产品详细信息

Arm CPU 1 Arm Cortex-A8 Arm MHz (Max.) 1000 CPU 32-bit Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension Operating system Linux, RTOS Security Crypto Rating Catalog Operating temperature range (C) -40 to 105, -40 to 90, 0 to 90
Arm CPU 1 Arm Cortex-A8 Arm MHz (Max.) 1000 CPU 32-bit Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension Operating system Linux, RTOS Security Crypto Rating Catalog Operating temperature range (C) -40 to 105, -40 to 90, 0 to 90
FC/CSP (CUS) 423 256 mm² 16 x 16
  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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More Information

Several of the documents associated to device are restricted and must go through export control. Depending on where you are and how your IP address registers with the TI servers, you may have problems accessing those particular documents.

技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 AM3715、AM3703 Sitara ARM 微处理器 数据表 (Rev. F) 2011年 8月 29日
* 勘误表 AM3715, AM3703 Microprocessors Silicon Errata (Silicon Revisions 1.2 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* 用户指南 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
更多文献资料 From Start to Finish: A Product Development Roadmap for Sitara™ Processors 2020年 12月 16日
应用手册 PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. C) 2020年 3月 3日
应用手册 TMS320C6472 DDR2 Implementation Guidelines 2019年 3月 20日
技术文章 Bringing the next evolution of machine learning to the edge 2018年 11月 27日
用户指南 How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 2018年 9月 24日
技术文章 How quality assurance on the Processor SDK can improve software scalability 2018年 8月 22日
更多文献资料 Ethernet Connectivity via GPMC 2018年 7月 6日
更多文献资料 AM37x/DM37x Schematic Checklist 2018年 7月 6日
更多文献资料 AM37x EVM Software Developer's Guide 2018年 7月 6日
技术文章 Clove: Low-Power video solutions based on Sitara™ AM57x processors 2016年 7月 21日
技术文章 Spring has sprung. A sale has sprung. 2016年 4月 4日
应用手册 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
白皮书 Power-saving techniques lead to ultra-low-power processors for battery-operated 2013年 4月 8日
用户指南 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
应用手册 PCB Design Requirements for OMAP3630, AM37x and DM37x Microprocessors 2011年 6月 15日
应用手册 Assembly Guidelines for 0.5mm Package-on-Package(PoP) Packages, Part II 2010年 6月 23日
应用手册 PCB Design Guidelines for 0.5mm Package-On-Package (PoP) Packages, Part I 2010年 6月 23日
应用手册 AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
应用手册 AM/DM37x Overview 2010年 6月 3日
应用手册 AM3715/03 Memory Subsystem 2010年 6月 3日
应用手册 AM3715/03 SDRC Subsystem Registers 2010年 6月 3日
应用手册 AM37x CUS Routing Guidelines 2010年 6月 3日
应用手册 OMAP35x to AM37x Hardware Migration Guide 2010年 6月 3日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

调试探针

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针(仿真器)的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器)连接到目标板,而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 PC 上运行,还需要 Code Composer Studio™ IDE 许可证。

(...)

现货
数量限制: 3
调试探针

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)

现货
数量限制: 1
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)

现货
数量限制: 1
软件开发套件 (SDK)

ANDROIDSDK-SITARA — 用于 Sitara 微处理器的 Android 开发套件

虽然起初专为移动手持终端而设计,Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。 与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。


Android 操作系统的亮点在于:

  • 完整的开放源码软件解决方案
  • 基于 Linux
  • 针对商业开发的简洁许可条款 (Apache)
  • 包含一个完整的应用框架
  • 允许通过 Java 轻松集成定制开发应用
  • 开包即用的多媒体、图形和图形用户界面
  • 大量 Android 和应用开发人员供随时调遣

 

软件开发套件 (SDK)

LINUXEZSDK-SITARA — 用于 Sitara™ ARM® 处理器的 Linux EZ 软件开发套件 (EZSDK)

Linux EZ 软件开发套件 (EZ SDK) 为 Sitara™ 开发人员提供了提供了轻松设置、开包即用的快捷体验(特定于且突出了 Sitara ARM9® 和 Cortex™ -A8® (...)
驱动程序或库

WIND-3P-VXWORKS-LINUX-OS — Wind River 处理器 VxWorks 和 Linux 操作系统

Wind River 是提供物联网 (IoT) 软件的全球领导者。自 1981 年以来,该公司的技术一直在为全世界最安全的器件提供支持,现在已广泛应用于超过 20 亿产品中。Wind River 提供全面的边缘到云产品系列,并针对这些产品提供世界一流的全球专业服务和备受赞誉的客户支持。Wind River 的 VxWorks 和 Linux 产品支持各种 TI 处理器。

如需了解有关 Wind River 的更多信息,请访问 https://www.windriver.com

由 Wind River Systems 提供
IDE、配置、编译器或调试器

CCSTUDIO-SITARA — 适用于 Sitara™ 处理器的 Code Composer Studio (CCS) 集成开发环境 (IDE)

Download the latest version of Code Composer Studio

Code Composer Studio™ - Integrated Development Environment for Sitara™ ARM© Processors

 

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug (...)

操作系统 (OS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
由 Green Hills Software 提供
操作系统 (OS)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify application (...)
由 Mentor Graphics Corporation 提供
操作系统 (OS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
由 QNX Software Systems 提供
软件编程工具

FLASHTOOL — 用于 AM35x、AM37x、DM37x 和 OMAP35x 器件的 FlashTool

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

软件编程工具

UNIFLASH — UniFlash stand-alone flash tool for microcontrollers, Sitara™ processors and SimpleLink™ family

支持的器件:CC13xx、CC25xx、CC26xx、CC3x20、CC3x30、CC3x35、Tiva、C2000、MSP43x、Hercules、PGA9xx、IWR12xx、IWR14xx、IWR16xx、IWR18xx、IWR68xx、AWR12xx、AWR14xx、AWR16xx、AWR18xx。  仅限命令行:AM335x、AM437x、AM571x、AM572x、AM574x、AM65XX、K2G

CCS Uniflash 是一个独立工具,用于编程 TI MCU 的片上闪存内存和 Sitara 处理器的板载闪存内存。Uniflash 具有 GUI、命令行和脚本接口。CCS Uniflash 免费提供。

仿真模型

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
仿真模型

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
仿真模型

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
仿真模型

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
仿真模型

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
仿真模型

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
计算工具

CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree elements (...)
计算工具

PINMUXTOOL — 用于 ARM® 和 F2837xD 微控制器的引脚复用实用程序

支持的器件: (...)
设计工具

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
封装 引脚 下载
FCBGA (CUS) 423 了解详情
POP-FCBGA (CBC) 515 了解详情
POP-FCBGA (CBP) 515 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

推荐产品的参数、评估模块或参考设计可能与此 TI 产品相关

支持与培训

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