首頁 無線連線 長距離 Sub-1 GHz 產品 Sub-1 GHz 無線 MCU
首頁
無線連線
長距離 Sub-1 GHz 產品
Sub-1 GHz 無線 MCU

CC1354P10

現行

支援 EdgeAI，具有 1MB + 296KB、+20dBm 的 SimpleLink™ Arm® Cortex®-M33 多頻段無線 MCU

立即訂購
產品規格表
使用指南

CC1354P10

現行
產品規格表 立即訂購

產品詳細資料

Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RSK) 64 64 mm² (8 mm × 8 mm) VQFN (RGZ) 48 49 mm² (7 mm × 7 mm)

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

filter 尋找其它 Sub-1 GHz 無線 MCU
下載 觀看有字幕稿的影片 影片

技術文件

找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 46
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU datasheet (Rev. B) PDF | HTML 2023/12/14
* 使用指南 CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 2022/3/28
* 勘誤表 CC1354P10 SimpleLink Wireless MCU Device Revision B (Rev. B) PDF | HTML 2023/11/30
應用說明 How to Modify TX and RX Commands Imported/Exported from SysConfig or SmartRF™ Studio PDF | HTML 2026/4/30
應用說明 TI Wi-SUN® Network Performance PDF | HTML 2025/8/1
應用說明 CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/8/6
應用說明 CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024/5/2
使用指南 SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2024/5/2
證書 LP-EM-CC1354P10-6 EU Declaration of Conformity (DoC) 2024/4/23
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 2024/4/9
證書 LP-EM-CC1354P10-1 EU Declaration of Conformity (DoC) (Rev. A) PDF | HTML 2023/10/25
應用說明 TI 15.4-Stack Software PDF | HTML 2023/10/17
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 2023/7/12
應用說明 2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P PDF | HTML 2022/4/5
應用說明 Antenna Impedance Measurement and Matching PDF | HTML 2022/3/22
應用說明 Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/2/25
應用說明 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 2022/2/7
應用說明 Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021/12/20
應用說明 TI Bluetooth® Mesh Software Product Brief PDF | HTML 2021/12/17
技術文章 4 questions to ask before choosing a Wi-SUN stack PDF | HTML 2021/8/13
白皮書 Dynamic Multi-Protocol (DMM) Performance 2021/4/21
白皮書 Exploring Thread and Zigbee for home and building automation PDF | HTML 2021/4/12
技術文章 How Wi-SUN® FAN improves connected infrastructures PDF | HTML 2020/11/19
技術文章 How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 2020/9/21
應用說明 Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 2020/9/14
網路安全諮詢 Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/5/18
應用說明 Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 2020/3/31
應用說明 Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020/1/28
技術文章 Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev PDF | HTML 2019/9/25
更多文件說明 Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 2019/6/17
更多文件說明 Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs 2019/6/17
應用說明 Bluetooth® Low Energy Tree Structure Network PDF | HTML 2019/5/29
應用說明 Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs PDF | HTML 2019/4/15
技術文章 The “key” to security: Zigbee 3.0’s security features PDF | HTML 2019/2/5
Product overview Out-of-box star-network solution: TI 15.4-Stack 2019/1/14
應用說明 RF PCB Simulation Cookbook 2019/1/9
Product overview Time Multiplexing: Concurrent Multi-standard Operation 2019/1/3
白皮書 Migrating your proprietary solution to the SimpleLink™ WMCU 2018/11/7
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 2018/11/5
技術文章 Unlock every door with the SimpleLink™ platform PDF | HTML 2018/9/19
應用說明 Low-Power ADC Solution for CC13x2 and CC26x2 2018/3/2
白皮書 Thread and Zigbee for home and building automation 2018/3/1
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs PDF | HTML 2018/2/27
應用說明 Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 2018/2/27
應用說明 Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017/3/5
應用說明 TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017/2/28

