CC2640R2F-Q1

AKTIV

Für den Automobilbereich zugelassener drahtloser SimpleLink™-32-Bit-ARM Cortex-M3-Bluetooth ® Low En

Eine neuere Version dieses Produkts ist verfügbar

Ähnliche Funktionalität wie der verglichene Baustein.
CC2340R5-Q1 AKTIV Drahtlos-MCU SimpleLink™ für Bluetooth® Low Energy mit 512 KB Flash und Qualifizierung für die Autom This product offers an ARM Cortex M0+, more Flash, more RAM
CC2745R10-Q1 AKTIV Drahtlose SimpleLink™ Bluetooth® LE-MCU für den Automobilbereich mit 1 MB Flash, HSM, APU, CAN-FD This product offers an ARM Cortex-M33, more Flash, more RAM, integrated HSM and CAN-FD

Produktdetails

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 CPU Arm Cortex-M3 Flash memory (kByte) 128 RAM (kByte) 28 Number of GPIOs 31 TX power (max) (dBm) 5 Features AEC-Q100 Grade 2, LE 1M PHY, LE Coded PHY (long range), OAD, Over-the-air upgrade Peripherals 1 UART, 12-bit ADC 8-channel, 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug Cryptographic accelerators AES, TRNG Rating Automotive Operating temperature range (°C) -40 to 105
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 CPU Arm Cortex-M3 Flash memory (kByte) 128 RAM (kByte) 28 Number of GPIOs 31 TX power (max) (dBm) 5 Features AEC-Q100 Grade 2, LE 1M PHY, LE Coded PHY (long range), OAD, Over-the-air upgrade Peripherals 1 UART, 12-bit ADC 8-channel, 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug Cryptographic accelerators AES, TRNG Rating Automotive Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² (7 mm × 7 mm)
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful Arm Cortex-M3
    • EEMBC CoreMark Score: 142
    • Up to 48MHz clock speed
    • 275KB nonvolatile memory, including 128KB in-system Programmable Flash
    • Up to 28KB system SRAM, of which 20KB is ultra-low leakage SRAM
    • 8KB SRAM for Cache or system RAM use
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air (OTA) upgrade
  • Ultra-low power sensor controller
    • Can run autonomously from the rest of the system
    • 16-bit architecture
    • 2-KB ultra-low leakage SRAM for code and data
  • Efficient code size architecture, placing drivers, Bluetooth Low Energy Controller, and bootloader in ROM to make more flash available for the application
  • RoHS-compliant automotive grade package
    • 7mm × 7mm RGZ VQFN48 with wettable flanks>
  • Peripherals
    • 31 GPIOs, all digital peripheral pins can be routed to any GPIO
    • Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
    • 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
    • Continuous time comparator
    • Ultra-low power analog comparator
    • Programmable current source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-time clock (RTC)
    • AES-128 security module
    • True random number generator (TRNG)
    • Support for eight capacitive-sensing buttons
    • Integrated temperature sensor
  • External system
    • On-chip internal DC/DC converter
    • Very few external components
    • Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
  • Low power
    • Wide supply voltage range: 1.8V to 3.8V
    • Active mode RX: 6.1mA
    • Active mode TX at 0dBm: 7.0mA
    • Active mode TX at +5dBm: 9.3mA
    • Active mode MCU: 61µA/MHz
    • Active mode MCU: 48.5 CoreMark/mA
    • Active mode sensor controller: 0.4mA + 8.2µA/MHz
    • Standby: 1.3µA (RTC running and RAM/CPU retention)
    • Shutdown: 150nA (wake up on external events)
  • RF section
    • 2.4GHz RF transceiver compatible with Bluetooth Low Energy (BLE) 4.2 and 5 specifications
    • Excellent receiver sensitivity (–97dBm for Bluetooth Low Energy 1Mbps), selectivity, and blocking performance
    • Programmable output power up to +5dBm
    • Link budget of 102dB for Bluetooth Low Energy 1Mbps
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Development Tools and Software
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Microcontroller
    • Powerful Arm Cortex-M3
    • EEMBC CoreMark Score: 142
    • Up to 48MHz clock speed
    • 275KB nonvolatile memory, including 128KB in-system Programmable Flash
    • Up to 28KB system SRAM, of which 20KB is ultra-low leakage SRAM
    • 8KB SRAM for Cache or system RAM use
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air (OTA) upgrade
  • Ultra-low power sensor controller
    • Can run autonomously from the rest of the system
    • 16-bit architecture
    • 2-KB ultra-low leakage SRAM for code and data
  • Efficient code size architecture, placing drivers, Bluetooth Low Energy Controller, and bootloader in ROM to make more flash available for the application
  • RoHS-compliant automotive grade package
    • 7mm × 7mm RGZ VQFN48 with wettable flanks>
  • Peripherals
    • 31 GPIOs, all digital peripheral pins can be routed to any GPIO
    • Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
    • 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
    • Continuous time comparator
    • Ultra-low power analog comparator
    • Programmable current source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C, I2S
    • Real-time clock (RTC)
    • AES-128 security module
    • True random number generator (TRNG)
    • Support for eight capacitive-sensing buttons
    • Integrated temperature sensor
  • External system
    • On-chip internal DC/DC converter
    • Very few external components
    • Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
  • Low power
    • Wide supply voltage range: 1.8V to 3.8V
    • Active mode RX: 6.1mA
    • Active mode TX at 0dBm: 7.0mA
    • Active mode TX at +5dBm: 9.3mA
    • Active mode MCU: 61µA/MHz
    • Active mode MCU: 48.5 CoreMark/mA
    • Active mode sensor controller: 0.4mA + 8.2µA/MHz
    • Standby: 1.3µA (RTC running and RAM/CPU retention)
    • Shutdown: 150nA (wake up on external events)
  • RF section
    • 2.4GHz RF transceiver compatible with Bluetooth Low Energy (BLE) 4.2 and 5 specifications
    • Excellent receiver sensitivity (–97dBm for Bluetooth Low Energy 1Mbps), selectivity, and blocking performance
    • Programmable output power up to +5dBm
    • Link budget of 102dB for Bluetooth Low Energy 1Mbps
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 328 and EN 300 440 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Development Tools and Software

