產品詳細資料

CPU 4 Arm Cortex-A53 Frequency (MHz) 140 Coprocessors 1 Arm Cortex-R5F Display type MIPI DPI Protocols Ethernet, TSN Hardware accelerators Deep learning accelerator, Video decode accelerator, Video encode accelerator, Vision processing accelerator Features Vision Analytics Operating system Linux, RTOS Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
CPU 4 Arm Cortex-A53 Frequency (MHz) 140 Coprocessors 1 Arm Cortex-R5F Display type MIPI DPI Protocols Ethernet, TSN Hardware accelerators Deep learning accelerator, Video decode accelerator, Video encode accelerator, Vision processing accelerator Features Vision Analytics Operating system Linux, RTOS Security Secure boot TI functional safety category Functional Safety-Compliant Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCCSP (ANF) 484 324 mm² 18 x 18

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
    • 512KB SRAM with SECDED ECC
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
  • Deep Learning Accelerator based on Single-core C7x
    • C7x floating point, up to 40 GFLOPS, 256-bit Vector DSP at 1.0GHz
    • Matrix Multiply Accelerator (MMA), up to 2TOPS (8b) at 1.0GHz
    • 64KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
    • 1.25MB of L2 SRAM with SECDED ECC
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators:
    • 315MPixel/s ISP; Up to 5MP @ 60fps
    • Support for 12-bit RGB-IR
    • Support for up to 16-bit input RAW format
    • Line support up to 4096
    • Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
      • Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL

Multimedia:

  • Display subsystem
    • Single display support
    • Up to 2048x1080 @ 60fps
    • Up to 165MHz pixel clock support with independent PLL
    • DPI 24-bit RGB parallel interface
    • Supports safety features such as freeze frame detection and MISR data check
  • One Camera Serial interface (CSI-2) Receiver with 4-Lane D-PHY
    • MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA
  • Video Encoder/Decoder
    • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
    • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
    • Support for up to 4K UHD resolution (3840 × 2160)
      • Clocking options supporting 240MPixels/s, 120MPixels/s, or 60MPixels/s
  • Motion JPEG encode at 416MPixels/s withresolutions up to 4K UHD (3840 × 2160)

Memory Subsystem:

  • Up to 2.29MB of On-chip RAM
    • 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
    • 1.25MB of L2 SRAM with SECDED ECC in C7x Deep Learning Accelerator
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4
    • 32-bit data bus with inline ECC
    • Supports speeds up to 3733MT/s
    • Max addressable range of 8GBytes

Functional Safety:

  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation will be available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3 targeted
    • Hardware Integrity up to SIL 2 targeted
    • Safety-related certification
      • IEC 61508 by TÜV SÜD planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TÜV SÜD planned
  • AEC - Q100 qualified [Automotive]

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time Sensitive Networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 3x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
      • Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
      • Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low-power modes supported by Device/Power Manager
    • Partial IO support for CAN/GPIO/UART wakeup
    • DeepSleep : I/O + DDR (suspend to RAM)
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling for Cortex-A53

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • Serial NAND Flash
  • SD Card
  • eMMC
  • USB (host) boot from Mass Storage device
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16-nm FinFET technology
  • 18mm x 18mm, 0.8mm pitch full-array, 484-pin FCBGA (AMB)
  • 18mm x 18mm, 0.8mm pitch full-array, 484-pin FCCSP (ANF)

Processor Cores:

  • Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
    • 512KB SRAM with SECDED ECC
  • Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
    • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
  • Deep Learning Accelerator based on Single-core C7x
    • C7x floating point, up to 40 GFLOPS, 256-bit Vector DSP at 1.0GHz
    • Matrix Multiply Accelerator (MMA), up to 2TOPS (8b) at 1.0GHz
    • 64KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
    • 1.25MB of L2 SRAM with SECDED ECC
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators:
    • 315MPixel/s ISP; Up to 5MP @ 60fps
    • Support for 12-bit RGB-IR
    • Support for up to 16-bit input RAW format
    • Line support up to 4096
    • Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
      • Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL