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發套件

LP-EM-CC1354P10 — 適用 SimpleLink™ Sub-1 GHz 和 2.4 GHz 無線微控制器的 CC1354P10 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件配備整合式功率放大器與多頻帶無線電支援，可同時進行 Sub-1 GHz 與 2.4GHz 操作，並加快裝置上的開發速度。支援的通訊協定包括相容於 SimpleLink™ 低功率軟體開發套件的 Bluetooth® 低功耗、Wi-SUN®、Thread、Zigbee®、TI 15.4 堆疊和 2.4GHz 與 Sub-1 GHz 專利 RF 通訊協定。提供具不同 RF 配對網路與功率等級的變化。這是一款分離式 LaunchPad™ 開發套件，因此不包含 XDS 偵錯器。建議的偵錯器爲 LP-XDS110 或 LP-XDS110ET。

  • (...)
支援產品和硬體
開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

支援產品和硬體
有庫存
限制：
??asset.out-of-stock-ti_zh_TW??
無法提供
開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

支援產品和硬體
有庫存
限制：
??asset.out-of-stock-ti_zh_TW??
無法提供
子卡

BDE-3P-SUB1GHZ — BDE Sub-1Ghz 模組

VDE Technology Inc. 是 TI 認證的第三方模組供應商。BDE 的模組以 TI 的 CC1XXX Sub-1Ghz 無線連線產品為基礎，讓客戶可縮短開發週期、減少設計不確定性、降低產品成本，並能有效推出具競爭力的產品。BDE 專精於提供超低功耗無線通訊技術，例如 Amazon Sidewalk、Wi-SUN、mioty 和無線 M-Bus 給全球的 OEM、系統整合商、裝置製造商和解決方案供應商。

從：BDE Technology Inc.
支援產品和硬體
偵錯探測器

LB-3P-TRACE32-WIRELESS — 適用於無線連線的 Lauterbach TRACE32® 偵錯系統

Lauterbach 的 TRACE32® 工具是一套先進的軟硬體元件，可讓開發人員分析、最佳化及認證 TI 許多無線連線晶片。全球知名的嵌入式系統偵錯解決方案是完美的解決方案，適用於從早期的矽前 (pre-silicon) 開發，到產品認證和現場故障排除等所有開發階段：   完整的晶片內建斷點支援；執行階段記憶體存取；快閃記憶體編程和基準計數器。所有內容都是可編寫指令碼，使開發人員能夠一再地重複相同的測試順序。Lauterbach 工具的直覺模組化設計為工程師提供現今最高的可用性能，以及可隨需求變化而調整和成長的系統。經認證的工具資格認證支援套件 (TQSK) 提供便利的全方位方式，鑒定 (...)

從：Lauterbach GmbH
支援產品和硬體
軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

支援產品和硬體
軟體開發套件 (SDK)

SIMPLELINK-MATTER — SimpleLink™ family of devices Matter software

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

支援產品和硬體
軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK — TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

ARM-CGT — Arm® 程式碼產生工具 - 編譯器

The TI Arm® compiler tools are an essential component of the CCStudio™ development ecosystem, providing robust support for TI Arm-based platforms. They are engineered to maximize the potential of TI Arm Cortex®-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio 是一系列圖形和命令行工具，旨在加速 TI 處理器、微控制器和雷達感測器上的邊緣 AI 開發。不管是使用來自 TI Model Zoo 的模型，還是
運用您自己的模型來開發概念驗證，Edge AI Studio 都能提供您所需的工具。

Edge AI Studio 圖形使用者介面提供完全整合的解決方案，用於收集和註釋資料、訓練和編譯模型，以在即時開發平台上部署。從 TI Model Zoo 中的各種預先訓練的模型中選擇，並可選擇透過自訂資料重新訓練，以提升準確度和性能。Edge AI Studio (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

SENSOR-CONTROLLER-STUDIO — Sensor Controller Studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

支援產品和硬體
線上培訓

SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
支援產品和硬體
快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支援產品和硬體
應用軟體及架構

MIOTY — MIOTY 技術的協定軟體

使用 LaunchPad SensorTag 套件，開始評估 MIOTY® 協定軟體：

  1. 購買一個或多個 CC1352R SensorTag 套件
  2. 購買一個 CC1352R1 LaunchPad 開發套件
  3. 下載 SimpleLink™ 軟體開發套件
  4. 如需開發 MIOTY 堆疊，請聯絡 Stackforce
  5. 向 MIOTY 訂購閘道


MIOTY 技術為新型低功率廣域網路 (LPWAN) 解決方案，且是以 ETSI 103 357 為基礎的真正標準化技術。MIOTY 透過 Sub-1 GHz 通訊實現長距離通訊範圍，且由於採用創新的電報拆分 (telegram splitting) (...)

