SPRUHZ7K August 2015 – April 2024 AM5706 , AM5708 , AM5716 , AM5718 , AM5718-HIREL
This section describes the external connections of the EMIF module.
Figure 15-46 shows an example EMIF DDR3/DDR3L configuration without ECC memory connected.
Figure 15-47 shows an example EMIF DDR3/DDR3L configuration with ECC memory connected.
For simplification the DDR PHYs and DDR I/Os are not shown. Only the I/O signals and their corresponding EMIF pins are shown.
Figure 15-46 EMIF DDR3/DDR3L Configuration Without ECC
Figure 15-47 EMIF DDR3/DDR3L Configuration With ECCTable 15-63 describes the EMIF module associated I/O signals used for connection to DDR3/DDR3L memory types.
| EMIF Pin Name | Device I/O Signal Names | I/O(1) | Description |
|---|---|---|---|
| EMIF1 Data PHYs | |||
| D[31:0] | ddr1_d[31:0] | I/O | Data bus |
| DQM[3:0] | ddr1_dqm[3:0] | O | Data mask |
| DQS[3:0] | ddr1_dqs[3:0] | I/O | Data strobe |
| DQSN[3:0] | ddr1_dqsn[3:0] | I/O | Data strobe invert |
| ECC_D | ddr1_ecc_d[7:0] | I/O | Data bus used for ECC |
| DQM_ECC | ddr1_dqm_ecc | O | Data mask used for ECC |
| DQS_ECC | ddr1_dqs_ecc | I/O | Data strobe used for ECC |
| DQSN_ECC | ddr1_dqsn_ecc | I/O | Data strobe invert used for ECC |
| EMIF1 Command PHYs | |||
| A[15:0] | ddr1_a[15:0] | O | Row/column address bus |
| BA[2:0] | ddr1_ba[2:0] | O | Bank select |
| CK | ddr1_ck | O | Differential clock |
| NCK | ddr1_nck | O | Differential clock |
| CSN[0] | ddr1_csn[0] | O | Active low rank select signal (chip select 0) |
| CSN[1] | ddr1_csn[1] | O | Active low rank select signal (chip select 1) |
| CKE | ddr1_cke | O | Clock enable |
| CASN | ddr1_casn | O | Command |
| RASN | ddr1_rasn | O | Command |
| WEN | ddr1_wen | O | Command |
| RST | ddr1_rst | O | Active low asynchronous reset |
| ODT[0] | ddr1_odt[0] | O | On-die termination enable signal for rank 0 |
| ODT[1] | ddr1_odt[1] | O | On-die termination enable signal for rank 1 |
Chip select 1 is not supported on this device.
The CKE memory pad is dynamically driven by the EMIF module according to the memory interface activity. The ddr1_cke pad can also be forced to tri-state by a dedicated Control Module register. For more information, see Section 15.3.4.17 Forcing CKE to tri-state.
The DDR memory connected to the DDR ECC bus does NOT need to be the same part number as the DDR memories connected to the DDR data bus. However, some constraints do apply. When selecting a memory for the DDR ECC bus, the following restrictions must be adhered to.
Compared to the DDR memories on the data bus, the DDR ECC memory must:
For a full list of supported DDR device types, frequencies, and topologies, refer to the routing guidelines of the device data manual.