MSP430FR2633

現行

具有 16 個觸控 IO (64 個感測器)、16KB FRAM、4KB SRAM、19 個 IO、10 位元 ADC 的電容式觸控 MCU

產品詳細資料

CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 16 RAM (kByte) 4 ADC type 10-bit SAR Features Advanced sensing, CapTIvate Touch I/O, Real-time clock UART 2 Number of ADC channels 8 SPI 2 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 16 Number of GPIOs 19 Number of I2Cs 1 Security Secure debug
CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 16 RAM (kByte) 4 ADC type 10-bit SAR Features Advanced sensing, CapTIvate Touch I/O, Real-time clock UART 2 Number of ADC channels 8 SPI 2 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 16 Number of GPIOs 19 Number of I2Cs 1 Security Secure debug
DSBGA (YQW) 24 4.84 mm² 2.2 x 2.2 TSSOP (DA) 32 89.1 mm² 11 x 8.1 VQFN (RHB) 32 25 mm² 5 x 5
  • CapTIvate™ technology – capacitive touch
    • Performance
      • Fast electrode scanning with four simultaneous scans
      • Support for high-resolution sliders with up to 1024 points
      • Proximity sensing
    • Reliability
      • Increased immunity to power line, RF, and other environmental noise
      • Built-in spread spectrum, automatic tuning, noise filtering, and debouncing algorithms
      • Enables reliable touch solutions with 10-V RMS common-mode noise, 4-kV electrical fast transients, and 15-kV electrostatic discharge, allowing for IEC‑61000-4-6, IEC‑61000-4-4, and IEC‑61000-4-2 compliance
      • Reduced RF emissions to simplify electrical designs
      • Support for metal touch and water rejection designs
    • Flexibility
    • Low power
      • <5 µA wake-on-touch with four sensors
      • Wake-on-touch state machine allows electrode scanning while CPU is asleep
      • Hardware acceleration for environmental compensation, filtering, and threshold detection
    • Ease of use
      • CapTIvate Design Center PC GUI lets engineers design and tune capacitive buttons in real time without having to write code
      • CapTIvate software library in ROM provides ample FRAM for customer application
  • Embedded microcontroller
    • 16-bit RISC architecture
    • Clock supports frequencies up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: 126 µA/MHz (typical)
    • Standby: <5 µA wake-on-touch with four sensors
    • LPM3.5 real-time clock (RTC) counter with 32768-Hz crystal: 730 nA (typical)
    • Shutdown (LPM4.5): 16 nA (typical)
  • High-performance analog
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
  • Enhanced serial communications
    • Two enhanced universal serial communication interfaces (eUSCI_A) support UART, IrDA, and SPI
    • One eUSCI (eUSCI_B) supports SPI and I2C
  • Intelligent digital peripherals
    • Four 16-bit timers
      • Two timers with three capture/compare registers each (Timer_A3)
      • Two timers with two capture/compare registers each (Timer_A2)
    • One 16-bit timer associated with CapTIvate technology
    • One 16-bit counter-only RTC
    • 16-bit cyclic redundancy check (CRC)
  • Low-power ferroelectric RAM (FRAM)
    • Up to 15.5KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
    • High FRAM-to-SRAM ratio, up to 4:1
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • Total of 19 I/Os on TSSOP-32 package
    • 16 interrupt pins (P1 and P2) can wake MCU from low-power modes
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2633: 15KB of program FRAM, 512 bytes of information FRAM, 4KB of RAM, up to 16 self-capacitive or 64 mutual-capacitive sensors
    • MSP430FR2533: 15KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 16 self-capacitive or 24 mutual-capacitive sensors
    • MSP430FR2632: 8KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 8 self-capacitive or 16 mutual-capacitive sensors
    • MSP430FR2532: 8KB of program FRAM, 512 bytes of information FRAM, 1KB of RAM, up to 8 self-capacitive or 8 mutual-capacitive sensors
  • Package options
    • 32 pin: VQFN (RHB)
    • 32 pin: TSSOP (DA)
    • 24 pin: VQFN (RGE)
    • 24-pin: DSBGA (YQW)
  • CapTIvate™ technology – capacitive touch
    • Performance
      • Fast electrode scanning with four simultaneous scans
      • Support for high-resolution sliders with up to 1024 points
      • Proximity sensing
    • Reliability
      • Increased immunity to power line, RF, and other environmental noise
      • Built-in spread spectrum, automatic tuning, noise filtering, and debouncing algorithms
      • Enables reliable touch solutions with 10-V RMS common-mode noise, 4-kV electrical fast transients, and 15-kV electrostatic discharge, allowing for IEC‑61000-4-6, IEC‑61000-4-4, and IEC‑61000-4-2 compliance
      • Reduced RF emissions to simplify electrical designs
      • Support for metal touch and water rejection designs
    • Flexibility
    • Low power
      • <5 µA wake-on-touch with four sensors
      • Wake-on-touch state machine allows electrode scanning while CPU is asleep
      • Hardware acceleration for environmental compensation, filtering, and threshold detection
    • Ease of use
      • CapTIvate Design Center PC GUI lets engineers design and tune capacitive buttons in real time without having to write code
      • CapTIvate software library in ROM provides ample FRAM for customer application
  • Embedded microcontroller
    • 16-bit RISC architecture
    • Clock supports frequencies up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: 126 µA/MHz (typical)
    • Standby: <5 µA wake-on-touch with four sensors
    • LPM3.5 real-time clock (RTC) counter with 32768-Hz crystal: 730 nA (typical)
    • Shutdown (LPM4.5): 16 nA (typical)
  • High-performance analog
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
  • Enhanced serial communications
    • Two enhanced universal serial communication interfaces (eUSCI_A) support UART, IrDA, and SPI
    • One eUSCI (eUSCI_B) supports SPI and I2C
  • Intelligent digital peripherals
    • Four 16-bit timers
      • Two timers with three capture/compare registers each (Timer_A3)
      • Two timers with two capture/compare registers each (Timer_A2)
    • One 16-bit timer associated with CapTIvate technology
    • One 16-bit counter-only RTC
    • 16-bit cyclic redundancy check (CRC)
  • Low-power ferroelectric RAM (FRAM)
    • Up to 15.5KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
    • High FRAM-to-SRAM ratio, up to 4:1
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • Total of 19 I/Os on TSSOP-32 package
    • 16 interrupt pins (P1 and P2) can wake MCU from low-power modes
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2633: 15KB of program FRAM, 512 bytes of information FRAM, 4KB of RAM, up to 16 self-capacitive or 64 mutual-capacitive sensors
    • MSP430FR2533: 15KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 16 self-capacitive or 24 mutual-capacitive sensors
    • MSP430FR2632: 8KB of program FRAM, 512 bytes of information FRAM, 2KB of RAM, up to 8 self-capacitive or 16 mutual-capacitive sensors
    • MSP430FR2532: 8KB of program FRAM, 512 bytes of information FRAM, 1KB of RAM, up to 8 self-capacitive or 8 mutual-capacitive sensors
  • Package options
    • 32 pin: VQFN (RHB)
    • 32 pin: TSSOP (DA)
    • 24 pin: VQFN (RGE)
    • 24-pin: DSBGA (YQW)