The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth® 4.2 and Bluetooth® 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

The CC2640R2F-Q1 device is part of the SimpleLink™ MCU platform from Texas Instruments™. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1GHz, Ethernet, Zigbee, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables users to add any combination of the portfolio’s devices into their design, allowing 100 percent code reuse when design requirements change. For more information, visit http://www.ti.com/wireless-connectivity/simplelink-solutions/overview/overview.html.

With very low active RF and MCU current consumption, in addition to flexible low power modes, the CC2640R2F-Q1 provides excellent battery life and allows long-range operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provide industry-leading RF performance that is required for the demanding automotive RF environment.

The CC2640R2F-Q1 wireless MCU contains a 32-bit Arm® Cortex®-M3 processor that runs at 48MHz as the main application processor and includes the Bluetooth® 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.

Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7mm × 7mm VQFN packagewith wettable flanks.The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.

The Bluetooth Low Energy Software Stack is available free of charge from ti.com.

The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth® 4.2 and Bluetooth® 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

The CC2640R2F-Q1 device is part of the SimpleLink™ MCU platform from Texas Instruments™. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1GHz, Ethernet, Zigbee, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables users to add any combination of the portfolio’s devices into their design, allowing 100 percent code reuse when design requirements change. For more information, visit http://www.ti.com/wireless-connectivity/simplelink-solutions/overview/overview.html.

With very low active RF and MCU current consumption, in addition to flexible low power modes, the CC2640R2F-Q1 provides excellent battery life and allows long-range operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provide industry-leading RF performance that is required for the demanding automotive RF environment.

The CC2640R2F-Q1 wireless MCU contains a 32-bit Arm® Cortex®-M3 processor that runs at 48MHz as the main application processor and includes the Bluetooth® 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.

Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7mm × 7mm VQFN packagewith wettable flanks.The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.

