SPRUIL1D May 2019 – December 2024 DRA829J , DRA829J-Q1 , DRA829V , DRA829V-Q1 , TDA4VM , TDA4VM-Q1
The Peripheral Component Interconnect Express (PCIe) subsystem is built around a multi-lane dual-mode PCIe controller that provides low pin-count, high reliability, and high-speed data transfers at rates of up to 8.0 Gbps per lane for serial links on backplanes and printed wiring boards.
The device includes four instantiations of PCIe subsystem named PCIE0, PCIE1, PCIE2 and PCIE3. Table 12-406 shows the PCIe subsystem allocation within device domains:
| Module Instance | Domain | ||
| WKUP | MCU | MAIN | |
| PCIE0 | - | - | ✓ |
| PCIE1 | - | - | ✓ |
| PCIE2 | - | - | ✓ |
| PCIE3 | - | - | ✓ |
Figure 12-190 provides PCIe subsystems overview.
