产品详情

CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBP) 515 144 mm² (12 mm × 12 mm) FCCSP (CUS) 423 256 mm² (16 mm × 16 mm) FCCSP (CBC) 515 196 mm² (14 mm × 14 mm)
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 DM3730、DM3725 数字媒体处理器 数据表 (Rev. D) 2011-4-11
* 勘误表 DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014-2-13
应用手册 OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles PDF | HTML 2019-3-20
技术文章 Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016-4-13
技术文章 Spring has sprung. A sale has sprung. PDF | HTML 2016-4-4
应用手册 Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015-8-13
技术文章 Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015-6-26
应用手册 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013-11-1
用户指南 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012-9-10
用户指南 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012-9-10
更多文献资料 DM37x Design Network Partners 2012-6-5
应用手册 TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011-11-3
应用手册 Introduction to TMS320C6000 DSP Optimization 2011-10-6
应用手册 PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011-6-15
产品概述 DM3730 Product Bulletin 2010-9-7
应用手册 PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010-6-23
应用手册 PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010-6-23
应用手册 AM/DM37x Power Estimation Spreadsheet 2010-6-7
应用手册 AM/DM37x Overview 2010-6-3
应用手册 Setting up AM37x SDRC Registers 2010-6-3
应用手册 AM37x CUS Routing Guidelines 2010-6-3
应用手册 AM3715/03 Memory Subsystem 2010-6-3
用户指南 Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005-5-23
应用手册 AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004-5-1

设计与开发

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评估板

BEACN-3P-TORPEDO — Beacon EmbeddedWorks DM3730/AM3703 Torpedo™ 系统级模块 (SoM)

DM3730/AM3703 Torpedo 系统级模块 (SoM) 是一款紧凑型、生产就绪的平台,基于德州仪器 (TI) DaVinci™ DM3730 和 Sitara™ AM3703 处理器构建。Torpedo 尺寸仅为 15mm × 27mm,将处理器、存储器、电源管理和基本系统功能集成于超小尺寸中,帮助工程师降低设计复杂性并加速开发进程。

DM3730 型号将 1GHz ARM® Cortex™-A8 处理器与 TMS320C64x+™ DSP 和 PowerVR SGX™ 图形加速器相结合,适用于多媒体、视觉和显示密集型应用。提供面向 Linux®、Android™ 和 (...)

支持的产品和硬件
软件开发套件 (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

虽然起初专为移动手持终端而设计,Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。


Android 操作系统的亮点在于:

  • 完整的开放源码软件解决方案
  • 基于 Linux
  • 针对商业开发的简洁许可条款 (Apache)
  • 包含一个完整的应用框架
  • 允许通过 Java 轻松集成定制开发应用
  • 开包即用的多媒体、图形和图形用户界面
  • 大量 Android 和应用开发人员供随时调遣

相关信息:

查看:TI E2E Android 论坛

支持的产品和硬件
软件开发套件 (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

虽然起初专为移动手持终端而设计,Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。


Android 操作系统的亮点在于:

  • 完整的开放源码软件解决方案
  • 基于 Linux
  • 针对商业开发的简洁许可条款 (Apache)
  • 包含一个完整的应用框架
  • 允许通过 Java 轻松集成定制开发应用
  • 开包即用的多媒体、图形和图形用户界面
  • 大量 Android 和应用开发人员供随时调遣

相关信息:

查看:TI E2E Android 论坛

支持的产品和硬件
软件开发套件 (SDK)

LINUXDVSDK-DM37X — 用于 DM3730/3725 数字媒体处理器的 Linux 数字视频软件开发套件 (DVSDK)

用于 DaVinci™ 处理器的 Linux 数字视频软件开发套件 (DVSDK) 可向开发者提供所需的一切功能,助其评估和开始开发 DM37x Cortex™-A8 DSP+ARM® 微处理器。使用附带的基于图形用户界面 (GUI) 的 Matrix 应用程序启动器,即可轻松启用演示、基准和应用。此外,开发者还能轻松开发应用,并将其添加到 Matrix 应用程序启动器。 DVSDK 还包括 DSP 加速音频视频编解码器,以及可轻松利用 DSP 进行其它信号处理任务的工具。

此版本是 Linux DVSDK 4.x 版的正式 (GA) 版。所支持的平台包括 (...)

支持的产品和硬件
驱动程序或库

TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

支持的产品和硬件
软件编程工具

FLASHTOOL — 用于 AM35x、AM37x、DM37x 和 OMAP35x 器件的 FlashTool

支持的产品和硬件
仿真模型

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507 (9 KB) - BSDL 模型
支持的产品和硬件
仿真模型

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS 模型
支持的产品和硬件
仿真模型

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL 模型
支持的产品和硬件
仿真模型

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS 模型
支持的产品和硬件
仿真模型

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL 模型
支持的产品和硬件
仿真模型

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS 模型
支持的产品和硬件
参考设计

TIDA-00408 — 适用于 Bldg 自动化和医疗应用的触觉反馈电容式触控显示屏的参考设计

TIDA-00408 具有触觉反馈的触觉显示参考设计展示了恒温器、楼宇自动化、工厂自动化、销售终端及汽车应用的触觉体验。  当用户与屏幕上的用户界面交互时,触摸屏可提供触摸反馈。  该参考设计包括一个 7 英寸电容式触摸显示屏、一个 DRV2667 压电式触觉驱动器及两个压电式传动器。

支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
FCCSP (CBC) 515 Ultra Librarian

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