The Bluetooth Low Energy Software Stack is available free of charge from ti.com.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt CC2640R2F-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU for Automotive datasheet (Rev. C) PDF | HTML 25.03.2025
* Benutzerhandbuch CC13x0, CC26x0 SimpleLink™ Wireless MCU Technical Reference Manual (Rev. I) PDF | HTML 23.06.2020
* Errata CC2640R2F-Q1 SimpleLink™ Bluetooth® Low Energy Wireless MCU Silicon Errata (Rev. B) PDF | HTML 24.08.2018
Beratung zur Cybersicherheit Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 28.05.2026
Beratung zur Cybersicherheit Denial of Service during Bluetooth LE authentication and connection PDF | HTML 28.05.2026
Anwendungshinweis AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 11.12.2025
Anwendungshinweis How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18.11.2025
Anwendungshinweis Crystal Oscillator and Crystal Selection for the CC13xx, CC26xx, and CC23xx Family of Wireless MCUs (Rev. L) PDF | HTML 21.04.2025
Anwendungshinweis CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06.08.2024
Anwendungshinweis CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02.05.2024
Anwendungshinweis Bluetooth® Angle of Arrival (AoA) Antenna Design (Rev. A) PDF | HTML 07.06.2023
Anwendungshinweis Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25.02.2022
Beratung zur Cybersicherheit Bluetooth® Low Energy – Missing Length Check for UNPI Packets Over SPI 08.10.2020
Beratung zur Cybersicherheit Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17.07.2020
Beratung zur Cybersicherheit Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 05.06.2020
Beratung zur Cybersicherheit Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18.05.2020
Technischer Artikel Exploring connectivity trends for Bluetooth® Low Energy in the car PDF | HTML 19.02.2020
Anwendungshinweis Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27.01.2020
Technischer Artikel Bluetooth® Low Energy shifts gears for car access PDF | HTML 15.07.2019
Technischer Artikel Adding CAN nodes in Bluetooth® Low Energy PEPS systems PDF | HTML 11.06.2019
Anwendungshinweis Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10.01.2019
Anwendungshinweis Increase RAM Size on the CC2640R2F Bluetooth low energy Wireless MCU (Rev. A) 26.07.2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller PDF | HTML 27.02.2018
Whitepaper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 16.10.2017
Technischer Artikel Bluetooth® low energy makes automotive systems more automatic PDF | HTML 04.10.2017
Anwendungshinweis CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) PDF | HTML 02.10.2017
Whitepaper Bluetooth® low energy and the automotive transformation 25.09.2017
Whitepaper Enabling Wireless Firmware Update for Bluetooth® low energy Applications 28.08.2017
Anwendungshinweis Design Considerations for High Temperature Applications Using the CC2640R2F-Q1 15.08.2017
Anwendungshinweis Johanson Balun for the CC26xx Device Family 07.08.2017
Whitepaper IoT provokes change in ultra-low-power MCUs 19.07.2017
Weitere Dokumente SimpleLink™ Bluetooth® low energy CC2640R2 MCU Security (Rev. A) 26.05.2017
Whitepaper RTOS Power Management Emerges as a Key for MCU-based IoT Nodes (Rev. A) 11.05.2017
Benutzerhandbuch CC26x0/CC13x0 SimpleLink™ Wireless MCU Power Management Software Development Ref (Rev. A) PDF | HTML 17.04.2017
Anwendungshinweis ETSI EN 300 328 Blocking Test for Bluetooth Low Energy PDF | HTML 08.02.2017
Anwendungshinweis Hardware Migration From CC2640F128 to CC2640R2F 31.01.2017
Technischer Artikel 5 need to know facts about the new SimpleLink™ Bluetooth low energy CC2640R2F wire PDF | HTML 19.01.2017
Benutzerhandbuch TI-RTOS 2.20 for CC13xx/CC26xx SimpleLink Getting Started Guide (Rev. D) 17.06.2016
Anwendungshinweis Using the Wireless SimpleLink CC26xx in Ext Regulator Mode With the TPS62740 19.11.2015
Anwendungshinweis CC2640 Wireless MCU DC Supply Evaluation 05.10.2015
Anwendungshinweis Using GCC/GDB With SimpleLink CC26xx PDF | HTML 23.02.2015

Design und Entwicklung

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Evaluierungsplatine

LAUNCHXL-CC2640R2 — CC2640R2 LaunchPad™-Development Kit für drahtlose SimpleLink™ Bluetooth® Low Energy-MCU

Dieses LaunchPad™ beschleunigt die Entwicklung mit einer BLE-Verbindung (Bluetooth®-Low-Energy) unter Verwendung der Bausteine CC2640R2F oder CC2640R2L. Das kompatible SDK bietet einen vollständig qualifizierten Bluetooth 5-Protokollstapel für Single-Mode-BLE-Anwendungen, der den (...)