The MSP430FR263x and MSP430FR253x are ultra-low-power MSP430™ microcontrollers for capacitive touch sensing that feature CapTIvate™ touch technology for buttons, sliders, wheels, and proximity applications. MSP430 MCUs with CapTIvate technology provide the most integrated and autonomous capacitive-touch solution in the market with high reliability and noise immunity at the lowest power. TI’s capacitive touch technology supports concurrent self-capacitance and mutual-capacitance electrodes on the same design for maximum flexibility. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

TI capacitive touch sensing MSP430 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-CAPT-FR2633 CapTIvate technology development kit. TI also provides free software including the CapTIvate Design Center, where engineers can quickly develop applications with an easy-to-use GUI and MSP430Ware™ software and comprehensive documentation with the CapTIvate Technology Guide.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

The MSP430FR263x and MSP430FR253x are ultra-low-power MSP430™ microcontrollers for capacitive touch sensing that feature CapTIvate™ touch technology for buttons, sliders, wheels, and proximity applications. MSP430 MCUs with CapTIvate technology provide the most integrated and autonomous capacitive-touch solution in the market with high reliability and noise immunity at the lowest power. TI’s capacitive touch technology supports concurrent self-capacitance and mutual-capacitance electrodes on the same design for maximum flexibility. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.

TI capacitive touch sensing MSP430 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-CAPT-FR2633 CapTIvate technology development kit. TI also provides free software including the CapTIvate Design Center, where engineers can quickly develop applications with an easy-to-use GUI and MSP430Ware™ software and comprehensive documentation with the CapTIvate Technology Guide.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet MSP430FR263x, MSP430FR253x Capacitive Touch Sensing Mixed-Signal Microcontrollers datasheet (Rev. E) PDF | HTML 2019年 12月 9日
* Errata MSP430FR2633 Device Erratasheet (Rev. S) PDF | HTML 2021年 5月 27日
* User guide MSP430FR4xx and MSP430FR2xx Family User's Guide (Rev. I) 2019年 3月 13日
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. B) PDF | HTML 2025年 6月 2日
User guide MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB) PDF | HTML 2022年 9月 22日
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 2021年 8月 23日
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 2021年 8月 12日
Application note Designing With the MSP430FR4xx and MSP430FR2xx ADC (Rev. A) PDF | HTML 2021年 8月 2日
Application note Low-Power Battery Voltage Measurement With MSP430FR MCU On-Chip VREF and ADC (Rev. B) PDF | HTML 2021年 8月 2日
Application note Migrating from MSP430 F2xx and G2xx families to MSP430 FR4xx and FR2xx family (Rev. G) PDF | HTML 2021年 8月 2日
Application note Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B) PDF | HTML 2021年 8月 2日
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 2021年 7月 14日
User guide CapTIvate™ Touch MCUs Getting Started Guide (Rev. A) PDF | HTML 2021年 7月 12日
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 2021年 5月 13日
More literature Designing in emerging applications: Ultrasonic sensing and capacitive touch 2020年 12月 15日
Application note MSP430FR2xx and MSP430FR4xx DCO+FLL Application Guide 2020年 12月 7日
White paper Capacitive Sensing Technology, Products, and Applications 2020年 5月 19日
Technical article The capacitive touch trend is rising rapidly. Can you keep up? PDF | HTML 2020年 5月 15日
Application note Automating Capacitive Touch Sensor PCB Design Using OpenSCAD Scripts (Rev. B) PDF | HTML 2020年 2月 26日
