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MSPM0G3529-Q1

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ARM® Cortex®-M0+ MCU für die Automobilindustrie, 80 MHz, 512 kB Flash, 128 kB SRAM, zwei CAN-FDs,

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MSPM0G3529-Q1

AKTIV
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Produktdetails

CPU Arm Cortex-M0+ Frequency (MHz) 80 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AEC Q100, AES encryption, CAN FD, Comparator, DAC, DMA, MATHACL, RTC UART 7 CAN (#) CAN-FD Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Number of ADC channels 15, 19, 27 SPI 3 Operating temperature range (°C) -40 to 125 Rating Automotive Communication interface CAN-FD, I2C, LIN, SPI, UART Operating system FreeRTOS, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Nonvolatile memory (kByte) 512 Number of GPIOs 28, 44, 60, 74, 94 Number of I2Cs 3
CPU Arm Cortex-M0+ Frequency (MHz) 80 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AEC Q100, AES encryption, CAN FD, Comparator, DAC, DMA, MATHACL, RTC UART 7 CAN (#) CAN-FD Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Number of ADC channels 15, 19, 27 SPI 3 Operating temperature range (°C) -40 to 125 Rating Automotive Communication interface CAN-FD, I2C, LIN, SPI, UART Operating system FreeRTOS, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Nonvolatile memory (kByte) 512 Number of GPIOs 28, 44, 60, 74, 94 Number of I2Cs 3
LQFP (PM) 64 144 mm² (12 mm × 12 mm)
  • Core
    • Arm 32-bit Cortex M0+ CPU with memory protection unit, frequency up to 80MHz
  • Functional Safety-Compliant targeted

    • Developed for functional safety applications

    • Documentation to aid ISO 26262 system design will be available

    • Systematic capability up to ASIL B targeted

  • PSA-L1 Certification targeted
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62V to 3.6V
  • Memories
    • Up to 512KB of flash memory with error correction code (ECC)

      • Dual-bank with address swap for OTA updates

    • 16KB data flash bank with ECC protection
    • 128KB total SRAM
      • SRAM (Bank 0): 64kB SRAM with ECC protection or hardware parity, and retention down to STANDBY mode
      • SRAM (Bank 1): 64kB SRAM with retention down to STOP mode
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4Msps analog-to-digital converters (ADC) with up to 27 external channels
      • 14-bit effective resolution at 250ksps with hardware averaging
    • Three high-speed comparators (COMP) with integrated 8-bit reference DACs
      • 32ns propagation delay in high-speed mode
      • Support low-power mode operation down to <1µA
    • One 12-bit 1Msps digital-to-analog converter (DAC) with integrated output buffer
    • Programmable analog connections between ADC, COMP and DAC
    • Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 123µA/MHz (CoreMark)
    • SLEEP: 38µA/MHz
    • STOP: 223µA at 4MHz
    • STANDBY: 1.7µA at 32kHz with RTC and SRAM Bank 0 and state retention
    • SHUTDOWN: 92nA with IO wake-up capability
  • Intelligent digital peripherals
    • 12-channel DMA controller
    • Math accelerator supports DIV, SQRT, MAC and TRIG computations
    • Nine timers support up to 28 PWM channels
      • Two 16-bit general-purpose timers support QEI
      • Four 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband support and complimentary outputs up to 12 PWM channels
    • Two windowed watchdog timers (WWDT), one independent watchdog timer (IWDT)
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Seven UART interfaces
      • Two supporting LIN, IrDA, DALI, Smart Card, Manchester
      • Three supporting low-power operation in STANDBY mode
    • Three I2C interfaces supporting up to FM+ (1Mbit/s), SMBus/PMBus, and wakeup from STOP mode
    • Three SPI interfaces, with one supporting up to 32Mbits/s
    • Two Controller Area Network (CAN) interfaces support CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4 to 32MHz oscillator (SYSOSC) with up to ±1.2% accuracy
    • Phase-locked loop (PLL) up to 80MHz
    • Internal 32kHz low-frequency oscillator (LFOSC) with ±3% accuracy
    • External 4 to 48MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)
    • External clock input
  • Data integrity and encryption
    • AES-128/256 accelerator with support for GCM/GMAC, CCM/CBC-MAC, CBC, CTR
    • Secure key storage for up to four AES keys
    • Flexible firewalls for protecting code and data
    • True random number generator (TRNG)
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 94 GPIOs
      • Two 5V-tolerant open-drain IOs
      • Three high-drive IOs with 20mA drive strength
      • Four high-speed IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP (PM) (0.5mm pitch)
  • Family members (also see Device Comparison)
    • MSPM0G3529-Q1: 512KB flash, 128KB RAM
  • Development kits and software (also see Tools and Software)
  • Automotive qualification
    • AEC-Q100 Grade 1 (-40°C to 125°C)
  • Core
    • Arm 32-bit Cortex M0+ CPU with memory protection unit, frequency up to 80MHz
  • Functional Safety-Compliant targeted

    • Developed for functional safety applications

    • Documentation to aid ISO 26262 system design will be available

    • Systematic capability up to ASIL B targeted

  • PSA-L1 Certification targeted
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62V to 3.6V
  • Memories
    • Up to 512KB of flash memory with error correction code (ECC)