Multimedia:

  • Display subsystem
    • Single display support
    • Up to 2048x1080 @ 60fps
    • Up to 165MHz pixel clock support with independent PLL
    • DPI 24-bit RGB parallel interface
    • Supports safety features such as freeze frame detection and MISR data check
  • One Camera Serial interface (CSI-2) Receiver with 4-Lane D-PHY
    • MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA
  • Video Encoder/Decoder
    • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
    • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
    • Support for up to 4K UHD resolution (3840 × 2160)
      • Clocking options supporting 240MPixels/s, 120MPixels/s, or 60MPixels/s
  • Motion JPEG encode at 416MPixels/s withresolutions up to 4K UHD (3840 × 2160)

Memory Subsystem:

  • Up to 2.29MB of On-chip RAM
    • 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
    • 1.25MB of L2 SRAM with SECDED ECC in C7x Deep Learning Accelerator
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4
    • 32-bit data bus with inline ECC
    • Supports speeds up to 3733MT/s
    • Max addressable range of 8GBytes

Functional Safety:

  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation will be available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3 targeted
    • Hardware Integrity up to SIL 2 targeted
    • Safety-related certification
      • IEC 61508 by TÜV SÜD planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TÜV SÜD planned
  • AEC - Q100 qualified [Automotive]

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time Sensitive Networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 3x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
      • Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
      • Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low-power modes supported by Device/Power Manager
    • Partial IO support for CAN/GPIO/UART wakeup
    • DeepSleep : I/O + DDR (suspend to RAM)
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling for Cortex-A53

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • Serial NAND Flash
  • SD Card
  • eMMC
  • USB (host) boot from Mass Storage device
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16-nm FinFET technology
  • 18mm x 18mm, 0.8mm pitch full-array, 484-pin FCBGA (AMB)
  • 18mm x 18mm, 0.8mm pitch full-array, 484-pin FCCSP (ANF)

AM62Ax is an extension of the Sitara™ automotive-grade family of heterogeneous Arm® processors with embedded Deep Learning (DL), Video and Vision Processing acceleration, display interface and extensive automotive peripheral and networking options. AM62Ax is built for a set of cost-sensitive automotive applications including driver and in-cabin monitoring systems, next generation of eMirror system, as well as a broad set of industrial applications in Factory Automation, Building Automation, Robotics, and other markets. The cost optimized AM62Ax provides high-performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in stand-alone Electronic Control Units (ECUs).

AM62Ax contains up to four Arm® Cortex®-A53 cores with 64-bit architecture, a Vision Processing Accelerator (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators, Deep Learning (DL) and video accelerators, a Cortex®-R5F MCU Channel core and a Cortex®-R5F Device Management core. The Cortex-A53s provide the powerful computing elements necessary for Linux applications as well as the implementation of traditional vision computing based-algorithms such as driver monitoring. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite including RGB-InfraRed (RGB-IR), support for higher bit depth, and features targeting analytics applications. Key cores include the next generation C7000™ DSP from Texas Instruments (“C7x”) with scalar and vector cores, dedicated “MMA” deep learning accelerator enabling performance up to 2 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with TSN support and can be used to enable industrial networking options. In addition, an extensive peripherals set is included in AM62Ax to enable system level connectivity such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. AM62Ax supports secure boot for IP protection with the built-in HSM (Hardware Security Module) and also employs advanced power management support for portable and power-sensitive applications.

AM62Ax is an extension of the Sitara™ automotive-grade family of heterogeneous Arm® processors with embedded Deep Learning (DL), Video and Vision Processing acceleration, display interface and extensive automotive peripheral and networking options. AM62Ax is built for a set of cost-sensitive automotive applications including driver and in-cabin monitoring systems, next generation of eMirror system, as well as a broad set of industrial applications in Factory Automation, Building Automation, Robotics, and other markets. The cost optimized AM62Ax provides high-performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in stand-alone Electronic Control Units (ECUs).