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 2019年 12月 13日
White paper Enabling Noise Tolerant Capacitive Touch HMIs With MSP CapTIvate™ Technology (Rev. B) 2019年 11月 12日
Application note Capacitive Touch Design Flow for MSP430™ MCUs With CapTIvate™ Technology (Rev. B) PDF | HTML 2019年 8月 14日
Technical article Capacitive touch & host controller functionality all in one package can reduce cos PDF | HTML 2019年 4月 4日
Application note Sensitivity, SNR, and design margin in capacitive touch applications (Rev. A) PDF | HTML 2019年 3月 25日
Application note Capacitive Touch Gesture Software and Tuning PDF | HTML 2018年 12月 13日
Technical article With capacitive touch, liquid is no longer kryptonite to keypads PDF | HTML 2018年 11月 27日
White paper Capacitive touch building security system equipment using MSP430™ MCUs (Rev. B) 2018年 11月 8日
White paper Simplify smart speaker human machine interface with capacitive-touch technology 2018年 2月 15日
Technical article Cooktops with capacitive touch technology make quick work in the kitchen for the h PDF | HTML 2017年 12月 7日
Technical article Modern, sleek and durable touch on metal HMIs PDF | HTML 2017年 11月 16日
Application note Capacitive Touch Through Metal Using MSP430™ MCUs With CapTIvate™ Technology (Rev. A) 2017年 10月 31日
Application note Designing Thermostats With CC3220 SimpleLink Single-Chip Wi-Fi MCU SoC 2017年 10月 30日
Technical article The power of capacitive touch that you can’t see PDF | HTML 2017年 10月 26日
Technical article Step 7 to build a smart thermostat using an MCU: how to pick the right MCU PDF | HTML 2017年 10月 11日
White paper SimpleLink™ MSP432™ MCU for electronic lock and intrusion HMI keypad 2017年 9月 18日
Technical article Embrace IoT living through the gateway of electronic door locks PDF | HTML 2017年 9月 14日
White paper Take your HMI design to the next level with transparent capacitive-touch technol 2017年 9月 14日
Technical article Making a smarter door lock with the SimpleLink™ MSP432™ microcontroller PDF | HTML 2017年 5月 31日
White paper Capacitive Touch and MSP Microcontrollers (Rev. A) 2017年 4月 27日
Technical article Sense, measure and more with MSP430™ MCUs at embedded world 2017 PDF | HTML 2017年 3月 14日
Technical article Getting a grip on handheld devices is easier with capacitive touch sensing PDF | HTML 2017年 2月 28日
Design guide Touch Remote Control Reference Design With CapTIvate Technology (Rev. A) 2016年 12月 6日
Technical article Rain on this touch panel parade won’t matter PDF | HTML 2016年 11月 28日
Technical article Trends in building automation: connected sensors for user comfort PDF | HTML 2016年 9月 2日
Technical article Engineering magic: Touch through thick glass with LEDs and LCD PDF | HTML 2016年 8月 18日
Technical article Touch it. Talk to it. Remote control solutions that will change how you interact w PDF | HTML 2016年 6月 29日
Technical article Engineers do better than magicians: HMI touch through a thick glass PDF | HTML 2016年 4月 26日
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 2016年 4月 1日
User guide Noise Tolerant Capacitive Touch Human Machine Interfaces Design Guide 2016年 3月 9日
User guide Getting started with MSP MCUs featuring CapTIvate™ technology 2016年 2月 18日
Technical article Don’t compromise your capacitive touch design PDF | HTML 2015年 12月 8日
Application note MSP Code Protection Features PDF | HTML 2015年 12月 7日
Technical article Touch the revolution with the most noise immune capacitive touch microcontroller PDF | HTML 2015年 11月 12日
White paper CapTIvate™ 터치 기술과 초저전력 MSP430™ FRAM 마이크로컨트롤러로 멋진 HMI 만들기 2015年 11月 11日
User guide 64 Button Capacitive Touch Panel With CapTIvate Technology Design Guide 2015年 10月 30日
White paper MSP430™ FRAM Microcontrollers With CapTIvate™ Touch Technology 2015年 10月 14日
Application note MSP430 FRAM Quality and Reliability (Rev. A) 2014年 5月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