支援產品和硬體
應用軟體及架構

SIMPLELINK-CONNECT — SimpleLink Connect App for the SimpleLink Low Power SDKs

SimpleLink Connect 行動應用程式是 Bluetooth® 低功耗應用範例，適用於搭配以下項目的行動裝置：

  • 執行 SIMPLELINK-LOWPOWER-SDK 的 CC23XX 裝置
  • 連接至執行 CC33XX-SOFTWARE 之主機的 CC33xx 裝置

應用程式提供了基準，讓使用者可使用 iOS 或 Android 快速建置自己的行動應用程式。提供原始碼，便於客製化。

支援產品和硬體
外掛程式

SIMPLELINK-SDK-EDGEAI-PLUGIN — Edge AI Plugin and application support for SimpleLink™ family of devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

支援產品和硬體
外掛程式

SIMPLELINK-SDK-LVGL-PLUGIN — SimpleLink™ 軟體開發套件 (SDK) LittlevGL 外掛程式

SimpleLink™ SDK LVGL 插件是一個配套軟體套件，透過將免費且開放程式碼的第三方函式庫 LittlevGL 整合到 SimpleLink SDK 生態系統中，為各種 SimpleLink™ MCU 平台提供進階圖形功能。外掛程式提供範例硬體抽象層與顯示驅動程式，讓開發人員能夠輕鬆地在參考硬體上開始於 SimpleLink 平台建置嵌入式 GUI。此外掛程式與 SimpleLink MSP432P4 SDK、SimpleLink MSP432E4 SDK、SimpleLink CC13x2 和 CC26x2 SDK 以及 SimpleLink CC32xx SDK 並行運作。

支援產品和硬體
軟體程式設計工具

FLASH-PROGRAMMER — SmartRF Flash Programmer

SmartRF Flash Programmer 2 可在德州儀器 ARM 架構低功耗 RF 無線 MCU 中，透過偵錯與序列介面進行快閃記憶體編程。查看支援產品相容性清單。Uniflash 也可用於編程任何 SimpleLink 產品。

SmartRF Flash Programmer 可在德州儀器 8051 型低功耗 RF 無線 MCU 中的進行快閃記憶體編程，並可在 SmartRF05 評估電路板、SmartRF 收發器評估電路板 (TrxEB) 和 CC 偵錯器上升級韌體和開機載入程式。

SmartRF Flash Programmer 和 SmartRF Flash (...)

lock = 需要匯出核准 (1 分鐘)
支援產品和硬體
軟體程式設計工具

UNIFLASH — UniFlash 快閃記憶體編程工具

UniFlash 是 TI 龐大 CCStudio™ 開發生態系統的一部分，是一款用於在 TI 微控制器與無線連線裝置上對晶片內快閃記憶體進行燒錄，以及在 TI 處理器上對板載快閃記憶體進行燒錄的軟體工具。UniFlash 提供圖形化介面與命令行介面，並可在桌面上或雲端中執行。

UniFlash 可從 CCStudio™ 開發人員區上的雲端執行，或在下載後於 Windows®、Linux® 和 macOS® 電腦中使用。

請注意，mmWave、AMx、K2G 和 J7 裝置不支援 macOS。AMx、K2G 和 J7 裝置僅於命令列上支援。

支援產品和硬體
計算工具

SMARTRF-STUDIO-7 — SmartRF Studio

SmartRF™ Studio 是一款 Windows 應用程式，功用在於協助射頻系統的設計人員在為所有 TI CC1xxx 及 CC2xxx 低功耗射頻裝置設計過程中，能在早期階段輕鬆評估無線電。此程式簡化了配置暫存器值和命令的產生，以及射頻系統的實際測試和除錯。

SmartRF Studio 支援下列 TI 裝置：

 

資源

支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RSK) 64 Ultra Librarian
VQFN (RGZ) 48 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片