SPRUJB6B November 2024 – May 2025 AM2612
The device implements a system interconnect using TI’s Common Bus Architecture (CBA), composed of the VBUSM and VBUSP protocols.
The system is based on a multi-layered interconnect approach designed to meet high-performance system requirements. The interconnect structure consists of a full crossbar implementation, where every initiator has an independent communication path with every target, such that, transactions from each initiator has access to full interconnect bandwidth. Arbitration will only happen at the target end point with round-robin prioritization. Targets cannot generate read/write requests directly. However, they can respond to these requests by generating error events (as defined by the CBA protocol), interrupts, and DMA requests.
The device interconnect is partitioned into the following sections:
There are multiple targets for each of the above interconnects, these are detailed in later sections of the chapter.