CC2340R5-Q1

활성

512KB 플래시를 지원하는 오토모티브 등급 SimpleLink™ Bluetooth® 저에너지 무선 MCU

제품 상세 정보

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
VQFN (RHB) 32 25 mm² 5 x 5

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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13개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC2340R5-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. A) PDF | HTML 2025/07/30
* Errata CC2340R5-Q1 SimpleLink Wireless MCU Device Revision B Errata (Rev. B) PDF | HTML 2025/07/16
* User guide CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 2024/08/07
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 2026/02/04
Application note AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 2025/12/11
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025/11/18
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 2024/02/27
Application note CC2340 Bluetooth LE Software Product Brief (Rev. A) PDF | HTML 2023/11/06
Application note Hardware Migration to CC2340R5 PDF | HTML 2023/05/09
Certificate LP-EM-CC2340R5 EU RoHS Declaration of Conformity (DoC) (Rev. A) 2023/04/28
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022/03/22
Application note RF PCB Simulation Cookbook 2019/01/09
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 2017/10/02

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LP-EM-CC2340R5 — SimpleLink™ Bluetooth® 5.3 Low Energy MCU용 CC2340R5 LaunchPad™ 개발 키트

Bluetooth 5 LE(Low Energy) 및 2.4GHz 독점 프로토콜을 지원하는 SimpleLink Bluetooth Low Energy MCU를 이용한 개발을 가속화하는 데 사용되는 LaunchPad 개발 키트입니다. SimpleLink 저전력 F3 소프트웨어 개발 키트(SDK)가 소프트웨어 지원을 제공합니다.

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디버그 프로브

TMDSEMU110-U — XDS110 JTAG 디버그 프로브

텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어(Core) 및 시스템 트레이스(System Trace)를 지원합니다.  핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

(...)
사용 설명서: PDF
Download English Version: PDF
TI.com에서 구매할 수 없음
디버그 프로브

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

개발 키트

LP-XDS110 — XDS110 LaunchPad™ 개발 키트 디버거

LP-XDS110 LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110은 20핀 엣지 커넥터를 통해 분할 LaunchPad에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다.

TI.com에서 구매할 수 없음
개발 키트

LP-XDS110ET — XDS110ET LaunchPad™ 개발 키트 디버거(EnergyTrace™ 소프트웨어 포함)

LP-XDS110ET LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110ET는 20핀 엣지 커넥터를 통해 분할 LaunchPad 개발 키트에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 개발 키트 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다. LP-XDS110ET는 EnergyTrace™ 소프트웨어를 지원하기 위해 전력 측정용 회로를 추가했습니다.

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개발 키트

RFSTAR-3P-AUTO-BLE-MODULES — CC2642R-Q1 CC2340R5-Q1 기반의 RF-스타 차량용 BLE 모듈

RF-star는 10년 이상 무선 연결 모듈용 TI의 3P IDH로, BLE, Matter, ZigBee,Thread, Wi-Fi, Sub-1G 및 Wi-SUN 등 TI 제품에 기반을 둔 광범위한 무선 모듈 및 솔루션을 공급하는 데 주력하고 있습니다. 
RF-BM-2340QB1은 CC2340R5-Q1 AEC-Q100 호환 MCU를 기반으로 하는 오토모티브 Bluetooth® 5.3 저에너지 모듈입니다. RF-BM-2642QB1I 및 RF-BM-2642QB1은 CC2642R-Q1 AEC-Q100 호환 MCU를 기반으로 하는 차량용 (...)

개발 키트

TTC-3P-AUTO-MODULES — TTC automotive Bluetooth Low Energy modules

HY-42Q101 Bluetooth low energy single mode module is for AEC-Q100 qualified automotive 
applications, automotive device specification temperature Grade 2: ( –40°C to +105°C), 

HY-42Q101 is a single mode device, targeted for low-power energy sensors and accessories. 

HY-42Q101 offers all Bluetooth (...)

소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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찾아보기 다운로드 옵션
소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-FMNAP Find My Network Accessory Protocol (FMNAP) Plugin for SimpleLink devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

소프트웨어 개발 키트(SDK)

TTC-SR-2340080I1Q — TTC SR-2340080I1Q는 BLE RF 트랜스미터가 있는 고성능 듀플렉스 TPMS 칩입니다.

SR-2340080I1Q는 압력 센서, 온도 센서, 가속 센서, 배터리 전압 센서 및 저전력 Bluetooth로 구성된 완전 통합 TPMS 센서 칩입니다.
TTC는 동봉 SDK 개발 패키지를 제공하여 TPMS 센서의 측정 및 통신을 고객의 소프트웨어에서 제어하도록 합니다. 이로써 고객이 빠르게 통합할 수 있습니다.
이 SDK에는 기본 TPMS 기능에서 복잡한 자동 위치 조정 알고리즘에 이르기까지 다양한 펌웨어 라이브러리 및 프로젝트 예제가 포함되어 있습니다.
시작하기

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
온라인 교육

SIMPLELINK-ACADEMY-CC23XX Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

소프트웨어 프로그래밍 도구

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
지원 소프트웨어

SMARTRF-STUDIO-8 SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
계산 툴

BT-POWER-CALC Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

거버(Gerber) 파일

CC2340R5-Q1 LaunchPad Design Files

SWRR187.ZIP (4185 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RHB) 32 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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지원 및 교육

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품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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