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CC2652RB

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Multiprotokollfähige drahtloser SimpleLink™-MCU mit ARM Cortex-M4F (32 Bit), 2,4 GHz, mit quarzlosem

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CC2652RB

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Produktdetails

CPU Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Edge AI enabled No
CPU Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Edge AI enabled No
VQFN (RGZ) 48 49 mm² (7 mm × 7 mm)
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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CC2652P AKTIV Drahtlose SimpleLink™-MCU mit ARM Cortex-M4F, 2,4 GHz, mit Integriertem Leistungsverstärker This product offers an integrated power amplifier but does not offer BAW resonator solution.
CC2652R AKTIV Multiprotokollfähiger drahtloser SimpleLink™-Mikrocontroller ARM Cortex-M4F, 32 Bit, 2,4 GHz, 352 kB This product does not include the BAW resonator and requires an external 48MHz crystal.

Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. D) PDF | HTML 16.02.2021
* Benutzerhandbuch CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 28.06.2024
* Errata CC2652RB SimpleLink™ Multiprotocol 2.4-GHz MCU Device Revision E Silicon Errata (Rev. A) 04.12.2019
Anwendungshinweis Configuration methods for BQB RF-PHY testing and SRRC fixed frequency testing for TI Bluetooth products (Rev. A) PDF | HTML 29.05.2026
Anwendungshinweis How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18.11.2025
Anwendungshinweis CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06.08.2024
Anwendungshinweis CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02.05.2024
Anwendungshinweis Antenna Impedance Measurement and Matching PDF | HTML 22.03.2022
Auswahlhilfe Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) Download English Version (Rev.B) 07.03.2022
Anwendungshinweis Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25.02.2022
Anwendungshinweis Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20.12.2021
Weitere Dokumente Bluetooth® Low Energy connectivity solutions for automotive applications 15.12.2021
Anwendungshinweis Hardware Migration From CC26x0 to CC26x2R (Rev. D) 23.08.2021
Technischer Artikel How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic PDF | HTML 23.07.2021
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 13.05.2021
Whitepaper Dynamic Multi-Protocol (DMM) Performance 21.04.2021
Whitepaper Exploring Thread and Zigbee for home and building automation PDF | HTML 12.04.2021
Technischer Artikel Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy PDF | HTML 20.08.2020
Beratung zur Cybersicherheit Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17.07.2020
Beratung zur Cybersicherheit Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 05.06.2020
Beratung zur Cybersicherheit Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18.05.2020
Anwendungshinweis Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31.03.2020
Anwendungshinweis Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 05.02.2020
Anwendungshinweis Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28.01.2020
Anwendungshinweis Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27.01.2020
Anwendungshinweis Minimizing Frequency Error Due to Soldering Process on CC2652RB Crystal-Less MCU PDF | HTML 15.01.2020
Technischer Artikel Testing TI BAW resonator technology in mechanical shock and vibration environments PDF | HTML 09.01.2020
Technischer Artikel Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin PDF | HTML 02.01.2020
Whitepaper Exploring IoT wireless connectivity in mechanical shock and vibration environme 07.11.2019
Technischer Artikel VIDEO: TI Bulk Acoustic Wave (BAW) resonator technology with Bluetooth 5 PDF | HTML 26.09.2019
Anwendungshinweis Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 23.09.2019
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 06.06.2019
Anwendungshinweis Bluetooth® Low Energy Tree Structure Network PDF | HTML 29.05.2019
Anwendungshinweis Debugging Communication Range (Rev. A) PDF | HTML 23.05.2019
Anwendungshinweis Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs PDF | HTML 15.04.2019
Technischer Artikel Top 5 things to know about TI BAW resonator technology PDF | HTML 27.02.2019
Anwendungshinweis Getting Started With CC2652RB for Crystal-less BAW Operation PDF | HTML 20.02.2019
Whitepaper SimpleLink Crystal-Less Wireless MCU based on TI BAW technology 18.02.2019
Anwendungshinweis Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10.01.2019
Anwendungshinweis RF PCB Simulation Cookbook 09.01.2019
Benutzerhandbuch LP-CC2652RB quick start guide 21.12.2018
Anwendungshinweis Low-Power ADC Solution for CC13x2 and CC26x2 02.03.2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller PDF | HTML 27.02.2018
Anwendungshinweis Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 27.02.2018
Anwendungshinweis Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05.03.2017
Anwendungshinweis TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28.02.2017

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Erste Schritte

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
Unterstützte Produkte und Hardware
Software-Programmiertool

FLASH-PROGRAMMER-2 — SmartRF Flash Programmer v2

Mit dem SmartRF Flash Programmer 2 kann der Flash-Speicher in kabellosen, ARM-basierten energieeffizienten RF-MCU von Texas Instruments über Debugging und serielle Schnittstellen programmiert werden. Liste der unterstützten Produkte auf Kompatibilität überprüfen. Uniflash kann darüber hinaus zur (...)

Unterstützte Produkte und Hardware
Software-Programmiertool

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash ist Teil des umfassenden CCStudio™-Entwicklungsökosystem von TI und ein Softwaretool zur Programmierung des integrierten Flash-Speichers von TI-Mikrocontrollern und drahtlosen Kommunikationsbausteinen sowie des integrierten Flash-Speichers für TI-Prozessoren. UniFlash bietet sowohl (...)

Unterstützte Produkte und Hardware
Support-Software

RF-RANGE-ESTIMATOR — RF Range Estimator

This tool is used to calculate a range estimate for indoor and outdoor RF links using TI wireless devices. The outdoor calculation is based upon Line-of-Sight (LOS). For the indoor estimation, construction materials can be selected that are between the Tx and Rx unit. The greater the attenuation (...)
Unterstützte Produkte und Hardware
Berechnungstool

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
Unterstützte Produkte und Hardware
Berechnungstool

PACKET-SNIFFER-2 — SmartRF Packet Sniffer 2

The SmartRF Packet Sniffer is a PC software application that can display and store radio packets captured by a listening RF device. The capture device is connected to the PC via USB. Various RF protocols are supported. The Packet Sniffer filters and decodes packets and displays them in a convenient (...)

Unterstützte Produkte und Hardware
Berechnungstool

SMARTRF-STUDIO-7 — SmartRF Studio

SmartRF™ Studio ist eine Windows-Anwendung, die Entwickler von HF-Systemen dabei unterstützt, die Funkleistung bereits in einer frühen Entwicklungsphase für alle stromsparenden HF-Bausteine CC1xxx und CC2xxx von TI einfach zu bewerten. umfassend zu beurteilen. Sie vereinfacht die Erstellung der (...)

Unterstützte Produkte und Hardware
Berechnungstool

ZIGBEE-POWER-CALC — Z-Stack™ Leistungsberechnungs-Tool

Mit diesem Tool können Benutzer der SimpleLink™ Z-Stack™ Software das Systemleistungsprofil für ein Endgerät im Ruhezustand in einer Zigbee-Anwendung analysieren. Mit diesem Rechner kann der Benutzer die potenzielle Systembatterielebensdauer bewerten und festlegen, wie die Batterielebensdauer (...)
Unterstützte Produkte und Hardware
Designtool

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

Der SimpleLine-Überprüfungsprozess für das Hardwaredesign stellt eine Möglichkeit bereit, direkt mit einem Fachexperten in Verbindung zu treten, welcher Sie bei der Prüfung Ihres Designs unterstützen und Ihnen ein wertvolles Feedback geben kann. Hier finden Sie einen einfachen dreistufigen Prozess (...)

Unterstützte Produkte und Hardware
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RGZ) 48 Ultra Librarian
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