AM62Ax contains up to four Arm® Cortex®-A53 cores with 64-bit architecture, a Vision Processing Accelerator (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators, Deep Learning (DL) and video accelerators, a Cortex®-R5F MCU Channel core and a Cortex®-R5F Device Management core. The Cortex-A53s provide the powerful computing elements necessary for Linux applications as well as the implementation of traditional vision computing based-algorithms such as driver monitoring. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite including RGB-InfraRed (RGB-IR), support for higher bit depth, and features targeting analytics applications. Key cores include the next generation C7000™ DSP from Texas Instruments (“C7x”) with scalar and vector cores, dedicated “MMA” deep learning accelerator enabling performance up to 2 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with TSN support and can be used to enable industrial networking options. In addition, an extensive peripherals set is included in AM62Ax to enable system level connectivity such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. AM62Ax supports secure boot for IP protection with the built-in HSM (Hardware Security Module) and also employs advanced power management support for portable and power-sensitive applications.

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重要文件 類型 標題 格式選項 日期
* Data sheet AM62Ax Sitara™ Processors datasheet (Rev. D) PDF | HTML 2025年 6月 20日
* Errata AM62Ax Sitara™ Processors Silicon Errata, Silicon Revision 1.0 (Rev. C) PDF | HTML 2025年 10月 10日
* User guide AM62Ax Sitara Processors Technical Reference Manual (Rev. C) 2025年 12月 8日
Application note Enabling Matter on Sitara MPU (Rev. A) PDF | HTML 2025年 11月 24日
Application note AM62x Audio Design Guide PDF | HTML 2025年 11月 20日
User guide Hardware Design Considerations for Custom Board Design using AM62A3, AM62A7-Q1, AM62A1-Q1, AM62D-Q1 Processor (Rev. D) PDF | HTML 2025年 10月 24日
User guide AM62A3, AM62A7-Q1, AM62A1-Q1, AM62D-Q1 Processor Family Schematic, Design Guidelines and Review Checklist (Rev. C) PDF | HTML 2025年 9月 17日
User guide AM62x, AM62Ax, AM62D-Q1 and AM62Px Processor Family Schematic, Design Guidelines and Review Checklist (Rev. I) PDF | HTML 2025年 9月 17日
Application note AM62x, AM62Ax, AM62Px, AM62Lx Spread-Spectrum Clocking PDF | HTML 2025年 9月 8日
Application note Custom Board Design and Simulation Guidelines for Processor High Speed Parallel Interfaces (Rev. A) PDF | HTML 2025年 9月 5日
Functional safety information AM6x, AM24x Software Diagnostics Library TÜV SÜD Functional Safety Certificate for 9.2.0 SDK (Rev. A) 2025年 7月 17日
Application note AM62Ax Power-Estimation Tool (PET)-- (Rev. B) PDF | HTML 2025年 3月 7日
User guide AM62Ax/AM62Dx Escape Routing for PCB Design (Rev. A) PDF | HTML 2025年 1月 14日
Application note AM62Ax, AM62Px LPDDR4 Board Design and Layout Guidelines (Rev. B) PDF | HTML 2024年 12月 17日
Application note Basic Ethernet Interface Debug With Linux PDF | HTML 2024年 10月 11日
Application note Minimal Platform Development on AM62x Devices (Rev. A) PDF | HTML 2024年 9月 24日
Application note AM6xA ISP Tuning Guide (Rev. A) PDF | HTML 2024年 5月 8日
Application note Developing Multiple-Camera Applications on AM6x (Rev. A) PDF | HTML 2024年 2月 14日
Technical article What’s the best type of computer vision for AI applications? PDF | HTML 2024年 1月 5日
Application note Multimedia Applications on AM62A PDF | HTML 2023年 11月 29日
Application note Using TSN Ethernet Features to Improve Timing in Industrial Ethernet Controllers PDF | HTML 2023年 11月 15日
Application brief Keyword Spotting Using AI at the Edge With Sitara Processors PDF | HTML 2023年 9月 28日
White paper Time Sensitive Networking for Industrial Automation (Rev. C) 2023年 7月 31日
Application note Vision AI-Based Defect Detection on AM62A Using TI Edge AI Studio PDF | HTML 2023年 7月 28日
User guide TPS65931211-Q1 PMIC User Guide for AM62A PDF | HTML 2023年 7月 27日
White paper Driver and Occupancy Monitoring Systems on AM62A PDF | HTML 2023年 7月 12日
Application brief AM62A Soc Improves Barcode Readers with Hardware Accelerated Vision Processing 2023年 6月 29日
White paper Camera Mirror Systems on AM62A PDF | HTML 2023年 6月 9日
Application note AM62A Edge AI Retail Scanner Demo: Analysis for SoC Selection and Power Usage PDF | HTML 2023年 5月 30日
White paper Easing the Pain of Safety Certified System Development PDF | HTML 2023年 5月 24日
Application note Building an Edge AI Application for Automated Retail Scanner on AM6xA MPUs PDF | HTML 2023年 5月 17日
Application note AM62Ax Maximum Current Ratings PDF | HTML 2023年 4月 18日
White paper Edge AI Smart Cameras Using Energy-Efficient AM62A Processor PDF | HTML 2023年 3月 2日
Application note Sitara™AM62A Benchmarks PDF | HTML 2023年 3月 1日
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023年 2月 24日
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 2019年 1月 10日
White paper Secure Boot on embedded Sitara™ processors (Rev. A) 2018年 10月 13日

