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  • LP-EM-CC2745R10-Q1 LaunchPad Development Kit for SimpleLink Bluetooth Low Energy MCU

    • SWRU635 May   2025 CC2744R7-Q1 , CC2745P10-Q1 , CC2745R10-Q1 , CC2745R7-Q1

       

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  • LP-EM-CC2745R10-Q1 LaunchPad Development Kit for SimpleLink Bluetooth Low Energy MCU
  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Energy Trace
    4. 2.4 Hardware and Debug Setup
      1. 2.4.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.4.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    5. 2.5 BoosterPack Connector Pinout
    6. 2.6 XDS110 Interface Connector
    7. 2.7 Debug Interface Connector
    8. 2.8 Jumper Information
    9. 2.9 Push Buttons
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 External Antenna
    2. 3.2 XDS110 GPIOs
    3. 3.3 Reset Selection on BoosterPack Connector
    4. 3.4 I2C Pullup Resistors
  10. 4Software
    1. 4.1 Getting Started
    2. 4.2 Out of Box Demo
  11. 5Hardware Design Files
    1. 5.1 Reference Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References
  15. IMPORTANT NOTICE
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EVM User's Guide

LP-EM-CC2745R10-Q1 LaunchPad Development Kit for SimpleLink Bluetooth Low Energy MCU

Description

This LaunchPad™ development kit speeds up development with the SimpleLink™Bluetooth® Low Energy MCU with support for Bluetooth Low Energy (LE) and 2.4GHz proprietary protocols. The SimpleLink Low Power F3 software development kit (SDK) provides software support.

Get Started

  1. Order the LP-EM-CC2745R10-Q1 device and either the LP-XDS110 or the LP-XDS110ET launch pad.
  2. Get the latest software development kit (SDK).
  3. Download the comprehensive reference design files in the TI reference design page.
  4. See the latest CC2745R10-Q1 product page.

Features

  • CC2745R10-Q1 wireless MCU
  • 32-bit Arm®Cortex®-M33 processor
  • Up to +10dBm output power
  • 2.4GHz PCB antenna with SMA connector for external antennas
  • 20-pin LP-EM Debug connector for a LaunchPad XDS110 Debugger (LP-XDS110 or LP-XDS110ET, sold separately and required for software development and RF evaluation)
  • 40-pin dual-gender BoosterPack™ connectors
  • Two LEDs
  • Two user buttons
  • Access to all I/O signals with the BoosterPack plug-in module connectors
  • 10-pin ArmCortex® debug connector
  • 8Mbit SPI flash memory for firmware updates

 
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