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차량용 무선 커넥티비티 제품

CC2745R7-Q1

활성

864kB 플래시, HSM, APU, CAN-FD를 지원하는 차량용 SimpleLink™ Bluetooth® LE 무선 MCU

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CC2745R7-Q1

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제품 상세 정보

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 864 RAM (kByte) 128 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 10 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 864 RAM (kByte) 128 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 10 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
VQFN (RHA) 40 36 mm² (6 mm × 6 mm)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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기술 자료

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* 데이터 시트 CC274xR-Q1, CC274xP-Q1 Automotive SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. D) PDF | HTML 2025. 11. 5
* 사용 설명서 CC27xx Technical Reference Manual (Rev. A) PDF | HTML 2025. 5. 19
* 정오표 CC274xx-Q1 SimpleLink ™ Wireless MCU Device Revision E Errata (Rev. B) PDF | HTML 2026. 1. 6
애플리케이션 노트 Practical Software Debugging Methods and Software Design FAQs for CC27xx and CC23xx PDF | HTML 2026. 7. 15
Application brief CC27xx HSM Timing Benchmarks PDF | HTML 2026. 7. 13
사이버 보안 권고 Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 2026. 5. 28
사이버 보안 권고 Denial of Service during Bluetooth LE authentication and connection PDF | HTML 2026. 5. 28
사이버 보안 권고 Enabling Tools Client Mode Leads to Possibility of Bypassing Debug Authentication on CC27xx Devices PDF | HTML 2026. 5. 12
애플리케이션 노트 CC27xx Operation and Configuration Without an External 32kHz Crystal PDF | HTML 2026. 5. 11
애플리케이션 노트 CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 2026. 2. 4
애플리케이션 노트 AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 2025. 12. 11
애플리케이션 노트 How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025. 11. 18
인증서 LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) (Rev. A) 2025. 5. 13
기술 문서 저전력 무선 MCU로 주요 무선 연결 사이버 보안 문제 해결 (Rev. A) PDF | HTML Download English Version (Rev.A) 2024. 12. 16
애플리케이션 노트 High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 2024. 2. 27
애플리케이션 노트 RF PCB Simulation Cookbook 2019. 1. 9
애플리케이션 노트 CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) PDF | HTML 2017. 10. 2

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LP-EM-CC2745R10-Q1 — CC2745R10-Q1 SimpleLink™ 2.4GHz 무선 MCU용 LaunchPad™ 개발 키트

이 LaunchPad™ 개발 키트는 2.4GHz 작동을 위한 일체형 전력 증폭기 및 무선 지원을 갖춘 장치에서 개발 속도를 높여줍니다. LaunchPad에는 차량용 애플리케이션을 위해 Bluetooth® 저에너지(5.3 및 향후 버전)를 지원하는 AEC-Q100 준수 무선 마이크로컨트롤러(MCU)가 장착되어 있습니다. 이 키트는 분할 LaunchPad™ 개발 키트이며, 따라서 XDS 디버거가 포함되어 있지 않습니다. 권장 디버거는 LP-XDS110 or LP-XDS110ET입니다.

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LP-XDS110 — XDS110 LaunchPad™ 개발 키트 디버거

LP-XDS110 LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110은 20핀 엣지 커넥터를 통해 분할 LaunchPad에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다.

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LP-XDS110ET — XDS110ET LaunchPad™ 개발 키트 디버거(EnergyTrace™ 소프트웨어 포함)

LP-XDS110ET LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110ET는 20핀 엣지 커넥터를 통해 분할 LaunchPad 개발 키트에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 개발 키트 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다. LP-XDS110ET는 EnergyTrace™ 소프트웨어를 지원하기 위해 전력 측정용 회로를 추가했습니다.

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TMDSEMU110-U — XDS110 JTAG 디버그 프로브

텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어(Core) 및 시스템 트레이스(System Trace)를 지원합니다.  핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

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TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

발송: TASKING Germany GmbH
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소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

SimpleLink™ 저전력 SDK는 CC13xx, CC23xx, CC26xx 및 CC27xx 제품군을 지원합니다. 이러한 SDK는 SimpleLink CC13xx, CC23xx, CC26xx 및 CC27xx 무선 MCU에서 Bluetooth® 저에너지, Mesh, Zigbee®, Matter, Thread, 802.15.4 기반, 독점 및 멀티프로토콜 솔루션을 지원하는 등 Sub-1GHz 및 2.4GHz 애플리케이션 개발을 위한 포괄적인 소프트웨어 패키지를 제공합니다.

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CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
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IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

지원되는 제품 및 하드웨어
IDE, 구성, 컴파일러 또는 디버거

TSK-3P-VX-TOOLSET — Arm용 TASKING VX-toolset

Arm용 VX-Toolset은 일부 Cortex-M 및 Cortex-R 코어 장치의 안전 필수 임베디드 소프트웨어 개발을 위해 인증된 컴파일러 툴체인입니다. Eclipse IDE 통합, 고급 멀티코어 지원, TASKING BlueBox 디버거와의 호환성을 제공하는 VX-toolset은 개발을 단순화합니다. 최대 ASIL D까지의 ISO 26262 및 ISO 21434 규격 준수를 위해 TÜV NORD 인증을 획득했습니다.

발송: TASKING Germany GmbH
지원되는 제품 및 하드웨어
지원 소프트웨어

SMARTRF-STUDIO-8 — CC23xx, CC27xx 장치 및 CC140xP 트랜시버용 SmartRF Studio 8 애플리케이션 소프트웨어

SmartRF™ Studio는 RF 시스템 설계자가 모든 TI CC1xxx 및 CC2xxx 저전력 RF 장치 설계 공정의 초기 단계에 무선 기능을 손쉽게 평가할 수 있도록 지원하는 Windows 애플리케이션입니다. 구성 레지스터 값 및 명령의 생성과 RF 시스템의 실무 테스트 및 디버깅을 간소화합니다.

SmartRF Studio는 다음과 같은 TI 장치를 지원합니다.

 

리소스

지원되는 제품 및 하드웨어
계산 툴

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
지원되는 제품 및 하드웨어
인증

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
지원되는 제품 및 하드웨어
설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

SimpleLink 하드웨어 설계 검토 프로세스는 설계를 검토하고 귀중한 피드백을 제공할 수 있는 주제 전문가와 일대일로 연락할 수 있는 방법을 제공합니다. 간단한 3단계 검토 요청 절차와 관련 기술 문서 및 리소스 링크는 여기서 확인할 수 있습니다.

시작하기

일반 설계 질문은 2.4GHz 하드웨어 설계 검토를 요청하기 전에 E2E 포럼에 게시해야 합니다.

하드웨어 설계 검토 요청 양식과 함께 전송할 다음 필수 문서가 준비되어 있는지 확인하세요:

  • 데이터 시트, 설계 가이드, 사용 설명서 및 기타 하드웨어 리소스와 같이 제품 (...)
지원되는 제품 및 하드웨어
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
VQFN (RHA) 40 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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