TMS320F28332

AKTIV

C2000™-MCU, 32 Bit, mit 100 MIPS, FPU, 128 KB Flash, EMIF, 12b-ADC

Produktdetails

CPU 1 C28 Frequency (MHz) 150 Flash memory (kByte) 128 RAM (kByte) 68 ADC type 1 pipeline Total processing (MIPS) 150 Features External memory interface, FPU32 UART 3 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Number of ADC channels 16 Direct memory access (Ch) 6 SPI 1 QEP 2 USB No Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, I2C, SPI, UART Operating system FreeRTOS Nonvolatile memory (kByte) 128 Number of GPIOs 88 Number of I2Cs 1 Security Secure storage
CPU 1 C28 Frequency (MHz) 150 Flash memory (kByte) 128 RAM (kByte) 68 ADC type 1 pipeline Total processing (MIPS) 150 Features External memory interface, FPU32 UART 3 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Number of ADC channels 16 Direct memory access (Ch) 6 SPI 1 QEP 2 USB No Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, I2C, SPI, UART Operating system FreeRTOS Nonvolatile memory (kByte) 128 Number of GPIOs 88 Number of I2Cs 1 Security Secure storage
HLQFP (PTP) 176 676 mm² 26 x 26 LQFP (PGF) 176 676 mm² 26 x 26
  • High-performance static CMOS technology
    • Up to 150 MHz (6.67-ns cycle time)
    • 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x)
    • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • More than 2M × 16 address reach
  • On-chip memory
    • F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
    • F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
    • F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K × 16)
    • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock
    • Protects flash/OTP/RAM blocks
    • Prevents firmware reverse-engineering
  • Enhanced control peripherals
    • Up to 18 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to 6 event capture inputs
    • Up to 2 Quadrature Encoder interfaces
    • Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
    • Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals
    • Up to 2 CAN modules
    • Up to 3 SCI (UART) modules
    • Up to 2 McBSP modules (configurable as SPI)
    • One SPI module
    • One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 80-ns conversion rate
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced debug features
    • Analysis and breakpoint functions
    • Real-time debug using hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™ and SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options:
    • Lead-free, green packaging
    • 176-ball plastic Ball Grid Array (BGA) [ZJZ]
    • 179-ball MicroStar BGA™ [ZHH]
    • 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
    • 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]
    • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]
  • Temperature options:
    • A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
    • S: –40°C to 125°C (PTP, ZJZ)
    • Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)
  • High-performance static CMOS technology
    • Up to 150 MHz (6.67-ns cycle time)
    • 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x)
    • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • More than 2M × 16 address reach
  • On-chip memory
    • F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
    • F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
    • F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K × 16)
    • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock
    • Protects flash/OTP/RAM blocks
    • Prevents firmware reverse-engineering
  • Enhanced control peripherals
    • Up to 18 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to 6 event capture inputs
    • Up to 2 Quadrature Encoder interfaces
    • Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
    • Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals
    • Up to 2 CAN modules
    • Up to 3 SCI (UART) modules
    • Up to 2 McBSP modules (configurable as SPI)
    • One SPI module
    • One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 80-ns conversion rate
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced debug features
    • Analysis and breakpoint functions
    • Real-time debug using hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™ and SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options:
    • Lead-free, green packaging
    • 176-ball plastic Ball Grid Array (BGA) [ZJZ]
    • 179-ball MicroStar BGA™ [ZHH]
    • 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
    • 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]
    • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]
  • Temperature options:
    • A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
    • S: –40°C to 125°C (PTP, ZJZ)
    • Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

To learn more about the C2000 MCUs, visit the C2000™ real-time control MCUs page.

