产品详细信息

Arm CPU 1 Arm Cortex-A8 Arm MHz (Max.) 800, 1000 Co-processor(s) GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (C) -40 to 105, -40 to 90, 0 to 90
Arm CPU 1 Arm Cortex-A8 Arm MHz (Max.) 800, 1000 Co-processor(s) GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (C) -40 to 105, -40 to 90, 0 to 90
FC/CSP (CUS) 423 256 mm² 16 x 16 POP-FCBGA (CBC) 515 196 mm² 14 x 14 POP-FCBGA (CBP) 515 144 mm² 12 x 12
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

下载

Limited design support from TI available

This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.

技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 DM3730、DM3725 数字媒体处理器 数据表 (Rev. D) 2011年 4月 11日
* 勘误表 DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* 用户指南 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
应用手册 TMS320C6472 DDR2 Implementation Guidelines 2019年 3月 20日
技术文章 Bringing the next evolution of machine learning to the edge 2018年 11月 27日
技术文章 How quality assurance on the Processor SDK can improve software scalability 2018年 8月 22日
更多文献资料 Ethernet Connectivity via GPMC 2018年 7月 6日
更多文献资料 AM37x/DM37x Schematic Checklist 2018年 7月 6日
更多文献资料 AM37x EVM Software Developer's Guide 2018年 7月 6日
技术文章 Clove: Low-Power video solutions based on Sitara™ AM57x processors 2016年 7月 21日
技术文章 Enabling Wi-Fi® and Bluetooth® connectivity on RTOS 2016年 4月 13日
应用手册 Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015年 8月 13日
应用手册 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
用户指南 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
更多文献资料 DM37x Design Network Partners 2012年 6月 5日
应用手册 TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011年 11月 3日
应用手册 Power Consumption Guide for the C66x 2011年 10月 6日
应用手册 PCB Design Requirements for OMAP3630, AM37x and DM37x Microprocessors 2011年 6月 15日
更多文献资料 DM3730 Product Bulletin 2010年 9月 7日
应用手册 Assembly Guidelines for 0.5mm Package-on-Package(PoP) Packages, Part II 2010年 6月 23日
应用手册 PCB Design Guidelines for 0.5mm Package-On-Package (PoP) Packages, Part I 2010年 6月 23日
应用手册 AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
应用手册 AM/DM37x Overview 2010年 6月 3日
应用手册 AM3715/03 Memory Subsystem 2010年 6月 3日
应用手册 AM3715/03 SDRC Subsystem Registers 2010年 6月 3日
应用手册 AM37x CUS Routing Guidelines 2010年 6月 3日
用户指南 Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005年 5月 23日
应用手册 Application Note 1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004年 5月 1日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

软件开发套件 (SDK)

ANDROIDSDK-DM37X — 用于 DM37x 达芬奇视频处理器的 Android 开发套件

虽然起初专为移动手持终端而设计,Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。


Android 操作系统的亮点在于:

  • 完整的开放源码软件解决方案
  • 基于 Linux
  • 针对商业开发的简洁许可条款 (Apache)
  • 包含一个完整的应用框架
  • 允许通过 Java 轻松集成定制开发应用
  • 开包即用的多媒体、图形和图形用户界面
  • 大量 Android 和应用开发人员供随时调遣

相关信息:

查看:TI E2E Android 论坛

软件开发套件 (SDK)

LINUXDVSDK-DM37X — 用于 DM3730/3725 数字媒体处理器的 Linux 数字视频软件开发套件 (DVSDK)

用于 DaVinci™ 处理器的 Linux 数字视频软件开发套件 (DVSDK) 可向开发者提供所需的一切功能,助其评估和开始开发 DM37x Cortex™-A8 DSP+ARM® 微处理器。使用附带的基于图形用户界面 (GUI) 的 Matrix 应用程序启动器,即可轻松启用演示、基准和应用。此外,开发者还能轻松开发应用,并将其添加到 Matrix 应用程序启动器。 DVSDK 还包括 DSP 加速音频视频编解码器,以及可轻松利用 DSP 进行其它信号处理任务的工具。

此版本是 Linux DVSDK 4.x 版的正式 (GA) 版。所支持的平台包括 TMS320DM365、OMAP-L138 和 TMS320DM3730/25 处理器。
 

其它信息:

驱动程序或库

TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER

软件编程工具

FLASHTOOL — 用于 AM35x、AM37x、DM37x 和 OMAP35x 器件的 FlashTool

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

仿真模型

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
仿真模型

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
仿真模型

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
仿真模型

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
仿真模型

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
仿真模型

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
计算工具

PINMUXTOOL — 用于 ARM® 和 F2837xD 微控制器的引脚复用实用程序

支持的器件: (...)
设计工具

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
参考设计

TIDA-00408 — 面向楼宇自动化和医疗应用的压电式反馈电容触摸显示器参考设计

采用触摸反馈的 TIDA-00408 触摸显示屏参考设计展示了用于恒温器、自动化建立、工厂自动化、销售点和汽车应用的触摸技术。当用户与屏上用户界面进行交互时,触摸屏会提供触摸反馈。该参考设计包含一块 7” 电容式触摸显示屏、一个 DRV2667 Piezo 触摸驱动器和两个 Piezo 传动器。
封装 引脚 下载
FCBGA (CUS) 423 了解详情
POP-FCBGA (CBC) 515 了解详情
POP-FCBGA (CBP) 515 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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支持与培训

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