AM2754-Q1

활성

쿼드 코어 ARM® Cortex®-R5F, 10.75MB SRAM을 지원하는 차량용 오디오용 80GFLOPS DSP 마이크로컨트롤러

제품 상세 정보

CPU Arm-Cortex - R5F Features Hardware ASRC, Multichannel audio serial ports (McASP) Operating system RTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) to
CPU Arm-Cortex - R5F Features Hardware ASRC, Multichannel audio serial ports (McASP) Operating system RTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) to
FCCSP (ANJ) 361 249.64 mm² 15.8 x 15.8
  • Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
    • 32KB I-Cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 32KB D-cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
      • Two Banks, A and B, 32KB each
        • Bank B split into B0 and B1, 16KB each
      • 128KB TCM for CPU0 in lockstep mode
    • Up to 128KB Remote L2 Cache
      • 32B cache line
      • Up to 128KB L2 cache covering up to 16MB cacheable space
      • Read only, 8-way cache
      • Fast Local Copy (FLC) support
    • For each cluster, lockstep or independent dual core operation supported
  • Single or Dual C7x DSP core with each core running up to 1GHz
    • L1 memory architecture
      • 32KB I-Cache per core
      • 64KB D-Cache per core
    • L2 memory architecture
      • 2.25MB with ECC protection on L2 SRAM
        • 2MB "Main" segment
        • 256KB "Auxiliary" segment
    • Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
  • 2x Asynchronous Audio Sample Rate Converter (ASRC)
    • 140dB Signal-to-Noise ratio (SNR)
    • Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
    • Input and output sample rates from 8KHz to 216KHz
    • 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

  • Up to 6MB of On-Chip Shared SRAM
  • Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM

  • 432KB of On-Chip SRAM in SMS Subsystem
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
  • 2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
    • 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
    • 1x FSS supporting OSPI or HyperRAM
    • RAM expansion
  • 1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface
  • 5 × Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 8 × Universal Asynchronous RX-TX (UART) modules
  • 5 × Serial Peripheral Interface (SPI) controllers
  • 8 × Inter-Integrated Circuit (I2C) ports
  • 5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 3 × Enhanced Pulse Width Modulation (ePWM) modules
  • 6 × Enhanced Capture (ECAP) modules
  • 1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
  • Up to 167 General Purpose I/O (GPIO)
  • Integrated Ethernet Switch supporting (total 2 external ports)
    • RMII (10/100) or RGMII (10/100/1000)
    • IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Supports 802.1Qav (eAVB)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority flow control
    • Four CPU hardware interrupt pacing
    • IP/ UDP/ TCP checksum offload in hardware
  • USB 2.0
    • Port configurable as USB host, USB device, or USB Dual-Role device
    • Integrated USB VBUS detection
  • Hardware Security Module (HSM)
    • Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
    • Dedicated security DMA and IPC subsystem for isolated processing
  • Secure boot support
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES - 128/192/256-bit key sizes
      • SHA2 - 224/256/384/512-bit support
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
      • Supports Chinese crypto algorithms: SM3 and SM4
    • DMA support
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
  • Secure storage support
  • On-the-Fly encryption and support for OSPI interface in XIP mode
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-B targeted
    • Safety-related certification
      • ISO 26262 planned
  • Power modes supported by Device Manager:
    • Active
    • Standby
    • IO Retention
  • UART
  • I2C EEPROM
  • OSPI NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass Storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet
  • AEC-Q100 qualified for automotive applications
  • 16-nm FinFET technology
  • 15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP
  • Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
    • 32KB I-Cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 32KB D-cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
      • Two Banks, A and B, 32KB each
        • Bank B split into B0 and B1, 16KB each
      • 128KB TCM for CPU0 in lockstep mode
    • Up to 128KB Remote L2 Cache
      • 32B cache line
      • Up to 128KB L2 cache covering up to 16MB cacheable space
      • Read only, 8-way cache
      • Fast Local Copy (FLC) support
    • For each cluster, lockstep or independent dual core operation supported
  • Single or Dual C7x DSP core with each core running up to 1GHz
    • L1 memory architecture
      • 32KB I-Cache per core
      • 64KB D-Cache per core
    • L2 memory architecture
      • 2.25MB with ECC protection on L2 SRAM
        • 2MB "Main" segment
        • 256KB "Auxiliary" segment
    • Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
  • 2x Asynchronous Audio Sample Rate Converter (ASRC)
    • 140dB Signal-to-Noise ratio (SNR)
    • Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
    • Input and output sample rates from 8KHz to 216KHz
    • 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

