CC1312R7

활성

704KB 플래시를 지원하는 SimpleLink™ Arm® Cortex®-M4F 다중 프로토콜 서브 1GHz 무선 MCU

제품 상세 정보

Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Proprietary, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1069-1329, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 152 Flash memory (kByte) 704 CPU Arm® Cortex®-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Sensitivity (best) (dBm) -121 Number of GPIOs 30 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Proprietary, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1069-1329, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 152 Flash memory (kByte) 704 CPU Arm® Cortex®-M4F Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Sensitivity (best) (dBm) -121 Number of GPIOs 30 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 25.2 µA in 2 MHz mode
    • 701 µA in 24 MHz mode
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 25.2 µA in 2 MHz mode
    • 701 µA in 24 MHz mode
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC1312R7 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty , Wi-SUN , proprietary systems, including the TI 15.4-Stack (Sub-1 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC1312R7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1312R7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. PHY and frequency band switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC1312R7 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1312R7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC1312R7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1312R7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC1312R7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC1312R7 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty , Wi-SUN , proprietary systems, including the TI 15.4-Stack (Sub-1 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC1312R7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1312R7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. PHY and frequency band switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC1312R7 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1312R7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC1312R7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1312R7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC1312R7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

다운로드 스크립트와 함께 비디오 보기 비디오

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
CC1314R10 활성 1MB 플래시 및 SRAM 최대 296KB의 SimpleLink™ Arm® Cortex®-M33 Sub-1 GHz 무선 MCU If in 7x7x, same pin out, larger flash and SRAM, better security, better MCU (M33), option to use 8x8 with more GPIOs

기술 자료

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15개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet CC1312R7 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU datasheet (Rev. A) PDF | HTML 2021/11/30
* Errata CC1312R7 Silicon Errata (Rev. A) PDF | HTML 2022/01/18
* User guide CC13x2x7 and CC26x2x7 Technical Reference Manual PDF | HTML 2023/02/24
Application note TI Wi-SUN® Network Performance PDF | HTML 2025/08/01
Product overview TI Wi-SUN® FAN Stack - Software Overview (Rev. B) PDF | HTML 2025/06/09
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/08/06
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2024/05/02
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 2024/04/09
Application note TI 15.4-Stack Software PDF | HTML 2023/10/17
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022/03/22
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 2022/02/07
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021/12/20
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 2021/06/04
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 2021/04/12
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017/02/28

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

도터 카드

BDE-3P-SUB1GHZ — BDE Sub-1GHz 모듈

BDE Technology, Inc.는 TI 인증을 받은 타사 모듈 공급자입니다. TI의 CC1XXX Sub-1GHz 무선 커넥티비티 제품에 기반을 둔 BDE 모듈을 사용하면 고객은 개발 주기 단축, 설계 불확실성 감소, 제품 비용을 낮추고, 경쟁력 있는 제품을 효율적으로 출시할 수 있습니다. BDE는 Amazon Sidewalk, Wi-SUN, mioty 및 무선 M-Bus와 같은 초저전력 무선 통신 기술을 전 세계의 OEM, 시스템 통합업체, 장치 제조업체 및 솔루션 제공업체에 제공하는 전문 기술을 제공합니다.

디버그 프로브

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발송: Lauterbach GmbH
개발 키트

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이 LaunchPad™ 개발 키트는 SimpleLink™ Sub-1GHz CC1312R7 무선 MCU를 사용하여 개발 속도를 높이는 데 사용됩니다. 소프트웨어 지원은 SIMPLELINK-LOWPOWER-SDK 소프트웨어 개발 키트에서 제공합니다.

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개발 키트

AMZN-3P-SIDEWALK-TOOLKIT — Amazon Sidewalk 개발 툴 키트

Amazon Sidewalk는 호환되는 Amazon Echo 및 Ring 장치와 같은 Amazon Sidewalk 브리지를 사용하여 가정, 건물 내, 전체 이웃은 물론 도시 전체 사용 사례를 포괄하는 안전하고 안정적인 커뮤니티 네트워크로, IoT 장치를 위한 클라우드 연결을 제공합니다. Amazon Sidewalk는 단거리 통신을 위한 Bluetooth® 저에너지를 사용하여 가정 및 그 이상의 저대역폭과 장거리 연결을 지원하고, 1GHz 미만 915MHz 주파수를 사용하여 더 먼 거리를 지원합니다. Amazon Sidewalk는 (...)

발송: Amazon
개발 키트

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WA12XX 시리즈는 UHF 고성능 디지털 무선 마이크 시스템으로, 무선 마이크, 레이저 포인터, PPT 페이지 플립 및 기타 기능이 통합되어 있습니다. 이 기능을 사용하면 사용 환경에서 깨끗한 채널을 자동으로 검색하여 채널을 빠르게 잠그고 간섭을 제거할 수 있습니다. 또한 적외선 주파수 페어링 모드가 탑재되어 열악한 사용 환경에서도 견딜 수 있습니다. 이 시리즈 제품은 UHF 주파수 대역에서 작동하므로 WiFi/2.4G/700MHz/5.8G의 간섭을 완벽하게 방지할 수 있습니다.

소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-F2-SDK SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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시작하기

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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지원되는 제품 및 하드웨어

IDE, 구성, 컴파일러 또는 디버거

SENSOR-CONTROLLER-STUDIO Sensor controller studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

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다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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온라인 교육

SIMPLELINK-ACADEMY-CC13XX-CC26XX SimpleLink™ CC13xx and CC26xx Academy

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계산 툴

PACKET-SNIFFER-2 SmartRF Packet Sniffer 2

The SmartRF Packet Sniffer is a PC software application that can display and store radio packets captured by a listening RF device. The capture device is connected to the PC via USB. Various RF protocols are supported. The Packet Sniffer filters and decodes packets and displays them in a convenient (...)

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계산 툴

SMARTRF-STUDIO-7 SmartRF Studio

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

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다운로드 옵션
설계 툴

SUB1GHZ-HW-DESIGN-REVIEW Hardware design reviews for SimpleLink™ CC1xxx devices

To get started with the SimpleLink™ Sub-1GHz hardware design review process:

  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC1xxx product page links below).
  • Step 2: (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RGZ) 48 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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