CC2652P7

AKTIV

Multiprotokollfähige Drahtlos-MCU SimpleLink™ Arm® Cortex ®-M4F, 2,4 GHz, 704 kB Flash-Speicher, int

Produktdetails

CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 704 RAM (kByte) 152 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Direction finding, Direction finding/AoA, End device, FTD, MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 704 RAM (kByte) 152 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Direction finding, Direction finding/AoA, End device, FTD, MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC2652P7 SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU With Integrated Power Amplifier datasheet (Rev. A) PDF | HTML 30 Nov 2021
* Errata CC2652P7 Silicon Errata (Rev. A) PDF | HTML 18 Jan 2022
* User guide CC13x2x7 and CC26x2x7 Technical Reference Manual PDF | HTML 24 Feb 2023
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 Aug 2024
Technical article TI extends support of Amazon Sidewalk to improve connectivity between homes, neighborhoods and cities PDF | HTML 21 Dez 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 Dez 2021
Application note Hardware Migration to CC2652R7 and CC2652P7 PDF | HTML 10 Nov 2021
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 04 Jun 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 Apr 2021
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017

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Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
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