  • Up to 6MB of On-Chip Shared SRAM
  • Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM

  • 432KB of On-Chip SRAM in SMS Subsystem
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
  • 2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
    • 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
    • 1x FSS supporting OSPI or HyperRAM
    • RAM expansion
  • 1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface
  • 5 × Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 8 × Universal Asynchronous RX-TX (UART) modules
  • 5 × Serial Peripheral Interface (SPI) controllers
  • 8 × Inter-Integrated Circuit (I2C) ports
  • 5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 3 × Enhanced Pulse Width Modulation (ePWM) modules
  • 6 × Enhanced Capture (ECAP) modules
  • 1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
  • Up to 167 General Purpose I/O (GPIO)
  • Integrated Ethernet Switch supporting (total 2 external ports)
    • RMII (10/100) or RGMII (10/100/1000)
    • IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Supports 802.1Qav (eAVB)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority flow control
    • Four CPU hardware interrupt pacing
    • IP/ UDP/ TCP checksum offload in hardware
  • USB 2.0
    • Port configurable as USB host, USB device, or USB Dual-Role device
    • Integrated USB VBUS detection
  • Hardware Security Module (HSM)
    • Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
    • Dedicated security DMA and IPC subsystem for isolated processing
  • Secure boot support
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES - 128/192/256-bit key sizes
      • SHA2 - 224/256/384/512-bit support
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
      • Supports Chinese crypto algorithms: SM3 and SM4
    • DMA support
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
  • Secure storage support
  • On-the-Fly encryption and support for OSPI interface in XIP mode
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-B targeted
    • Safety-related certification
      • ISO 26262 planned
  • Power modes supported by Device Manager:
    • Active
    • Standby
    • IO Retention
  • UART
  • I2C EEPROM
  • OSPI NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass Storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet
  • AEC-Q100 qualified for automotive applications
  • 16-nm FinFET technology
  • 15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm Cortex R5F and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

  • Extensive audio interfacing with 5x McASP peripherals
  • Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm Cortex R5F and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

  • Extensive audio interfacing with 5x McASP peripherals
  • Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

다운로드 스크립트와 함께 비디오 보기 비디오
추가 정보 요청

AM2754-Q1에 대한 기능 안전 고급 문서. 지금 요청

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
8개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet AM275x Signal Processing Microcontrollers datasheet (Rev. A) PDF | HTML 2025/07/27
* Errata AM275x Errata (Rev. A) PDF | HTML 2025/07/29
* User guide AM275x Technical Reference Manual (Rev. A) PDF | HTML 2025/08/19
Application note Throughput Characterization of OSPI and QSPI Serial NOR/NAND Flash Operations PDF | HTML 2026/02/17
Application note AM275x Audio Design Guide PDF | HTML 2025/11/20
Application brief AM275x Power Estimation Tool PDF | HTML 2025/10/20
Technical article TI AM275x Audio DSP: Reshape In-Vehicle Audio Technology PDF | HTML 2025/09/25
White paper 프리미엄 차량용 오디오를 위한 고도로 통합된 DSP가 운전 환경을 새롭게 정의하는 방법 PDF | HTML 2025/04/17

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

AUDIO-AM275-EVM — AM275x 오디오 평가모듈

AM275x 평가 모듈(EVM)은 AM275x 기능을 평가하고 다양한 멀티 채널 오디오 애플리케이션을 위한 프로토타입을 개발할 수 있는 독립형 테스트, 개발 및 평가 플랫폼입니다. AM275x EVM에는 AM275x 마이크로컨트롤러와 추가 부품이 포함되어 있어 사용자가 McASP 디지털 오디오 신호, 이더넷, USB 2.0, CAN-FD 등을 포함한 다양한 장치 인터페이스를 사용하여 프로토타입을 쉽게 제작할 수 있으며 온보드 전류 측정 기능을 통해 소비 전력을 모니터링할 수 있습니다. 내장된 에뮬레이션 로직과 함께 제공되는 (...)
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
평가 보드

DP83867-EVM-AM — 산업용 이더넷 PHY 애드온 보드용 AM2x 및 AM6x 평가 모듈

DP83867-EVM-AM은 Arm 기반 고성능 마이크로컨트롤러 평가 모듈과 함께 사용되는 산업용 이더넷 PHY 애드온 보드입니다. 이 애드온 보드는 EVM을 사용한 초기 이더넷 평가 및 프로토타이핑에 탁월한 선택입니다. DP83867-EVM-AM에는 RGMII 인터페이스 및 표준 RJ45 이더넷 네트워킹 커넥터와 함께 TI DP83867IR 저지연 10/100/1000Mbps PHY가 장착되어 있습니다. DP83867-EVM-AM은 AUDIO-AM275-EVM과 같은 이더넷 확장 커넥터가 있는 EVM에서 지원됩니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
평가 보드

