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CC2340R5-Q1

現行

具有 512kB 快閃記憶體的車用認證 SimpleLink™ Bluetooth® 低耗能無線 MCU

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CC2340R5-Q1

現行
產品規格表 立即訂購

產品詳細資料

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
VQFN (RHB) 32 25 mm² 5 x 5

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers

  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers

  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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重要文件 類型 標題 格式選項 日期
* Data sheet CC2340R5-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. A) PDF | HTML 2025年 7月 30日
* Errata CC2340R5-Q1 SimpleLink Wireless MCU Device Revision B Errata (Rev. B) PDF | HTML 2025年 7月 16日
* User guide CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 2024年 8月 7日
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 2026年 2月 4日
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025年 11月 18日
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 2024年 2月 27日
Application note CC2340 Bluetooth LE Software Product Brief (Rev. A) PDF | HTML 2023年 11月 6日
Application note Hardware Migration to CC2340R5 PDF | HTML 2023年 5月 9日
Certificate LP-EM-CC2340R5 EU RoHS Declaration of Conformity (DoC) (Rev. A) 2023年 4月 28日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Application note RF PCB Simulation Cookbook 2019年 1月 9日
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 2017年 10月 2日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-EM-CC2340R5 — 適用於 SimpleLink™ Bluetooth® 5.3 低耗能 MCU 的 CC2340R5 LaunchPad™ 開發套件

此 LaunchPad 開發套件可藉由支援 Bluetooth 5 低耗能 (LE) 及 2.4-GHz 專利通訊協定的 SimpleLink Bluetooth 低耗能 MCU 加快開發速度。軟體支援由 SimpleLink 低功率 F3 軟體開發套件 (SDK) 提供。

TI.com 無法提供
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TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

使用指南: PDF
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偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

從：TASKING Germany GmbH
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開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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開發套件

RFSTAR-3P-AUTO-BLE-MODULES — 以 CC2642R-Q1 CC2340R5-Q1 為基礎的 RF-STAR 汽車 BLE 模組

RF-star 超過十年來均是 TI 的無線連線模組第三方 IDH，專門供應以 TI 產品為基礎的各種無線模組及解決方案，例如 BLE、Matter、ZigBee、Thread、Wi-Fi、Sub-1G 與 Wi-SUN。 
RF-BM-2340QB1 是汽車 Bluetooth® 5.3 低功耗模組，以符合 AEC-Q100 標準的 MCU CC2340R5-Q1 為基礎。RF-BM-2642QB1I 和 RF-BM-2642QB1 是汽車 Bluetooth® 5.2 低功耗模組，以符合 AEC-Q100 標準的 MCU CC2642R-Q1 為基礎。其可在 -40℃ 至 105℃ (...)

從：Shenzhen RF-star Technology Co., Ltd.
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開發套件

TTC-3P-AUTO-MODULES — TTC automotive Bluetooth Low Energy modules

HY-42Q101 Bluetooth low energy single mode module is for AEC-Q100 qualified automotive 
applications, automotive device specification temperature Grade 2: ( –40°C to +105°C), 

HY-42Q101 is a single mode device, targeted for low-power energy sensors and accessories. 

HY-42Q101 offers all Bluetooth (...)

從：Shenzhen Shengrun Technology Co., Ltd.
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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-FMNAP — Find My Network Accessory Protocol (FMNAP) Plugin for SimpleLink devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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軟體開發套件 (SDK)

TTC-SR-2340080I1Q — TTC SR-2340080I1Q 是具備 BLE RF 發射器的高性能雙工 TMPS 晶片。

SR-2340080I1Q 為一顆高度整合之 TPMS 感測器晶片，包含壓力感測器、溫度感測器、加速度感測器、電池電壓感測器，以及低功耗藍牙功能。
TTC 提供隨附之 SDK 開發套件，使 TPMS 感測器之測量與通訊能由客戶端軟體控管，並協助客戶快速整合。
該 SDK 含括多樣化韌體函式庫與專案範例，範圍自基本 TPMS 功能至複雜之自動定位演算法。
從：Shenzhen Shengrun Technology Co., Ltd.
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TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx and CC23xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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Gerber 檔案

CC2340R5-Q1 LaunchPad Design Files

SWRR187.ZIP (4185 KB)
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VQFN (RHB) 32 Ultra Librarian
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