CC2674R10

AKTIV

Multiprotokollfähiger, drahtloser SimpleLink™-Mikrocontroller Arm® Cortex®-M33, 2,4 GHz, 1 MB Flash

Produktdetails

CPU core Arm® Cortex®-M33 Technology 2.4 GHz proprietary, 6LoWPAN, Bluetooth low energy, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee 3.0 Flash memory (kByte) 1024 RAM (kByte) 296 Peripherals 12-bit ADC 8-channel, 2 I2C, 2 comparators, 4 SSI, 4 UART, 4 timers, 8-bit DAC, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC), Sensor controller Features 15.4G PHY, Border router, Direction finding, Direction finding/AoA, End device, Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 42 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure debug, Secure firmware & software update, Secure storage Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Edge AI enabled No
CPU core Arm® Cortex®-M33 Technology 2.4 GHz proprietary, 6LoWPAN, Bluetooth low energy, Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Matter, Thread, Zigbee 3.0 Flash memory (kByte) 1024 RAM (kByte) 296 Peripherals 12-bit ADC 8-channel, 2 I2C, 2 comparators, 4 SSI, 4 UART, 4 timers, 8-bit DAC, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC), Sensor controller Features 15.4G PHY, Border router, Direction finding, Direction finding/AoA, End device, Multi-protocol dual-band, NCP, OAD, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 42 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure debug, Secure firmware & software update, Secure storage Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RSK) 64 64 mm² 8 x 8

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY, and MAC
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 4.0mA active mode, CoreMark
    • 83µA/MHz running CoreMark
    • 1.19µA standby mode, RTC, 256kB SRAM
    • 0.13µA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32µA in 2MHz mode
    • 849µA in 24MHz mode
  • Radio consumption:
    • 6.4mA RX at 2.4GHz
    • 7.3mA TX at 0dBm at 2.4GHz

Wireless protocol support

High-performance radio

  • -104dBm for Bluetooth® Low Energy 125kbps
  • -105dBm for IEEE 802.15.4-2006 2.4GHz OQPSK (coherent modem)

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (31 GPIOs)
  • 8mm × 8mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY, and MAC
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 4.0mA active mode, CoreMark
    • 83µA/MHz running CoreMark
    • 1.19µA standby mode, RTC, 256kB SRAM
    • 0.13µA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32µA in 2MHz mode
    • 849µA in 24MHz mode
  • Radio consumption:
    • 6.4mA RX at 2.4GHz
    • 7.3mA TX at 0dBm at 2.4GHz

Wireless protocol support

High-performance radio

  • -104dBm for Bluetooth® Low Energy 125kbps
  • -105dBm for IEEE 802.15.4-2006 2.4GHz OQPSK (coherent modem)

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (31 GPIOs)
  • 8mm × 8mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC2674R10 device is a multiprotocol and multiband 2.4GHz wireless microcontroller (MCU) supporting Thread, Zigbee, Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.92µA with full 256kB SRAM retention.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low Energy (–105dBm for 125kbps LE Coded PHY).

The CC2674R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more details, see the SimpleLink MCU platform.

In addition to the software compatibility, within the multiband wireless MCUs, there is pin-to-pin compatibility from 352kB of flash up to 1MB of flash in the 7mm × 7mm QFN package for maximum design scalability. For more information on TI’s 2.4GHz devices, see www.ti.com/bluetooth.

The SimpleLink™CC2674R10 device is a multiprotocol and multiband 2.4GHz wireless microcontroller (MCU) supporting Thread, Zigbee, Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.92µA with full 256kB SRAM retention.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low Energy (–105dBm for 125kbps LE Coded PHY).

The CC2674R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more details, see the SimpleLink MCU platform.

In addition to the software compatibility, within the multiband wireless MCUs, there is pin-to-pin compatibility from 352kB of flash up to 1MB of flash in the 7mm × 7mm QFN package for maximum design scalability. For more information on TI’s 2.4GHz devices, see www.ti.com/bluetooth.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU datasheet (Rev. B) 25 Apr 2024
* Errata CC2674R10 SimpleLink™ Wireless MCU Device Revision B (Rev. B) PDF | HTML 28 Jun 2023
* User guide CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 23 Mär 2023
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 Nov 2025
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 Aug 2024
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 Mai 2024
Application note Hardware Migration to CC2674R10 and CC2674P10 PDF | HTML 13 Jul 2023
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 12 Jul 2023
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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