NEU

AM2752-Q1

AKTIV

32-GFLOPS-DSP-Prozessor für Automobilaudiosysteme mit Dual-Core-ARM®-Cortex®-R5F, 7,125 MB SRAM

Produktdetails

CPU Arm-Cortex - R5F Features Hardware ASRC, Multichannel audio serial ports (McASP) Operating system RTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) to
CPU Arm-Cortex - R5F Features Hardware ASRC, Multichannel audio serial ports (McASP) Operating system RTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) to
FCCSP (ANJ) 361 249.64 mm² 15.8 x 15.8
  • Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
    • 32KB I-Cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 32KB D-cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
      • Two Banks, A and B, 32KB each
        • Bank B split into B0 and B1, 16KB each
      • 128KB TCM for CPU0 in lockstep mode
    • Up to 128KB Remote L2 Cache
      • 32B cache line
      • Up to 128KB L2 cache covering up to 16MB cacheable space
      • Read only, 8-way cache
      • Fast Local Copy (FLC) support
    • For each cluster, lockstep or independent dual core operation supported
  • Single or Dual C7x DSP core with each core running up to 1GHz
    • L1 memory architecture
      • 32KB I-Cache per core
      • 64KB D-Cache per core
    • L2 memory architecture
      • 2.25MB with ECC protection on L2 SRAM
        • 2MB "Main" segment
        • 256KB "Auxiliary" segment
    • Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
  • 2x Asynchronous Audio Sample Rate Converter (ASRC)
    • 140dB Signal-to-Noise ratio (SNR)
    • Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
    • Input and output sample rates from 8KHz to 216KHz
    • 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

  • Up to 6MB of On-Chip Shared SRAM
  • Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM

  • 432KB of On-Chip SRAM in SMS Subsystem
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
  • 2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
    • 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
    • 1x FSS supporting OSPI or HyperRAM
    • RAM expansion
  • 1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface
  • 5 × Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 8 × Universal Asynchronous RX-TX (UART) modules
  • 5 × Serial Peripheral Interface (SPI) controllers
  • 8 × Inter-Integrated Circuit (I2C) ports
  • 5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 3 × Enhanced Pulse Width Modulation (ePWM) modules
  • 6 × Enhanced Capture (ECAP) modules
  • 1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
  • Up to 167 General Purpose I/O (GPIO)
  • Integrated Ethernet Switch supporting (total 2 external ports)
    • RMII (10/100) or RGMII (10/100/1000)
    • IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Supports 802.1Qav (eAVB)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority flow control
    • Four CPU hardware interrupt pacing
    • IP/ UDP/ TCP checksum offload in hardware
  • USB 2.0
    • Port configurable as USB host, USB device, or USB Dual-Role device
    • Integrated USB VBUS detection
  • Hardware Security Module (HSM)
    • Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
    • Dedicated security DMA and IPC subsystem for isolated processing
  • Secure boot support
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES - 128/192/256-bit key sizes
      • SHA2 - 224/256/384/512-bit support
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
      • Supports Chinese crypto algorithms: SM3 and SM4
    • DMA support
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
  • Secure storage support
  • On-the-Fly encryption and support for OSPI interface in XIP mode
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-B targeted
    • Safety-related certification
      • ISO 26262 planned
  • Power modes supported by Device Manager:
    • Active
    • Standby
    • IO Retention
  • UART
  • I2C EEPROM
  • OSPI NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass Storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet
  • AEC-Q100 qualified for automotive applications
  • 16-nm FinFET technology
  • 15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP
  • Dual or Quad-core Arm Cortex R5F CPU with each core running up to 1GHz
    • 32KB I-Cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 32KB D-cache with 64-bit ECC per CPU core
      • 4x8KB association
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
    • 64KB Tightly Coupled Memory (TCM) per core, with 32-bit ECC
      • Single Error Correction, Double Error Detection ECC protected per 64 bits
      • Two Banks, A and B, 32KB each
        • Bank B split into B0 and B1, 16KB each
      • 128KB TCM for CPU0 in lockstep mode
    • Up to 128KB Remote L2 Cache
      • 32B cache line
      • Up to 128KB L2 cache covering up to 16MB cacheable space
      • Read only, 8-way cache
      • Fast Local Copy (FLC) support
    • For each cluster, lockstep or independent dual core operation supported
  • Single or Dual C7x DSP core with each core running up to 1GHz
    • L1 memory architecture
      • 32KB I-Cache per core
      • 64KB D-Cache per core
    • L2 memory architecture
      • 2.25MB with ECC protection on L2 SRAM
        • 2MB "Main" segment
        • 256KB "Auxiliary" segment
    • Matrix Multiply Accelerator Version 2f (MMA2F) on DSP0
  • 2x Asynchronous Audio Sample Rate Converter (ASRC)
    • 140dB Signal-to-Noise ratio (SNR)
    • Up to 8 pairs of input and output streams (up to 16 channels total) per ASRC
    • Input and output sample rates from 8KHz to 216KHz
    • 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

  • Up to 6MB of On-Chip Shared SRAM
  • Remote Low latency L2 cache (RL2), software programmable, allocated from SRAM