C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

To learn more about the C2000 MCUs, visit the C2000™ real-time control MCUs page.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet TMS320F2833x, TMS320F2823x Real-Time Microcontrollers datasheet (Rev. Q) PDF | HTML 08 Aug 2022
* Errata TMS320F2833x, TMS320F2823x Real-Time MCUs Silicon Errata (Rev. N) PDF | HTML 11 Apr 2022
* User guide TMS320x2833x, TMS320x2823x Technical Reference Manual 19 Mär 2020
Application note Serial Flash Programming of C2000 Microcontrollers (Rev. I) PDF | HTML 14 Aug 2025
User guide C2000 Real-Time Control Peripheral Reference Guide (Rev. U) PDF | HTML 11 Jul 2025
Product overview Safety Package for Automotive and Industrial Real-Time Microcontrollers (Rev. E) PDF | HTML 23 Jun 2025
Application note C2000™ MCU JTAG Connectivity Debug (Rev. C) PDF | HTML 12 Aug 2024
Application note Semiconductor and IC Package Thermal Metrics (Rev. D) PDF | HTML 25 Mär 2024
Product overview C2000™ Safety Mechanisms (Rev. B) 09 Nov 2023
Application note Migrating Software From 8-Bit (Byte) Addressable CPU’s to C28x CPU (Rev. A) PDF | HTML 19 Apr 2023
Application note TMS320F2833x/2823x to TMS320F2837xD/2837xS/2807x Migration Overview PDF | HTML 14 Jan 2022
Application note Enhancing the Computational Performance of the C2000™ Microcontroller Family (Rev. C) PDF | HTML 14 Dez 2021
Application note C2000™ Unique Device Number (Rev. B) PDF | HTML 17 Sep 2020
Application note EEPROM Emulation for Gen 2 C2000 Real-Time MCUs (Rev. A) 23 Jul 2020
Application note Configurable Error Generator for Controller Area Network PDF | HTML 19 Dez 2019
User guide TMS320C28x Extended Instruction Sets Technical Reference Manual (Rev. C) 29 Okt 2019
Application note Calculating Useful Lifetimes of Embedded Processors (Rev. B) PDF | HTML 07 Mai 2019
Application note MSL Ratings and Reflow Profiles (Rev. A) 13 Dez 2018
Application note Hardware Design Guidelines for TMS320F28xx and TMS320F28xxx DSCs (Rev. D) 18 Nov 2018
White paper Breakthrough technologies lead the solar power industry into the future 27 Jul 2018
White paper Exploring the evolution and optimization of wireless power transfer 27 Jul 2018
Certificate Certificate of Compliance 06 Jul 2018
Certificate Certificate of Compliance E352502-20130316 06 Jul 2018
Functional safety information IEC60730 Safety Library for TMS320F2802x 06 Jul 2018
Functional safety information IEC60730 Safety Library for TMS320F2803x 06 Jul 2018
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 06 Jul 2018
Functional safety information VDE Safety Certification Document 22 Jun 2018
Application note Dual Motor Ctl Using FCL and Perf Analysis Using SFRA on TMS320F28379D LaunchPad (Rev. A) 20 Mär 2018
User guide Fast Current Loop (C28x) Library 06 Mär 2018
Application note Performance Analysis of Fast Current Loop (FCL) in Servo 06 Mär 2018
Application note Programming TMS320x28xx and 28xxx Peripherals in C/C++ (Rev. E) PDF | HTML 19 Dez 2017
Application note Programming Examples for the TMS320x28xx eCAN (Rev. B) PDF | HTML 12 Sep 2017
Application note Copying Compiler Sections from Flash to RAM on the TMS320F28xxx DSCs (Rev. A) PDF | HTML 18 Aug 2017
White paper Designing the Next Generation of Industrial Drive and Control Systems (Rev. A) 12 Sep 2016
Application note Calculator for CAN Bit Timing Parameters PDF | HTML 22 Mär 2016
User guide TMS320C28x DSP CPU and Instruction Set (Rev. F) 10 Apr 2015
Application note Calculating FIT for a Mission Profile 24 Mär 2015
White paper Resolver-to-digital conversion implementation (Rev. A) 26 Mär 2014
User guide TMS320C28x Floating Point Unit and Instruction Set Reference Guide (Rev. B) 23 Jan 2014
Application note Sensorless Field Oriented Control of 3-Phase Induction Motors Using F2833x 29 Okt 2013
Functional safety information Safety Manual for C2000 MCUs in IEC60730 Safety Applications (Rev. A) 21 Aug 2013
Application note Sensorless Field Oriented Control:3-Phase Perm.Magnet Synch. Motors Using 2833x 01 Jul 2013
Application note Running an Application from Internal Flash Memory on the TMS320F28xxx DSP (Rev. L) 28 Feb 2013
User guide TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide (Rev. L) 09 Okt 2012
Application note Programming External Nonvolatile Memory Using SDFlash for TMS320C28x Devices 16 Nov 2009
Application note TMS320C28x FPU Primer (Rev. A) 20 Jul 2009
Application note Migrating from TMS320x280x to TMS320x2833x or 2823x (Rev. B) 01 Jul 2009
Application note Migrating from TMS320x281x to TMS320x2833x or 2823x (Rev. B) 08 Jun 2009
Application note Common Object File Format (COFF) 15 Apr 2009
Application note Migrating from TMS320x2833x/2823x to TMS320x2834x 03 Mär 2009
Application note Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x (Rev. A) 09 Sep 2008
Application note Flash Programming Solutions for the TMS320F28xxx DSCs 19 Aug 2008
User guide TMS320C28x Floating Point Unit and Instruction Set Reference Guide (Rev. A) 08 Aug 2008
Application note Interfacing the TMS320F2833x to the AIC23B Stereo Audio Codec 04 Aug 2008
Application note An Overview of Designing Analog Interface With TM320F28xx/28xxx DSCs (Rev. A) 14 Mai 2008
Application note Configuring Source of Multiple ePWM Trip-Zone Events 25 Okt 2007
Application note Custom Bootloader Options via One-Time Programmable (OTP) Memory 18 Sep 2007
Application note Interfacing SD/MMC Cards With TMS320F28xxx DSCs 26 Jul 2007
Application note TMS320280x and TMS320F2801x ADC Calibration (Rev. A) 06 Mär 2007
Application note Using Enhanced Pulse Width Modulator (ePWM) Module for 0-100% Duty Cycle Control 20 Dez 2006
Application note Using the eQEP Module in TMS320x280x as a Dedicated Capture 30 Nov 2006
Application note Migrating from TMS320x281x to TMS320x280x/2801x/2804x (Rev. A) 05 Okt 2006
Application note Online Stack Overflow Detection on the TMS320C28x DSP 02 Mai 2003

Design und Entwicklung

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C2000WARE C2000Ware for C2000 Microcontrollers

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Erste Schritte

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Support-Software

SPRC539 Download: TMS320F2833x Flash APIs (v2.00)

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Simulationsmodell

F28332 PGF BSDL Model

SPRM421.ZIP (4 KB) - BSDL Model
Simulationsmodell

F28332 PGF IBIS Model

SPRM409.ZIP (203 KB) - IBIS Model
Simulationsmodell

F28332 ZHH BSDL Model

SPRM422.ZIP (4 KB) - BSDL Model
Simulationsmodell

F28332 ZHH IBIS Model

SPRM410.ZIP (204 KB) - IBIS Model
Simulationsmodell

F28332 ZJZ BSDL Model

SPRM423.ZIP (4 KB) - BSDL Model
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F28332 ZJZ IBIS Model (Rev. A)

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12Vin Power Design (Rev. A)

SLVR334A.PDF (253 KB)
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
HLQFP (PTP) 176 Ultra Librarian
LQFP (PGF) 176 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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