홈 마이크로컨트롤러(MCU) 및 프로세서 마이크로프로세서 및 DSP 차량용 운전자 지원 SoC
홈
마이크로컨트롤러(MCU) 및 프로세서
마이크로프로세서 및 DSP
차량용 운전자 지원 SoC

TDA2EG-17

활성

ADAS 애플리케이션용 그래픽 및 비디오 가속화 기능을 갖춘 SoC 프로세서(17mm 패키지)

지금 주문하기
데이터 시트
정오표

TDA2EG-17

활성
데이터 시트 지금 주문하기

제품 상세 정보

CPU 1 Arm Cortex-A15 Frequency (MHz) 500, 800 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 2 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
CPU 1 Arm Cortex-A15 Frequency (MHz) 500, 800 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 2 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCCSP (CBD) 538 289 mm² 17 x 17
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • DDR3/DDR3L Memory Interface (EMIF) module
    • Supports up to DDR-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller With DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR™ SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port gigabit ethernet (GMAC)
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-Bit MPU watchdog timer
  • Six high-speed inter-integrated circuit (I2C) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface (QSPI)
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-speed USB 2.0 dual-role device
  • High-speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
  • PCI Express® 3.0 port with integrated PHY
    • One 2-lane Gen2-compliant port
    • or Two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® CSI-2 camera serial interface
  • Up to 186 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • DDR3/DDR3L Memory Interface (EMIF) module
    • Supports up to DDR-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller With DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR™ SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port gigabit ethernet (GMAC)
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-Bit MPU watchdog timer
  • Six high-speed inter-integrated circuit (I2C) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface (QSPI)
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-speed USB 2.0 dual-role device
  • High-speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
  • PCI Express® 3.0 port with integrated PHY
    • One 2-lane Gen2-compliant port
    • or Two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® CSI-2 camera serial interface
  • Up to 186 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.
filter 기타 차량용 운전자 지원 SoC 찾기
다운로드 스크립트와 함께 비디오 보기 비디오

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
34개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) datasheet (Rev. G) PDF | HTML 2019/11/25
* Errata TDA2x ADAS Applications Processor (Rev. K) PDF | HTML 2024/09/08
Application note Integrating virtual DRM between VISION SDK and PSDK on Jacinto6 SOC PDF | HTML 2021/05/05
Application note IVA-HD Sharing Between VISION-SDK and PSDKLA on Jacinto6 SoC PDF | HTML 2020/08/24
White paper Paving the way to self-driving cars with ADAS (Rev. A) 2020/07/24
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 2020/07/24
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020/01/06
Application note Integrating New Cameras With Video Input Port on DRA7xx SoCs PDF | HTML 2019/06/11
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019/06/10
User guide TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) TRM (Rev. D) 2019/05/21
Application note The Implementation of YUV422 Output for SRV 2018/08/02
Application note MMC DLL Tuning (Rev. B) 2018/07/31
Application note Integrating AUTOSAR on TI SoC: Fundamentals 2018/06/18
Application note ECC/EDC on TDAxx (Rev. B) 2018/06/13
Application note Sharing VPE Between VISIONSDK and PSDKLA 2018/05/04
Application note TMS320C66x XMC Memory Protection 2018/01/31
Application note DSS Bit Exact Output (Rev. A) 2018/01/12
Application note Flashing Utility - mflash 2018/01/09
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017/11/07
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017/11/03
Application note DSS BT656 Workaround for TDA2x (Rev. A) 2017/11/03
Functional safety information Safety Features on VisionSDK 2017/10/26
Application note Optimization of GPU-Based Surround View on TI’s TDA2x SoC 2017/09/12
White paper Step into next-gen architectures for multi-camera operations in automobiles 2017/06/16
White paper Making Cars Safer Through Technology Innovation (Rev. A) 2017/06/07
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016/12/15
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016/08/23
Application note ADAS Power Management 2016/03/07
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016/02/23
User guide Vision Application Board User's Guide 2016/02/09
White paper Surround view camera systems for ADAS (Rev. A) 2015/10/20
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014/08/13
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014/04/14
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 2013/10/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

개발 키트

D3-3P-RVP-TDA2X — TDA2 프로세서용 D3 임베디드 DesignCore® RVP-TDA2x 개발 키트

RVP-TDA2x는 하이엔드 ADAS 시스템을 위한 다중 카메라 플랫폼입니다. ARM A15 애플리케이션 프로세서 2개, 최대 4개의 EVE(Vision Acceleration PAC) 코프로세서, 하드웨어 가속 H.264 인코더가 포함되어 있습니다. 개발 키트는 8개의 카메라 입력을 지원하지만 필요에 따라 사용자 지정할 수 있습니다. 키트 구매에는 소프트웨어 배포 및 일회용 라이센스가 포함됩니다.

발송: D3 Embedded
파트너 사이트 방문
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
코드 예제 또는 데모

D3-3P-DEV — AI 카메라, 하드웨어, 드라이버 및 펌웨어에 대한 D3 임베디드 지원

D3 Embedded는 미국에 본사를 둔 기업으로, 비전과 mmWave 레이더 감지, 연결, 임베디드 프로세싱, AI를 통합해 고성능 응용 분야를 위한 포괄적인 솔루션을 제작하는 전문 업체입니다. D3 Embedded는 개발 부문에서 25년 넘게 축적한 경력을 바탕으로 사용자 지정 소프트웨어와 하드웨어 개발 서비스, ISP 기반 이미지 튜닝, AI와 알고리즘, 복잡한 DSP 프로세싱 체인 개발 서비스를 제공합니다. 특히 사내 전문가로 구성된 레이더 및 DSP 팀은 텍사스 인스트루먼트의 애플리케이션별 프로세서에 적합한 맞춤형 (...)
발송: D3 Embedded
View Options
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
운영 체제(OS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
발송: Green Hills Software
파트너 사이트 방문
시뮬레이션 모델

TDA2Ex-17 BSDL Model (Rev. A)

SPRM698A.ZIP (15 KB) - BSDL Model
다운로드
시뮬레이션 모델

TDA2Ex-17 IBIS Model

SPRM700.ZIP (9618 KB) - IBIS Model
다운로드
시뮬레이션 모델

TDA2Ex-17 Thermal Model

SPRM699.ZIP (2 KB) - Thermal Model
다운로드
계산 툴

CLOCKTREETOOL — Sitara, 오토모티브, 비전 분석 및 디지털 신호 프로세서용 클록 트리 툴

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
사용 설명서: PDF
View Options
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCCSP (CBD) 538 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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