  • 432KB of On-Chip SRAM in SMS Subsystem
    • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
  • 2 × Flash Sub Systems (FSS) that support Octal Serial Peripheral Interface (OSPI) at up to 166MHz SDR and 166MHz DDR at 1.8V and 3.3V with full XIP (eXecute In Place) which can be used for
    • 1x FSS supporting OSPI OptiFlash memory technology, Firmware Over-The-Air upgrades (FOTA), and On The Fly Advanced Encryption Standard (OTFA)
    • 1x FSS supporting OSPI or HyperRAM
    • RAM expansion
  • 1 × 8-bit Multi-Media Card/Secure Digital (eMMC/SD) interface
  • 5 × Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50MHz
    • Up to 26 Serial Data Pins across 5x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S) and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 8 × Universal Asynchronous RX-TX (UART) modules
  • 5 × Serial Peripheral Interface (SPI) controllers
  • 8 × Inter-Integrated Circuit (I2C) ports
  • 5 × Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 3 × Enhanced Pulse Width Modulation (ePWM) modules
  • 6 × Enhanced Capture (ECAP) modules
  • 1 × 12-bit Analog to Digital Converters (ADC) with 4MSPS maximum sampling rate
  • Up to 167 General Purpose I/O (GPIO)
  • Integrated Ethernet Switch supporting (total 2 external ports)
    • RMII (10/100) or RGMII (10/100/1000)
    • IEEE 1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Supports 802.1Qav (eAVB)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority flow control
    • Four CPU hardware interrupt pacing
    • IP/ UDP/ TCP checksum offload in hardware
  • USB 2.0
    • Port configurable as USB host, USB device, or USB Dual-Role device
    • Integrated USB VBUS detection
  • Hardware Security Module (HSM)
    • Dedicated dual-core ARM Cortex-M4F Security co-processor with dedicated interconnect for security
    • Dedicated security DMA and IPC subsystem for isolated processing
  • Secure boot support
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES - 128/192/256-bit key sizes
      • SHA2 - 224/256/384/512-bit support
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing: RSA-4096 bits, ECDSA, SM2DSA, Curve25519/448
      • Supports Chinese crypto algorithms: SM3 and SM4
    • DMA support
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
  • Secure storage support
  • On-the-Fly encryption and support for OSPI interface in XIP mode
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-B targeted
    • Safety-related certification
      • ISO 26262 planned
  • Power modes supported by Device Manager:
    • Active
    • Standby
    • IO Retention
  • UART
  • I2C EEPROM
  • OSPI NOR/NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass Storage
  • USB (device) boot from external host (DFU mode)
  • Ethernet
  • AEC-Q100 qualified for automotive applications
  • 16-nm FinFET technology
  • 15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm Cortex R5F and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

  • Extensive audio interfacing with 5x McASP peripherals
  • Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm Cortex R5F and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

  • Extensive audio interfacing with 5x McASP peripherals
  • Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD, UARTs, SPI and GPIOs.
  • Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
  • One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet AM275x Signal Processing Microcontrollers datasheet (Rev. A) PDF | HTML 27 Jul 2025
* Errata AM275x Errata (Rev. A) PDF | HTML 29 Jul 2025
* User guide AM275x Technical Reference Manual (Rev. A) PDF | HTML 19 Aug 2025
Application note AM275x Audio Design Guide PDF | HTML 20 Nov 2025

Design und Entwicklung

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Evaluierungsplatine

AUDIO-AM275-EVM — Evaluierungsmodul für Audio AM275x

Das AM275x Evaluierungsmodul (EVM) ist eine eigenständige Test-, Entwicklungs- und Evaluierungsplattform, mit welchem Entwickler die Funktionalität des Bausteins AM275x evaluieren und Prototypen für eine Vielzahl von Anwendungen entwickeln können. Das AM275x-EVM ist mit einem (...)
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Nicht verfügbar auf TI.com
Evaluierungsplatine

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Evaluierungsplatine

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Benutzerhandbuch: PDF | HTML
Software-Entwicklungskit (SDK)

AM275-AWE-SDK Audio Weaver SDK based on AM275

This SDK provides a cohesive platform for audio signal chain processing by integrating with DSP Concepts' Audio Weaver (AWE). It includes the AM275-FREERTOS-SDK, low level drivers, and examples for audio signal chain layouts.
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Software-Entwicklungskit (SDK)

AM275-FREERTOS-SDK FreeRTOS SDK for AM275 – RTOS, No-RTOS

This SDK contains the fundamental libraries, tools, and examples to develop RTOS and no-RTOS based applications, accompanied by "getting started" and developer user guides for AM275 peripherals
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Treiber oder Bibliothek

AM275X-RESTRICTED-DOCS-ADVANCE AM275 Hardware Design Guidelines and Schematic Checklist

This NDA required folder will be updated regularly to contain all collaterals not yet approved for TI.com availability. This folder includes Hardware Design Guidelines and Schematic Checklist.
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Erste Schritte

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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K3-RESOURCE-CONFIGURATION Resource partitioning tool for multi core SOCs

Also known as the k3-respart-tool, the Resource Configuration tool allows for configuration of various system level parameters and generate the necessary data to be fed into software components
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IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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Onlineschulungen

AM27X-ACADEMY AM27x Academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
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Simulationsmodell

AM275x BSDL Model

SPRM883.ZIP (7 KB) - BSDL Model
Simulationsmodell

AM275x IBIS Model

SPRM885.ZIP (153 KB) - IBIS Model
Simulationsmodell

AM275x Thermal Model

SPRM884.ZIP (1 KB) - Thermal Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCCSP (ANJ) 361 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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