TAS67CD-AEC — TAS67CD-AEC 클래스 D 증폭기 오디오 확장 카드

TAS67CD-AEC 애드온 카드는 2개의 4채널 TAS67x 클래스 D 오디오 증폭기 IC를 구현하며 AEC(오디오 확장 카드) 폼 팩터 커넥터를 통해 TI 오디오 DSP EVM과 호환됩니다. 각 애드온 카드는 최대 8개 채널의 50W 증폭 디지털 오디오 출력을 제공합니다.
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
디버그 프로브

LB-3P-TRACE32-ARM — Arm® 기반 마이크로컨트롤러 및 프로세서용 Lauterbach TRACE32® 디버그 및 트레이스 시스템

Lauterbach의 TRACE32® 툴은 개발자가 모든 종류의 Arm® 기반 마이크로컨트롤러 및 프로세서를 분석, 최적화 및 인증할 수 있도록 하는 첨단 하드웨어 및 소프트웨어 구성 요소 제품군입니다. 세계적으로 유명한 임베디드 시스템 및 SoC용 디버그 및 트레이스 솔루션은 초기 사전 실리콘 개발부터 현장의 제품 인증 및 문제 해결에 이르기까지 모든 개발 단계를 위한 완벽한 솔루션입니다. Lauterbach 툴의 직관적인 모듈형 설계는 엔지니어에게 현존하는 최고의 성능을 제공하고 요구 사항 변화에 따라 적응하고 성장하는 (...)

발송: Lauterbach GmbH
소프트웨어 개발 키트(SDK)

AM275-AWE-SDK Audio Weaver SDK based on AM275

This SDK provides a cohesive platform for audio signal chain processing by integrating with DSP Concepts' Audio Weaver (AWE). It includes the AM275-FREERTOS-SDK, low level drivers, and examples for audio signal chain layouts.
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지원되는 제품 및 하드웨어

소프트웨어 개발 키트(SDK)

AM275-FREERTOS-SDK FreeRTOS SDK for AM275 – RTOS, No-RTOS

This SDK contains the fundamental libraries, tools, and examples to develop RTOS and no-RTOS based applications, accompanied by "getting started" and developer user guides for AM275 peripherals
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

찾아보기 다운로드 옵션
드라이버 또는 라이브러리

AM275X-RESTRICTED-DOCS-ADVANCE AM275 Hardware Design Guidelines and Schematic Checklist

This NDA required folder will be updated regularly to contain all collaterals not yet approved for TI.com availability. This folder includes Hardware Design Guidelines and Schematic Checklist.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작하기

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

IDE, 구성, 컴파일러 또는 디버거

C7000-CGT C7000 code generation tools (CGT) - compiler

The TI C7000 C/C++ Compiler Tools support development of applications for TI C7000 Digital Signal Processor cores.

Code Composer Studio is the Integrated Development Environment (IDE) for TI embedded devices.  If you are looking to develop on a TI embedded device it is recommended to start (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

C7000-SAFETI-CQKIT-RV C7000 safety compiler qualification kit (leverages compiler release validations)

The Safety Compiler Qualification Kit was developed to assist customers in qualifying their use of the TI ARM, C6000, C7000 or C2000/CLA C/C++ Compiler to functional safety standards such as IEC 61508 and ISO 26262.

The Safety Compiler Qualification Kit:

  • is free of charge for TI customers
  • does (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

K3-RESOURCE-CONFIGURATION Resource partitioning tool for multi core SOCs

Also known as the k3-respart-tool, the Resource Configuration tool allows for configuration of various system level parameters and generate the necessary data to be fed into software components
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
온라인 교육

AM27X-ACADEMY AM27x Academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시뮬레이션 모델

AM275x BSDL Model

SPRM883.ZIP (7 KB) - BSDL Model
시뮬레이션 모델

AM275x IBIS Model

SPRM885.ZIP (153 KB) - IBIS Model
시뮬레이션 모델

AM275x Thermal Model

SPRM884.ZIP (1 KB) - Thermal Model
패키지 CAD 기호, 풋프린트 및 3D 모델
FCCSP (ANJ) 361 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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