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音訊與雷達 DSP SoC

AM2732-Q1

現行

最高達 400 MHz 的車用雙核心 Arm® Cortex-R5F 架構 MCU，具有 C66x DSP、乙太網路、安全和安全性

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產品規格表
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AM2732-Q1

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) -40 to 140 Ethernet MAC only
CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) -40 to 140 Ethernet MAC only
NFBGA (NZN) 225 169 mm² 13 x 13 NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.
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重要文件 類型 標題 格式選項 日期
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. C) PDF | HTML 2025年 6月 6日
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 (Rev. C) PDF | HTML 2025年 5月 14日
* User guide AM273x Technical Reference Manual (Rev. E) 2025年 4月 10日
Application brief AM273x QSPI Flash Selection Guide (Rev. A) PDF | HTML 2025年 4月 7日
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 2025年 1月 28日
Functional safety information AM273x AUTOSAR MCAL Drivers Functional Safety Certificate 2024年 8月 20日
Application note AM273x Hardware Design Guide (Rev. A) PDF | HTML 2023年 11月 27日
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 2023年 11月 8日
Application note Sitara MCU Thermal Design PDF | HTML 2023年 9月 11日
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 2023年 8月 3日
User guide 10-kW, Three-Phase, Three-Level (T-Type) Inverter Using AM263 PDF | HTML 2023年 7月 11日
Application note Debugging Sitara AM2x Microcontrollers PDF | HTML 2022年 10月 24日
Application note Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 2022年 8月 8日
Application note Power Estimation Tool PDF | HTML 2021年 12月 1日

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Third-party accessory

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模擬型號

AM273x 0.8-mm Package Sitara BSDL Model

SPRM813.ZIP (4 KB) - BSDL Model
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模擬型號

AM273x 0.8-mm Package Sitara Thermal Model

SPRM814.ZIP (6 KB) - Thermal Model
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模擬型號

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
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模擬型號

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
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模擬型號

AM273x IBIS Model 0.80 mm package

SPRM812.ZIP (1862 KB) - IBIS Model
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模擬型號

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
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計算工具

SPRM803 — AM273x Power Estimation Tool

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參考設計

TIDA-020047 — 適用於汽車 4D 成像雷達的雙裝置 mmWave 串接參考設計

此汽車雷達參考設計為串接 76-GHz 至 81-GHz 雷達感測器模組。其中包含 AWR2243 裝置的雙裝置串接陣列和 AM2732R 雷達處理器。在此串接雷達配置中，主要裝置會將 20-GHz 本機振盪器 (LO) 訊號分配至主要和次要裝置，讓這兩個裝置能以單一射頻 (RF) 收發器的形式運作。如此即可支援多達 6 個傳輸 (TX) 和 8 個接收 (RX) 天線元件，因此在多輸入多輸出 (MIMO) 虛擬陣列中總共可提供 48 個虛擬通道。
Design guide: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
NFBGA (NZN) 225 Ultra Librarian
NFBGA (ZCE) 285 Ultra Librarian
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