CC2340R5-Q1

AKTIV

Drahtlos-MCU SimpleLink™ für Bluetooth® Low Energy mit 512 KB Flash und Qualifizierung für die Autom

Produktdetails

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.4 CPU Arm Cortex-M0+ Flash memory (kByte) 512 RAM (kByte) 36, 64 Number of GPIOs 19 TX power (max) (dBm) 8 Features AEC-Q100 Grade 2 qualified, DC/DC, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, ISO21434 automotive cybersecurity compliant Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, RNG TI functional safety category CS
VQFN (RHB) 32 25 mm² 5 x 5

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

Wireless microcontroller

  • AEC-Q100 Grade 2 qualified for automotive applications
  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 2.4GHz RF transceiver compatible with Bluetooth 5.4 Low Energy

  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode

  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode, RTC, 64KB RAM
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm for Bluetooth® Low Energy 125kbps
  • –96.5dBm for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • 19 I/O Pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • 15 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, eight external ADC inputs
  • 1× low-power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Product Cybersecurity Compliance

  • ISO 21434 compliant (Cybersecurity Assurance Level 2)
  • Developed for cybersecurity-relevant applications
  • Documentation available to aid cybersecurity system design

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40 to +125°C
  • HBM ESD Classification Level 2 (ESD CDM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level 2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

RoHS-compliant package

  • 5mm × 5mm RHB QFN32 with wettable flanks (19 GPIOs)

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as tire pressure monitoring systems (TPMS), car access, including key fobs used in passive entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth 5.4 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC2340R5-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. A) PDF | HTML 30 Jul 2025
* Errata CC2340R5-Q1 SimpleLink Wireless MCU Device Revision B Errata (Rev. B) PDF | HTML 16 Jul 2025
* User guide CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 07 Aug 2024
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 04 Feb 2026
Application note AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 11 Dez 2025
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 Nov 2025
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 27 Feb 2024
Application note CC2340 Bluetooth LE Software Product Brief (Rev. A) PDF | HTML 06 Nov 2023
Application note Hardware Migration to CC2340R5 PDF | HTML 09 Mai 2023
Certificate LP-EM-CC2340R5 EU RoHS Declaration of Conformity (DoC) (Rev. A) 28 Apr 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
Application note RF PCB Simulation Cookbook 09 Jan 2019
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 02 Okt 2017

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

LP-EM-CC2340R5 — CC2340R5 LaunchPad™-Development Kit für SimpleLink™ Bluetooth® 5.3 Low Energy-MCU

Dieses LaunchPad Entwicklungskit dient zur Beschleunigung der Entwicklung mit dem SimpleLink MCU für Bluetooth Low Energy mit Unterstützung von Bluetooth 5 Low Energy (LE) und proprietären 2,4-GHz-Protokollen. Softwareunterstützung wird bereitgestellt durch das SimpleLink Low Power (...)

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Benutzerhandbuch: PDF
Nicht verfügbar auf TI.com
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Entwicklungskit

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Der Debugger des LaunchPad-Entwicklungskits LP-XDS110 ist ein Tool zum Programmieren und Debuggen von Mikrocontrollern, Mikroprozessoren und DSP XDS-kompatiblen Bausteinen von Texas Instruments (TI). Der LP-XDS110 wurde für den direkten Anschluss an geteilte LaunchPads über den 20-poligen (...)

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Der Debugger des LaunchPad-Entwicklungskits LP-XDS110ET ist ein Tool zum Programmieren und Debuggen von Mikrocontrollern, Mikroprozessoren und DSP XDS-kompatiblen Bausteinen von Texas Instruments (TI). Der LP-XDS110ET wurde für den direkten Anschluss an geteilte LaunchPad-Entwicklungskits über den (...)

Entwicklungskit

RFSTAR-3P-AUTO-BLE-MODULES — RF-STAR-BLE-Modul für den Automobilbereich auf der Vasis von CC2642R-Q1 CC2340R5-Q1

RF-STAR von TI gibt es bereits seit mehr als einem Jahrzehnt als 3P IDH für drahtlose Verbindungsmodule und dient der Bereitstellung einer breiten Palette von drahtlosen Modulen und Lösungen auf der Basis von TI-Produkten, darunter BLE, Matter, ZigBee, Thread, Wi-Fi, Sub-1G und Wi-SUN. 
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Entwicklungskit

TTC-3P-AUTO-MODULES — TTC automotive Bluetooth Low Energy modules

HY-42Q101 Bluetooth low energy single mode module is for AEC-Q100 qualified automotive 
applications, automotive device specification temperature Grade 2: ( –40°C to +105°C), 

HY-42Q101 is a single mode device, targeted for low-power energy sensors and accessories. 

HY-42Q101 offers all Bluetooth (...)

Software-Entwicklungskit (SDK)

SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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Software-Entwicklungskit (SDK)

SIMPLELINK-LOWPOWER-FMNAP Find My Network Accessory Protocol (FMNAP) Plugin for SimpleLink devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

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Software-Entwicklungskit (SDK)

TTC-SR-2340080I1Q — TTC SR-2340080I1Q ist ein leistungsstarker Duplex-TPMS-Chip mit BLE-HF-Sender.

SR-2340080I1Q ist ein vollständig integrierter TPMS-Sensorchip, der aus einem Drucksensor, einem Temperatursensor, einem Beschleunigungssensor, einem Batteriespannungssensor und einem energieeffizienten Bluetooth besteht.
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Erste Schritte

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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Onlineschulungen

SIMPLELINK-ACADEMY-CC23XX Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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Support-Software

SMARTRF-STUDIO-8 SmartRF Studio 8 application software for CC23xx and CC27xx devices

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BT-POWER-CALC Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

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Gerberdatei

CC2340R5-Q1 LaunchPad Design Files

SWRR187.ZIP (4185 KB)
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RHB) 32 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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