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開發板

SK-AM62A-LP — 適用低功耗 Sitara™ 處理器的 AM62A 入門套件

SK-AM62A-LP 入門套件 (SK) 評估模組 (EVM) 以 AM62A AI 視覺處理器為基礎打造,其中包含在 60 fps 最高支援 5 MP 的影像訊號處理器 (ISP)、每秒 2 兆次運算 (TOPS) 的 AI 加速器、四核心 64 位元 Arm® Cortex®-A53微處理器、單核心 Arm Cortex-R5F 和 H.264/H.265 影片編碼/解碼。SK-AM62A-LP 是尋求開發低功耗智慧攝影機、行車紀錄器、機械視覺攝影機和汽車前攝影機應用的理想選擇。

SK-AM62A-LP 也包含單一攝影機的行動工業處理器介面 (MIPI®) CSI-2 (...)

使用指南: PDF | HTML
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偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)

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偵錯探測器

LB-3P-TRACE32-ARM — 適用於 Arm® 架構微控制器和處理器的 Lauterbach TRACE32® 偵錯和追蹤系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件,可讓開發人員分析、最佳化及認證各種 Arm® 架構微控制器和處理器。全球知名的嵌入式系統和 SoC 偵錯和追蹤解決方案是完美的解決方案,適用於從早期的矽前 (pre-silicon) 開發,到產品認證和現場故障排除等所有開發階段。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能,以及可隨需求變化而調整和成長的系統。藉由 TRACE32® 偵錯器,開發人員也可透過單一偵錯介面,同時偵錯和控制 SoC 中的任何 C28x/C29x/C6x/C7x DSP 核心及所有其他 Arm (...)

軟體開發套件 (SDK)

MCU-PLUS-SDK-AM62A MCU+ SDK for AM62A – RTOS, No-RTOS

The AM62A vision processor Linux® and TI MCU plus software development kits (SDKs) are unified software platforms for our embedded processors with deep learning capabilities with edge AI. They provide easy setup and fast out-of-the-box access to benchmarks and demonstrations. AM62A is a high (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-QNX-AM62AX QNX software development kit for AM62A Sitara™ processors

The AM62A vision processor Linux® and TI MCU plus software development kits (SDKs) are unified software platforms for our embedded processors with deep learning capabilities with edge AI. They provide easy setup and fast out-of-the-box access to benchmarks and demonstrations. AM62A is a high (...)