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TMDSEMU200-U — XDS200-USB-Debug-Tastkopf

Der XDS200 ist ein Debug-Tastkopf (Emulator) zum Debugging von Embedded-Bausteinen von TI. Für die meisten Bausteine wird die Verwendung der neueren, kostengünstigeren XDS110 (www.ti.com/tool/TMDSEMU110-U) empfohlen. Der XDS200 unterstützt eine große Zahl von Standards (IEEE1149.1, IEEE1149.7, SWD) (...)

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Debug-Tastkopf

LB-3P-TRACE32-WIRELESS — Debug-System Lauterbach TRACE32® für Funkverbindungen

Die TRACE32®-Tools von Lauterbach umfassen eine Suite hochmoderner Hardware- und Softwarekomponenten, mit denen Entwickler viele der Chips für die drahtlose Verbindung von TI analysieren, optimieren und zertifizieren können. Die weltweit anerkannten Debug-Lösungen für eingebettete Systeme bieten (...)

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Debug-Tastkopf

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Software-Entwicklungskit (SDK)

SIMPLELINK-CC2640R2-SDK — SimpleLink™-CC2640R2-Softwareentwicklungskit

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Software-Entwicklungskit (SDK)

SIMPLELINK-CC2640R2-SDK — SimpleLink™ CC2640R2 SDK – Bluetooth® Low Energy

Wichtiger Hinweis: Die SimpleLink-SDKs werden regelmäßig aktualisiert. Klicken Sie oben auf „Benachrichtigen“, um die neuesten Versions-Updates zu erhalten.

Dieses SDK enthält die lizenzfreien Bluetooth® Low Energy (BLE)-Software-Stacks von TI mit aller notwendigen Software, Beispielanwendungen und (...)

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IDE, Konfiguration, Compiler oder Debugger

ARM-CGT — ARM Code Generation Tools - Compiler

The TI Arm® compiler tools are an essential component of the CCStudio™ development ecosystem, providing robust support for TI Arm-based platforms. They are engineered to maximize the potential of TI Arm Cortex®-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the (...)

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ARM-CGT-CLANG — Arm® code generation tools - compiler

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CCSTUDIO-OPENOCD — OpenOCD Binary Releases

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SENSOR-CONTROLLER-STUDIO — Sensor controller studio

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SYSCONFIG — Standalone desktop version of SysConfig

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Onlineschulungen

SIMPLELINK-ACADEMY-CC2640R2 — SimpleLink™ C2640R2 Academy

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Erste Schritte

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

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BLE-STACK — Bluetooth-Softwarestack mit geringem Stromverbrauch

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UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

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Support-Software

PACKET-SNIFFER — SmartRF™ Packet Sniffer 2.18.1

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Berechnungstool

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

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Referenzdesign

CC2650EM-4XD-RD — CC2650EM-4XD-Referenzdesign

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CC2650EM-4XS-EXT-REG-RD — CC2650EM-4XS-EXT-REG-Referenzdesign

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CC2650EM-4XS-RD — CC2650EM-4XS-Referenzdesign

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CC2650EM-5XD-RD — CC2650EM-5XD-Referenzdesign

The CC2650EM-5XD reference design contains schematics and layout files for the CC2650 evauation module with the 5x5 mm package and differential RF output with external biasing. The reference design demonstrates good techniques for CC2650 decoupling and RF layout. For optimum RF performance, the (...)

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CC2650EM-MURBAL-RD — CC2650EM-MurBal-Referenzdesign

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Dieses Referenzdesign ist für PEPS (Passive Entry Passive Start)-Fahrzeugzugangssysteme vorgesehen, die den Standort eines Schlüsselanhängers mittels Bluetooth® Low Energy (BLE)-Technologie ermitteln. Das Design zeigt, wie ein Fahrzeug-BLE-Satellitenknoten implementiert werden kann, um den (...)
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