홈 마이크로컨트롤러(MCU) 및 프로세서 마이크로프로세서 및 DSP 차량용 운전자 지원 SoC
홈
마이크로컨트롤러(MCU) 및 프로세서
마이크로프로세서 및 DSP
차량용 운전자 지원 SoC

TDA3LA

활성

ADAS 애플리케이션용 비전 가속화를 지원하는 저전력 SoC

지금 주문하기
데이터 시트
정오표

TDA3LA

활성
데이터 시트 지금 주문하기

제품 상세 정보

Rating Automotive Operating temperature range (°C) to
Rating Automotive Operating temperature range (°C) to
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
filter 기타 차량용 운전자 지원 SoC 찾기
다운로드 스크립트와 함께 비디오 보기 비디오
추가 정보 요청

이 제품군은 대량 자동차 제조업체가 사용할 수 있습니다. 자세한 내용은 TI 판매 담당자에 문의하십시오.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
30개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 2020/02/04
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 2019/10/01
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 2020/07/24
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020/01/06
User guide TDA3x Technical Reference Manual (Rev. D) 2019/07/29
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019/06/10
Application note TDA3xx Tester On Chip (TESOC) (Rev. A) 2018/10/19
Application note ECC/EDC on TDAxx (Rev. B) 2018/06/13
Application note TMS320C66x XMC Memory Protection 2018/01/31
Application note DSS Bit Exact Output (Rev. A) 2018/01/12
Application note Flashing Utility - mflash 2018/01/09
White paper Embedded low-power deep learning with TIDL 2017/12/08
Application note Dynamic Backup Lines PDF | HTML 2017/11/14
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017/11/07
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017/11/03
Application note DSS BT656 Workaround for TDA2x (Rev. A) 2017/11/03
Functional safety information Safety Features on VisionSDK 2017/10/26
Application note IISS Image Pipe for Alternate CFA Formats 2017/08/16
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016/12/15
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016/08/23
Application note ADC as Voltage Monitoring in TDA3x 2016/06/20
Application note TDA3xx ISS Tuning and Debug Infrastructure 2016/06/02
Application note ADAS Power Management 2016/03/07
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016/02/23
Application note TDA3x Error Signaling Module (ESM) 2016/01/26
White paper Surround view camera systems for ADAS (Rev. A) 2015/10/20
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014/08/13
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014/04/14
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 2013/10/16
White paper Empowering Automotive Vision with TI’s Vision AccelerationPac 2013/10/13

설계 및 개발

전원 공급 솔루션

TDA3LA에 사용 가능한 전원 공급 솔루션을 찾아보세요. TI는 칩(SoC), 프로세서, 마이크로컨트롤러, 센서 또는 FPGA(Field Programmable Gate Array)의 TI와 비TI 시스템을 위한 전원 공급 솔루션을 제공합니다.

솔루션 보기
평가 보드

D3-3P-RVP-TDA3X — TDA3 프로세서용 D3 임베디드 RVP-TDA3x 개발 키트

RVP-TDA3x는 저비용 ADAS(첨단 운전자 보조 시스템)를 위한 멀티 카메라 플랫폼입니다. 비전 가속 PAC(EVE)와 ISP(이미지 신호 프로세서)가 포함되어 있습니다. ARM 코어 또는 코덱은 포함되지 않습니다. 개발 키트는 4개의 카메라 입력을 지원하지만 필요에 따라 사용자 지정할 수 있습니다. 키트 구매에는 소프트웨어 배포 및 일회용 라이센스가 포함됩니다. 애플리케이션에는 전방 또는 후방 카메라, 2D/3D 서라운드 뷰, 레이더, 운전자 모니터링, CMS(카메라 모니터링 시스템)/미러 대체 기능이 포함되어 있습니다.

발송: D3 Embedded
파트너 사이트 방문
평가 보드

TDA3XEVM — TDA3X 평가 모듈

The TDA3x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for ADAS applications. The EVM is based on the TDA3x SoC, which incorporates a heterogeneous, scalable architecture that includes a mixture of the following:

  • TI’s (...)
발송: SVTRONICS INC
사용 설명서: PDF
View Options
디버그 프로브

LB-3P-TRACE32-DSP — DSP(디지털 신호 프로세서)용 Lauterbach TRACE32 디버그 및 트레이스 시스템

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

발송: Lauterbach GmbH
View Options
개발 키트

D3-3P-TDA3X-SK — TDA3 프로세서용 D3 임베디드 DesignCore® TDA3x 차량용 스타터 키트

벤치형 스타터 키트를 사용하면 생산 환경에서 설계된 전자 플랫폼에서 임베디드 ADAS 기술을 평가할 수 있습니다. 텍사스 인스트루먼트 TDA3x 고급 비전 프로세서를 기반으로, 실시간 비전 처리 및 분석을 위한 네 가지 FPD-Link III HD 데이터 스트림(비디오, 레이더, 라이더 등)의 동기 획득을 지원합니다. 키트 구매에는 TI 비전 SDK 및 D3 임베디드 고급 비전 소프트웨어 프레임워크에 대한 소프트웨어 배포판과 단일 사용 라이센스가 포함되어 있습니다.

발송: D3 Embedded
파트너 사이트 방문
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

Processor SDK-Vision (Vision SDK) and Processor SDK-Radar (Radar SDK) are multi-processor software development kits for TDAx processors. The software framework allows users to create different ADAS application data flows involving radar capture, radar processing, video capture, video (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
운영 체제(OS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

QNX Neutrino® RTOS(실시간 운영 체제)는 자동차, 의료, 운송, 군사 및 산업용 임베디드 시스템을 위한 차세대 제품을 지원하도록 설계된 모든 기능을 갖춘 견고한 RTOS입니다. 마이크로커널 설계 및 모듈식 아키텍처를 통해 고객은 낮은 총 소유 비용으로 고도로 최적화되고 안정적인 시스템을 만들 수 있습니다.
발송: QNX
파트너 사이트 방문
시뮬레이션 모델

TDA3x BSDL Model

SPRM714.ZIP (9 KB) - BSDL Model
다운로드
시뮬레이션 모델

TDA3x IBIS Model

SPRM702.ZIP (10940 KB) - IBIS Model
다운로드
시뮬레이션 모델

TDA3x Thermal Model

SPRM701.ZIP (1 KB) - Thermal Model
다운로드
계산 툴

CLOCKTREETOOL — Sitara, 오토모티브, 비전 분석 및 디지털 신호 프로세서용 클록 트리 툴

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
사용 설명서: PDF
View Options
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCBGA (ABF) 367 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상