CAPTIVATE-BSWP — 電容式觸控自電容按鈕、滑桿、轉輪和近距感測器示範板

CapTIvate ™ 按鈕、滑桿、轉輪和近距展示板 (CAPTIVATE-BSWP) 是一款適合採用各種配置之自電容式電容觸控感測器的簡易評估平台。  感測器面板展示電池供電應用的低功耗設計原則,並展示 MSP430™ CapTIvate MCU 的喚醒近距狀態機功能。  面板也展示了使用自電容式感測器而實現的高滑桿和車輪感測器解決方案。
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開發板

CAPTIVATE-FR2633 — 電容式觸控 MSP430FR2633 MCU 機板

CapTIvate ™ MSP430FR2633 MCU 電路板 (CapTIvate FR2633) 為簡單的評估工具,可透過外接感測器機板(另行販售)來評估電容式觸控與近距感測功能。  MCU 機板配備 20 接腳母端偵錯連接器,可用於偵錯板載 MSP430FR2633 CapTIvate MCU,並具備 48 接腳感測器面板連接器,可連接外部電容式觸控感測器。  MCU 電路板上亦配備部分填充的 BoosterPack™ 外掛模組接頭,可提供有限的 LaunchPad™ 和 BoosterPack 生態系統支援。  目前支援的套件包括:存取控制面板搭配藍牙低功耗和電容式觸控參考設計 (...)
TI.com 無法提供
開發板

