Home Drahtlose Konnektivität Produkte für die drahtlose Verbindung in der Automobilindustrie
Home
Drahtlose Konnektivität
Produkte für die drahtlose Verbindung in der Automobilindustrie
NEU

CC2745R7-Q1

AKTIV

Drahtlos-SimpleLink™-Bluetooth®-LE-MCU für den Automobilbereich mit 864 kB Flash, HSM, APU, CAN-F

Jetzt bestellen
Datenblatt
Fehlerverzeichnis

CC2745R7-Q1

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 864 RAM (kByte) 128 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 10 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 864 RAM (kByte) 128 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 10 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Rating Automotive Operating temperature range (°C) -40 to 125 Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
VQFN (RHA) 40 36 mm² 6 x 6
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
filter Andere Produkte für die drahtlose Verbindung in der Automobilindustrie suchen
Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 10
Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC274xR-Q1, CC274xP-Q1 AutomotiveSimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. D) PDF | HTML 05 Nov 2025
* Errata CC274xx-Q1 SimpleLink ™ Wireless MCU Device Revision E Errata (Rev. B) PDF | HTML 06 Jan 2026
Application note CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 04 Feb 2026
Application note AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 11 Dez 2025
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 Nov 2025
User guide CC27xx Technical Reference Manual (Rev. A) PDF | HTML 19 Mai 2025
Certificate LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) (Rev. A) 13 Mai 2025
Technical article Solving key wireless connectivity cyber security challenges with low-power wireless MCUs (Rev. A) PDF | HTML 11 Dez 2024
Application note High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 27 Feb 2024
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 02 Okt 2017

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

LP-EM-CC2745R10-Q1 — CC2745R10-Q1 LaunchPad™-Entwicklungskit für drahtlose SimpleLink™ 2,4 GHz MCU

Dieses LaunchPad™-Entwicklungskit beschleunigt die Entwicklung von Bausteinen mit integriertem Leistungsverstärker und Funkunterstützung für den 2,4 Ghz-Betrieb. Das LaunchPad ist mit AEC-Q100-konformen Drahtlos-Mikrocontrollern (MCUs) ausgestattet, die Bluetooth® Low Energy (5.3 und die kommenden (...)

Benutzerhandbuch: PDF | HTML
Nicht verfügbar auf TI.com
Debug-Tastkopf

TMDSEMU110-U — XDS110 JTAG-Debug-Tastkopf

Der XDS110 von Texas Instruments ist eine neue Klasse von Debug-Tastkopf (Emulator) für Embedded-Prozessoren von TI. Der XDS110 ersetzt die XDS100-Familie und unterstützt eine größere Anzahl von Standards (IEEE1149.1, IEEE1149.7, SWD) in einem einzigen Pod. Alle XDS-Debug-Tastköpfe unterstützen (...)

Benutzerhandbuch: PDF
Nicht verfügbar auf TI.com
Debug-Tastkopf

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

Von: TASKING Germany GmbH
View Options
Entwicklungskit

LP-XDS110 — XDS110 LaunchPad™ Entwicklungskit-Debugger

Der Debugger des LaunchPad-Entwicklungskits LP-XDS110 ist ein Tool zum Programmieren und Debuggen von Mikrocontrollern, Mikroprozessoren und DSP XDS-kompatiblen Bausteinen von Texas Instruments (TI). Der LP-XDS110 wurde für den direkten Anschluss an geteilte LaunchPads über den 20-poligen (...)

Nicht verfügbar auf TI.com
Entwicklungskit

LP-XDS110ET — XDS110ET LaunchPad™ Entwicklungskit-Debugger mit EnergyTrace™-Software

Der Debugger des LaunchPad-Entwicklungskits LP-XDS110ET ist ein Tool zum Programmieren und Debuggen von Mikrocontrollern, Mikroprozessoren und DSP XDS-kompatiblen Bausteinen von Texas Instruments (TI). Der LP-XDS110ET wurde für den direkten Anschluss an geteilte LaunchPad-Entwicklungskits über den (...)

Nicht verfügbar auf TI.com
Software-Entwicklungskit (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Durchsuchen Download-Optionen
IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Start Download-Optionen
Support-Software

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Download-Optionen
Berechnungstool

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Download-Optionen
Zertifizierung

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Herunterladen
Designtool

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware
Herunterladen
Gerberdatei

LAUNCHXL-CC2745R10-Q1 Design Files (Rev. B)

SWRC393B.ZIP (7172 KB)
Herunterladen
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RHA) 40 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos