产品详情

Output type AC-LVPECL, Custom Swing, HS-LVDS, LP-HCSL Output frequency (MHz) 100, 156.25, 312.5, 625, 2500 Stability (ppm) +/- 20, +/-25 Supply voltage (V) 2.5, 3.3 Operating temperature range (°C) -40 to 105 Jitter (ps) 9.3 Frequency range 50MHz - 2.5GHz
Output type AC-LVPECL, Custom Swing, HS-LVDS, LP-HCSL Output frequency (MHz) 100, 156.25, 312.5, 625, 2500 Stability (ppm) +/- 20, +/-25 Supply voltage (V) 2.5, 3.3 Operating temperature range (°C) -40 to 105 Jitter (ps) 9.3 Frequency range 50MHz - 2.5GHz
VSON (DLR) 6 3.2 mm² 2 x 1.6
  • Industry’s lowest jitter:
    • 9.3fs typical differential RMS jitter at 625MHz HS-LVDS with 4MHz 1st order high-pass filter (12kHz to 20MHz)
    • 19.7fs typical differential RMS jitter at 312.5MHz AC-LVPECL with 4MHz 1st order high-pass filter (12kHz to 20MHz)
    • 16fs typical RMS jitter at 2500MHz AC-LVPECL output (12kHz to 20MHz)
    • 18fs typical, 35fs max RMS jitter at 625MHz AC-LVPECL output (12kHz to 20MHz)
    • 28fs typical RMS jitter at 312.5MHz AC-LVPECL output (12kHz to 20MHz)
  • Exceptional PSRR performance (ripple frequencies > 10kHz, 50mV supply ripple, 0.1µF decoupling capacitor):
    • < -95dBc spurs for 156.25MHz LP-HCSL
    • < -80dBc spurs for 312.5MHz LVDS
  • Output frequency:
    • Initial frequency offerings: 100, 125, 156.25, 312.5, 625, 1250, 2500MHz, and others
    • Preview, contact TI: 322.265625, 390.625, 425, 496, 603.2291, 804.305467, 2343.75, 2400, 2412.91636, 2457.6, 2480, 2550, 2578.125MHz
      • Other fixed frequencies on request
  • Supports PCIe Gen 1 to Gen 7
  • Output formats:
    • LVDS, HS-LVDS, AC-LVPECL, Custom Swing: 50MHz to 2500MHz
    • LP-HCSL: 50MHz to 625MHz
  • ±25ppm total frequency stability (inclusive of all factors with 10-year aging at 25°C board temperature)
    • ±7ppm temperature variation (-40°C to 105°C)
  • Preview, contact TI: ±20ppm total frequency stability (inclusive of all factors with 10-year aging at 85°C board temperature)
  • 91mA maximum current consumption (AC-LVPECL, Custom Swing, LVDS, HS-LVDS)
  • 85mA maximum current consumption (LP-HCSL)
  • 2.5V / 3.3V power supply (2.375V through 3.465V)
  • Industry standard 6-pin package:
    • 2.0mm × 1.6mm (wettable flank)
    • Preview, contact TI: 2.5mm × 2.0mm, 3.2mm × 2.5mm
  • -40°C to 105°C PCB temperature
  • Industry’s lowest jitter:
    • 9.3fs typical differential RMS jitter at 625MHz HS-LVDS with 4MHz 1st order high-pass filter (12kHz to 20MHz)
    • 19.7fs typical differential RMS jitter at 312.5MHz AC-LVPECL with 4MHz 1st order high-pass filter (12kHz to 20MHz)
    • 16fs typical RMS jitter at 2500MHz AC-LVPECL output (12kHz to 20MHz)
    • 18fs typical, 35fs max RMS jitter at 625MHz AC-LVPECL output (12kHz to 20MHz)
    • 28fs typical RMS jitter at 312.5MHz AC-LVPECL output (12kHz to 20MHz)
  • Exceptional PSRR performance (ripple frequencies > 10kHz, 50mV supply ripple, 0.1µF decoupling capacitor):
    • < -95dBc spurs for 156.25MHz LP-HCSL
    • < -80dBc spurs for 312.5MHz LVDS
  • Output frequency:
    • Initial frequency offerings: 100, 125, 156.25, 312.5, 625, 1250, 2500MHz, and others
    • Preview, contact TI: 322.265625, 390.625, 425, 496, 603.2291, 804.305467, 2343.75, 2400, 2412.91636, 2457.6, 2480, 2550, 2578.125MHz
      • Other fixed frequencies on request
  • Supports PCIe Gen 1 to Gen 7
  • Output formats:
    • LVDS, HS-LVDS, AC-LVPECL, Custom Swing: 50MHz to 2500MHz
    • LP-HCSL: 50MHz to 625MHz
  • ±25ppm total frequency stability (inclusive of all factors with 10-year aging at 25°C board temperature)
    • ±7ppm temperature variation (-40°C to 105°C)
  • Preview, contact TI: ±20ppm total frequency stability (inclusive of all factors with 10-year aging at 85°C board temperature)
  • 91mA maximum current consumption (AC-LVPECL, Custom Swing, LVDS, HS-LVDS)
  • 85mA maximum current consumption (LP-HCSL)
  • 2.5V / 3.3V power supply (2.375V through 3.465V)
  • Industry standard 6-pin package:
    • 2.0mm × 1.6mm (wettable flank)
    • Preview, contact TI: 2.5mm × 2.0mm, 3.2mm × 2.5mm
  • -40°C to 105°C PCB temperature

The LMK6Bx device is an ultra-low jitter, fixed frequency oscillator achieving 9.3fs at 625MHz. This device incorporates the BAW as the resonator source. The device is factory programmed per specific operation mode, including frequency, output type, function pin, and frequency stability.

The high-performance clocking, mechanical stability, flexibility, and small package options for this device are designed for reference and core clocks in high-speed SerDes used in telecommunications, data and enterprise network, and industrial applications.

The LMK6Bx device is an ultra-low jitter, fixed frequency oscillator achieving 9.3fs at 625MHz. This device incorporates the BAW as the resonator source. The device is factory programmed per specific operation mode, including frequency, output type, function pin, and frequency stability.

The high-performance clocking, mechanical stability, flexibility, and small package options for this device are designed for reference and core clocks in high-speed SerDes used in telecommunications, data and enterprise network, and industrial applications.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 LMK6Bx Ultra Low Jitter, High-Performance BAW Oscillator 数据表 PDF | HTML 2026年 3月 10日
应用手册 Clocking LMK6Bx with TI Clock Buffers PDF | HTML 2026年 3月 11日
应用手册 The LMK6B: Revolutionizing Optical Module Performance with Industry-Leading Ultra-Low Jitter BAW Oscillators PDF | HTML 2026年 3月 11日
EVM 用户指南 LMK6B Evaluation Module PDF | HTML 2026年 3月 9日

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评估模块 (EVM) 用 GUI

LMK6B-GUI Prerelease GUI for LMK6B test chip

LMK6B test chip does not include e-fuse for frequency configuration. TICS Pro 2 profile for LMK6B test chip allows programming the test chip to arbitrary frequencies.
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PLLATINUMSIM-SW is a simulation tool that allows users to create detailed designs and simulations of our PLLatinum™ integrated circuits, which include the LMX series of phase-locked loops (PLLs) and synthesizers.

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VSON (DLR) 6 Ultra Librarian

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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