CAPTIVATE-METAL — 適用於 CapTIvate™ 開發套件的金屬觸控電容式感測附加基板

CapTIvate ™金屬觸控面板 (CAPTIVATE-METAL) 是 CapTIvate 開發套件(CAPTIVATE-FR2633CAPTIVATE-FR2676)的附加模組,讓設計人員與工程師可評估金屬觸控技術。這項傳統電容式觸控感測器的替代技術,能以不鏽鋼、鋁合金、黃銅或青銅打造更具美感的觸控模組設計。

採用 CapTIvate 技術的 MSP430™ 微控制器則使用另一種方式來處理金屬覆蓋層。堆疊結構包括一塊具有傳統電容式觸控感測器的印刷電路板,以及一個上方覆有接地金屬層的墊片。此機械結構形成可變電容器,對按鈕、滑桿或滾輪施加力量時,其電容量會產生變化。CapTIvate (...)

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開發板

ALGO-3P-UISP1-TI — 適用於德州儀器裝置的 Algocraft μISP1 編程器

μISP 可以連接到主機 PC (內建 RS-232、USB、LAN 連接) 或獨立模式工作。

在單機模式下,只要按下「開始」按鈕或透過一些 TTL 控制線,就可以執行編程週期。

其緊湊的尺寸和多功能性可輕鬆整合到生產環境、手動和自動化程序中。

從:Algocraft
開發套件

CAPTIVATE-PHONE — 具有觸覺回饋的電容式觸控互電容感測器示範板

此 MSP430™ CapTIvate™展示板 (CAPTIVATE-PHONE) 是一套適用於互電容式電容觸控感測器的簡易評估平台,此平台可在實際應用中使用各種配置。  感測器面板展示如何組成互電容式觸控感測器以實現高密度和低針腳數,並展示互電容式滑桿和車輪感測器的建議配置。  面板也展示如何執行防護通道,以防止因手掌或清潔布造成的誤觸偵測。  隨附觸控驅動器和致動器,可在偵測到觸控時為使用者提供振動回饋。

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硬體程式設計工具

CAPTIVATE-PGMR — MSP430 CapTIvate MCU 編程器

MSP430 CapTIvate MCU 編程器可獨立使用,或做為 MSP CapTIvate™ MCU 開發套件的一部分提供。這是一個全面,易用的平台,可評估採用電容式觸控技術的 MSP430FR2633 微控制器。  編程器/偵錯器電路板可搭配 BOOSTXL-CAPKEYPAD BoosterPack™ 模組和透過金屬附加電路板的 CAPTIVATE-METAL 電容式觸控使用。  編程器採用 EnergyTrace™ 技術,可透過 Code Composer Studio™ IDE 測量能耗。  搭載 CapTIvate 技術的 MSP MCU 是業界最低功耗的電容式觸控 (...)
TI.com 無法提供
硬體程式設計工具

MSP-FET — MSP MCU 程式設計工具和偵錯器

MSP-FET 是一款強大的模擬開發工具,通常稱為偵錯探測器,可讓使用者快速展開 MSP 低功耗微控制器 (MCU) 的開始工作。

它支援透過 JTAG 和 SBW 介面進行編程和即時偵錯。此外,MSP-FET 也能在電腦 USB 介面與 MSP UART 間提供後通道 UART 連接。這為 MSP 程式設計工具提供了一種便利的方法,能在 MSP 和電腦上執行的終端之間進行串行通訊。它也支援透過 UART 和 I2C 通訊協定,使用 BSL(自舉式載入程式)將程式(通常稱為韌體)載入到 MSP 目標。

USB 介面可將 MSP-FET 連接至電腦,而 14 針腳連接器則可存取 MSP (...)

