The device includes a single instance (DSP1) of a digital signal processor (DSP) subsystem, based on the TI's standard TMS320C66x™ DSP CorePac core.
The TMS320C66x DSP core enhances the TMS320C674x™ core, which merges the C674x™ floating point and the C64x+™ fixed-point instruction set architectures. The C66x DSP is object-code compatible with the C64x+/C674x DSPs.
For more information on the TMS320C66x core CPU, see the TMS320C66x DSP CPU and Instruction Set Reference Guide, ( SPRUGH7).
The DSP subsystem integrated in the device includes the following components:
- A TMS320C66x™ CorePac DSP core that encompasses:
- L1 program-dedicated (L1P) cacheable memory
- L1 data-dedicated (L1D) cacheable memory
- L2 (program and data) cacheable memory
- Extended Memory Controller (XMC)
- External Memory Controller (EMC)
- DSP CorePac located interrupt controller (INTC)
- DSP CorePac located power-down controller (PDC)
- Dedicated enhanced data memory access engine - EDMA, to transfer data from/to memories and peripherals external to the DSP subsystem and to local DSP memory (most commonly L2 SRAM). The external DMA requests are passed through DSP system level (SYS) wakeup logic, and collected from the DSP1 dedicated outputs of the device DMA Events Crossbar for the subsystem.
- A level 2 (L2) interconnect network (DSP NoC) to allow connectivity between different modules of the subsystem or the remainder of the device via the device L3_MAIN interconnect.
- Two memory management units (on EDMA L2 interconnect and DSP MDMA paths) for accessing the device L3_MAIN interconnect address space
- Dedicated system control logic (DSP_SYSTEM) responsible for power management, clock generation, and connection to the device power, reset, and clock management (PRCM) module
Figure 5-1 is the DSP subsystem top-level architecture.