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韌體

USIT-3P-SECIC-HSM — Uni-Sentry SecIC-HSM 韌體

SecIC-HSM 旨在滿足 MCU/SoC 晶片所需的網路安全要求。HSM 韌體可應用於汽車、新能源、光伏、機器人、醫療保健與航空等領域。提供的網路安全功能包括安全開機、安全通訊 (SecOC)、安全診斷、安全儲存、安全更新、安全偵錯和金鑰管理。SecIC-HSM 的優點:一站式網路安全解決方案,具備跨晶片系列的全方位軟體相容性,擁有業界領先的性能,已在近 30 家 OEM 的量產車型中成功部署,累計出貨超過 300 萬套。
韌體

USIT-3P-SECIC-PQC — Uni-Sentry SecIC-PQC 演算法韌體

Uni-Sentry 的安全解決方案採用 PQC 演算法,能夠抵抗量子電腦對傳統加密演算法所造成的解密威脅。PQC 韌體與硬體安全模組 (HSM) 進行協同優化,利用硬體加速與安全性強化,以提升加密演算法的執行效率與安全性。 


Uni-Sentry 持續監控全球量子運算的發展,並更新其演算法組合。當前的 PQC 產品功能包括:

  • SP 800-208:LMS 和 XMSS
  • FIPS 203 (ML-KEM):CRYSTALS-KYBER
  • FIPS 204 (ML-DSA):CRYSTALS-Dilithium
  • FIPS 205 (SLH-DSA): SPHINCS+ 

技術亮點 

  • 量子抗性認證:與 (...)
快速入門

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

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IDE、配置、編譯器或偵錯程式

CLOCKTREE-AM62AX Clock tree configuration for AM62Ax


The Clock Tree Tool (CTT) for ARM Processors & Digital Signal Processors is an interactive configuration software tool that provides information about device clock tree architecture. This tool allows visualization of the device clock tree. It can also be used to determine the exact register (...)

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IDE、配置、編譯器或偵錯程式

DDR-CONFIG-AM62A DDR Configuration Tool

This SysConfig based tool simplifies the process of configuring the DDR Subsystem Controller and PHY to interface to SDRAM devices. Based on the memory device, board design, and topology the tool outputs files to initialize and train the selected memory.
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IDE、配置、編譯器或偵錯程式

EDGE-AI-STUDIO Edge AI Studio

Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers and radar sensors. Whether developing a proof of concept using a model from the TI Model Zoo or leveraging your own model, Edge AI Studio provides the (...)

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IDE、配置、編譯器或偵錯程式

K3-RESOURCE-CONFIGURATION Resource partitioning tool for multi core SOCs

Also known as the k3-respart-tool, the Resource Configuration tool allows for configuration of various system level parameters and generate the necessary data to be fed into software components
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IDE、配置、編譯器或偵錯程式

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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線上培訓

AM62A-ACADEMY AM62Ax Academy

AM62Ax Academy is designed to simplify and accelerate development on AM62Ax processors.
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作業系統 (OS)

WHIS-3P-SAFERTOS — WITTENSTEIN SAFERTOS 預先認證的安全 RTOS

SAFERTOS® 是專為嵌入式處理器設計的獨特即時作業系統。經 TÜV SÜD 預先認證,符合 IEC 61508 SIL3 與 ISO 26262 ASILD 標準。SAFERTOS® 是由 WHIS 專家團隊專為安全而打造,適用於全球重要安全應用。WHIS 與德州儀器的合作已經超過十年。在此期間,WHIS 已將 SAFERTOS® 移植至各種 TI 處理器,支援所有熱門核心,並可依要求提供其他架構。SAFERTOS® 專為您的特定處理器/編譯器組合量身打造,隨附完整的原始程式碼與設計保證包,可完全一目了然整個設計生命週期。許多 WHIS 客戶開始使用 FreeRTOS (...)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCCSP (ANF) 484 Ultra Librarian

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  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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