使用指南: PDF | HTML
TI.com 無法提供
硬體程式設計工具

ALGO-3P-WRITENOW — Algocraft WriteNow!程式設計工具

WriteNow! 系統內編程器系列是可編程產業的一大突破。此編程器支援多家製造商的眾多裝置 (例如微控制器、記憶體、CPLD 與其他可編程裝置)。其尺寸精巧,便於整合至 ATE 與固定裝置。編程器可單機運作,或透過內建的 RS-232、LAN 與 USB 連接埠與主機電腦連線,並隨附操作簡易的工具軟體。

從:Algocraft
應用軟體及架構

MSP430-IEC60730-SW-PACKAGE IEC60730 Software Package

The IEC60730 MSP430 software package was developed to be useful in assisting customers in complying with IEC 60730-1:2010 (Automatic Electrical Controls for Household and Similar Use – Part 1: General Requirements) for up to Class B products, which includes home appliances, arc detectors, (...)

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應用軟體及架構

MSPCAPTDSNCTR MSP CapTIvate™ design Center GUI

The CapTIvate™ Design Center GUI is a one-stop resource for everything related to CapTIvate capacitive sensing technology integrated on TI MSP430™ microcontrollers. It includes tools, documentation and software examples that can simplify and accelerate capacitive touch designs. Start by (...)

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程式碼範例或展示

SLAC700 MSP430FR243x, MSP430FR253x, MSP430FR263x Code Examples

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韌體

MSPFRBOOT MSPFRBOOT

The bootloader (BSL) on MSP430™ microcontrollers (MCUs) lets users communicate with embedded memory in the MSP MCUs during the prototyping phase, final production, and in service. This is done through standard interfaces such as UART, I2C, SPI, and USB. Both the programmable memory (Flash/FRAM) and (...)

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快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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IDE、配置、編譯器或偵錯程式

ENERGYTRACE — EnergyTrace 技術

EnergyTrace™ software for MSP430™ MCUs, MSP432™ MCUs, CC13xx wireless MCUs and CC26xx wireless MCUs is an energy-based code analysis tool that measures and displays the energy profile of an application and helps optimize it for ultra-low-power consumption.

As most developers know, it is difficult to (...)

使用指南: PDF
IDE、配置、編譯器或偵錯程式

IAR-KICKSTART — IAR Embedded Workbench

IAR Embedded Workbench delivers a complete development toolchain for building and debugging embedded applications for your selected target microcontroller. The included IAR C/C++ Compiler generates highly optimized code for your application, and the C-SPY Debugger is a fully integrated debugger for (...)
從:IAR Systems
使用指南: PDF
線上培訓

MSP430-ACADEMY MSP430™ academy

MSP430™ academy delivers easy-to-use training modules that span a wide range of topics and LaunchPads in the MSP430 MCU portfolio.
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作業系統 (OS)

WHIS-3P-SAFERTOS — WITTENSTEIN SAFERTOS 預先認證的安全 RTOS

SAFERTOS® 是專為嵌入式處理器設計的獨特即時作業系統。經 TÜV SÜD 預先認證,符合 IEC 61508 SIL3 與 ISO 26262 ASILD 標準。SAFERTOS® 是由 WHIS 專家團隊專為安全而打造,適用於全球重要安全應用。WHIS 與德州儀器的合作已經超過十年。在此期間,WHIS 已將 SAFERTOS® 移植至各種 TI 處理器,支援所有熱門核心,並可依要求提供其他架構。SAFERTOS® 專為您的特定處理器/編譯器組合量身打造,隨附完整的原始程式碼與設計保證包,可完全一目了然整個設計生命週期。許多 WHIS 客戶開始使用 FreeRTOS (...)
軟體程式設計工具

MSP-GANG-SOFTWARE MSP-GANG Software

The MSP Gang Programmer (MSP-GANG) is a MSPM0/MSP430/MSP432 device programmer that can program up to eight identical devices at the same time.
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軟體程式設計工具

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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設計工具

MSP-3P-SEARCH — MSP 第三方搜尋工具

TI has partnered with multiple companies to offer a wide range of solutions and services for TI MSP devices. These companies can accelerate your path to production using MSP devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your needs.

(...)

許多 TI 參考設計包含 MSP430FR2633

使用我們的參考設計選擇工具,以檢視並找出最適合您的應用和參數的設計。

封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YQW) 24 Ultra Librarian
TSSOP (DA) 32 Ultra Librarian
VQFN (RHB) 32 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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