제품 상세 정보

CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 704 RAM (kByte) 152 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Direction finding, Direction finding/AoA, End device, FTD, MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 704 RAM (kByte) 152 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Direction finding, Direction finding/AoA, End device, FTD, MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

다운로드 스크립트와 함께 비디오 보기 비디오

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
CC2652P 활성 전원 증폭기가 통합된 SimpleLink™ Arm Cortex-M4F 다중 프로토콜 2.4GHz 무선 MCU Pin-to-pin compatible with reduced flash and RAM.
CC2674P10 활성 SimpleLink™ Arm® Cortex®-M33 다중 프로토콜 2.4GHz 무선 MCU, 1MB 플래시 및 전원 증폭기 Pin-to-pin upgrade with increased flash and RAM

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
12개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC2652P7 SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU With Integrated Power Amplifier datasheet (Rev. A) PDF | HTML 2021/11/30
* Errata CC2652P7 Silicon Errata (Rev. A) PDF | HTML 2022/01/18
* User guide CC13x2x7 and CC26x2x7 Technical Reference Manual PDF | HTML 2023/02/24
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/08/06
Technical article TI extends support of Amazon Sidewalk to improve connectivity between homes, neighborhoods and cities PDF | HTML 2023/12/21
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022/03/22
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/02/25
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021/12/20
Application note Hardware Migration to CC2652R7 and CC2652P7 PDF | HTML 2021/11/10
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 2021/06/04
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 2021/04/12
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017/02/28

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

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발송: Amazon
개발 키트

RFSTAR-3P-CC2652-MODULES — CC2652R CC2652R7 CC2652P CC2652P7 기반 RFSTAR 다중 프로토콜 무선 모듈

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하드웨어 프로그래밍 도구

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SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — SimpleLink™ CC2xxx 장치에 대한 하드웨어 설계 검토

SimpleLink 하드웨어 설계 검토 프로세스는 설계를 검토하고 귀중한 피드백을 제공할 수 있는 주제 전문가와 일대일로 연락할 수 있는 방법을 제공합니다. 간단한 3단계 검토 요청 절차와 관련 기술 문서 및 리소스 링크는 여기서 확인할 수 있습니다.

시작하기

일반 설계 질문은 2.4GHz 하드웨어 설계 검토를 요청하기 전에 E2E 포럼에 게시해야 합니다.

하드웨어 설계 검토 요청 양식과 함께 전송할 다음 필수 문서가 준비되어 있는지 확인하세요:

  • 데이터 시트, 설계 가이드, 사용 설명서 및 기타 하드웨어 리소스와 같이 제품 (...)
거버(Gerber) 파일

CC1352-P7EM-XD7793-XD24-PA24_10dBm Design Files

SWRC379.ZIP (1951 KB)
거버(Gerber) 파일

CC1352-P7EM-XD7793-XD24-PA9093 Design Files

SWRC380.ZIP (1772 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RGZ) 48 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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