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳且具備與所比較裝置相同的功能
CC1352P 現行 SimpleLink™ ARM Cortex-M4F 多協定低於 1 GHz 和 2.4 GHz 無線 MCU 整合式功率放大器 More RAM, added sensor controller and added dual band / Bluetooth Low Energy functionality

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 11
重要文件 類型 標題 格式選項 日期
* Data sheet CC1311P3 SimpleLink™ High-Performance Sub-1GHz Wireless MCU with Integrated Power Amplifier datasheet (Rev. A) PDF | HTML 2025年 4月 1日
* Errata CC1311P3 Silicon Errata PDF | HTML 2022年 2月 25日
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 2022年 5月 11日
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024年 8月 6日
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2024年 5月 2日
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 2024年 4月 9日
Application note TI 15.4-Stack Software PDF | HTML 2023年 10月 17日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 2022年 2月 7日
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 2021年 6月 4日
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017年 2月 28日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

子卡

BDE-3P-SUB1GHZ — BDE Sub-1Ghz 模組

VDE Technology Inc. 是 TI 認證的第三方模組供應商。BDE 的模組以 TI 的 CC1XXX Sub-1Ghz 無線連線產品為基礎,讓客戶可縮短開發週期、減少設計不確定性、降低產品成本,並能有效推出具競爭力的產品。BDE 專精於提供超低功耗無線通訊技術,例如 Amazon Sidewalk、Wi-SUN、mioty 和無線 M-Bus 給全球的 OEM、系統整合商、裝置製造商和解決方案供應商。

偵錯探測器

LB-3P-TRACE32-WIRELESS — 適用於無線連線的 Lauterbach TRACE32® 偵錯系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件,可讓開發人員分析、最佳化及認證 TI 許多無線連線晶片。全球知名的嵌入式系統偵錯解決方案是完美的解決方案,適用於從早期的矽前 (pre-silicon) 開發,到產品認證和現場故障排除等所有開發階段:   完整的晶片內建斷點支援;執行階段記憶體存取;快閃記憶體編程和基準計數器。所有內容都是可編寫指令碼,使開發人員能夠一再地重複相同的測試順序。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能,以及可隨需求變化而調整和成長的系統。經認證的工具資格認證支援套件 (TQSK) 提供便利的全方位方式,鑒定 (...)

開發套件

LP-CC1311P3 — 適用 SimpleLink™ sub-1-GHz 無線 MCU 的 CC1311P3 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件可用來加快 SimpleLink™ sub-1-GHz 無線 MCU 的開發,並支援 TI 15.4 堆疊與專利 RF 通訊協定。CC13XX-CC26XX 軟體開發套件 (SDK) 提供軟體支援。

TI.com 無法提供
開發套件

KNGRY-3P-MICROPHONE — 適用於 CC1311 和 CC1312 的廣州晶銳信息技術有限公司無線數位麥克風

WA12XX 系列為 UHF 高性能數位無線麥克風系統、整合無線麥克風、雷射指標、PPT 翻頁器及其它功能。它可以自動搜尋環境中的乾淨頻道以供使用、快速鎖定頻道,並消除干擾。同時,還配有 IR 頻率配對模式,可承受嚴苛的使用環境。此系列產品採用 UHF 頻帶運作,完全避免 Wifi /2.4G/700MHz/5.8G 干擾。

軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

支援產品和硬體

支援產品和硬體

瀏覽 下載選項
軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

支援產品和硬體

支援產品和硬體

下載選項
快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支援產品和硬體

支援產品和硬體

IDE、配置、編譯器或偵錯程式

ARM-CGT — Arm® 程式碼產生工具 - 編譯器

TI Arm® 程式碼產生 (編譯器) 工具支援基於 TI Arm 的平台開發應用程式,尤其是採用 TI Arm Cortex-M 和 Cortex-R 系列裝置的平台。

目前的工具 ARM-CGT-CLANG 源自於開源 Clang 編譯器及其支援的 LLVM 基礎架構。舊版專有 (ARM-CGT) 工具處於維護狀態,並將視需要提供錯誤修復。請參閱所使用的軟體開發套件 (SDK) 文件,以確認支援哪些編譯器。一般而言,基於 Clang 的編譯器用於新產品。 

Code Composer Studio™ 是適用於 TI 嵌入式裝置的整合式開發環境 (IDE)。開始開發時,建議先從下載 Code (...)

使用指南: PDF | HTML
IDE、配置、編譯器或偵錯程式

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

支援產品和硬體

支援產品和硬體

啟動 下載選項
軟體程式設計工具

UNIFLASH — UniFlash 快閃記憶體編程工具

UniFlash 是一套軟體工具,可在 TI 微控制器和無線連線裝置上編程晶片快閃記憶體,也適用 TI 處理器的板載快閃記憶體。UniFlash 提供圖形和命令列介面。

UniFlash 可從 TI 開發人員區上的雲端執行,或在下載後於 Windows®、Linux® 和 macOS® 電腦中使用。

支援的裝置:CC13xx、CC23xx、CC25xx、CC26xx、CC27xx、CC32xx、C2000™ 微控制器、MSP430™ 微控制器、MSP432™ 微控制器、MSPM0、TM4C、Hercules™ (...)

計算工具

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

支援產品和硬體

支援產品和硬體

下載選項
設計工具

SUB1GHZ-HW-DESIGN-REVIEW Hardware design reviews for SimpleLink™ CC1xxx devices

To get started with the SimpleLink™ Sub-1GHz hardware design review process:

  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC1xxx product page links below).
  • Step 2: (...)
支援產品和硬體

支援產品和硬體

封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGZ) 48 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片