      • Dual-bank with address swap for OTA updates

    • 16KB data flash bank with ECC protection
    • 128KB total SRAM
      • SRAM (Bank 0): 64kB SRAM with ECC protection or hardware parity, and retention down to STANDBY mode
      • SRAM (Bank 1): 64kB SRAM with retention down to STOP mode
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4Msps analog-to-digital converters (ADC) with up to 27 external channels
      • 14-bit effective resolution at 250ksps with hardware averaging
    • Three high-speed comparators (COMP) with integrated 8-bit reference DACs
      • 32ns propagation delay in high-speed mode
      • Support low-power mode operation down to <1µA
    • One 12-bit 1Msps digital-to-analog converter (DAC) with integrated output buffer
    • Programmable analog connections between ADC, COMP and DAC
    • Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 123µA/MHz (CoreMark)
    • SLEEP: 38µA/MHz
    • STOP: 223µA at 4MHz
    • STANDBY: 1.7µA at 32kHz with RTC and SRAM Bank 0 and state retention
    • SHUTDOWN: 92nA with IO wake-up capability
  • Intelligent digital peripherals
    • 12-channel DMA controller
    • Math accelerator supports DIV, SQRT, MAC and TRIG computations
    • Nine timers support up to 28 PWM channels
      • Two 16-bit general-purpose timers support QEI
      • Four 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband support and complimentary outputs up to 12 PWM channels
    • Two windowed watchdog timers (WWDT), one independent watchdog timer (IWDT)
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Seven UART interfaces
      • Two supporting LIN, IrDA, DALI, Smart Card, Manchester
      • Three supporting low-power operation in STANDBY mode
    • Three I2C interfaces supporting up to FM+ (1Mbit/s), SMBus/PMBus, and wakeup from STOP mode
    • Three SPI interfaces, with one supporting up to 32Mbits/s
    • Two Controller Area Network (CAN) interfaces support CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4 to 32MHz oscillator (SYSOSC) with up to ±1.2% accuracy
    • Phase-locked loop (PLL) up to 80MHz
    • Internal 32kHz low-frequency oscillator (LFOSC) with ±3% accuracy
    • External 4 to 48MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)
    • External clock input
  • Data integrity and encryption
    • AES-128/256 accelerator with support for GCM/GMAC, CCM/CBC-MAC, CBC, CTR
    • Secure key storage for up to four AES keys
    • Flexible firewalls for protecting code and data
    • True random number generator (TRNG)
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 94 GPIOs
      • Two 5V-tolerant open-drain IOs
      • Three high-drive IOs with 20mA drive strength
      • Four high-speed IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP (PM) (0.5mm pitch)
  • Family members (also see Device Comparison)
    • MSPM0G3529-Q1: 512KB flash, 128KB RAM
  • Development kits and software (also see Tools and Software)
  • Automotive qualification
    • AEC-Q100 Grade 1 (-40°C to 125°C)

MSPM0G352x-Q1 microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform, operating at up to 80MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 256KB to 512KB of flash memory in small packages or high pin count packages (up to 100 pins). These devices include dual CAN-FD controllers, cybersecurity enablers, high performance integrated analog, and provide excellent low power performance across the operating temperature range.

The device has up to 512KB of embedded flash program memory with built-in error correction code (ECC) and up to 128KB SRAM (with ECC and parity protection for the first 64kB). The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

A set of high performance analog modules is provided, such as two simultaneously sampling 12-bit, 4Msps ADCs supporting up to 27 external channels, on-chip voltage reference (1.4V or 2.5V), one 12-bit 1Msps DAC, and three comparators operable in low-power and high-speed modes with additional built-in 8-bit reference DACs .

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G352x-Q1 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSPM0 Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.

MSPM0G352x-Q1 microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform, operating at up to 80MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 256KB to 512KB of flash memory in small packages or high pin count packages (up to 100 pins). These devices include dual CAN-FD controllers, cybersecurity enablers, high performance integrated analog, and provide excellent low power performance across the operating temperature range.

The device has up to 512KB of embedded flash program memory with built-in error correction code (ECC) and up to 128KB SRAM (with ECC and parity protection for the first 64kB). The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

A set of high performance analog modules is provided, such as two simultaneously sampling 12-bit, 4Msps ADCs supporting up to 27 external channels, on-chip voltage reference (1.4V or 2.5V), one 12-bit 1Msps DAC, and three comparators operable in low-power and high-speed modes with additional built-in 8-bit reference DACs .

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G352x-Q1 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSPM0 Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.
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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt MSPM0G352x-Q1 Automotive Mixed-Signal Microcontrollers With CAN-FD Interface datasheet (Rev. B) PDF | HTML 28.10.2025
* Errata MSPM0Gx51x Mixed-Signal Microcontrollers Errata (Rev. E) PDF | HTML 06.07.2026
Anwendungshinweis EMC Improvement Guide for MSPM0 (Rev. A) PDF | HTML 02.12.2025

Design und Entwicklung

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Evaluierungsplatine

LP-MSPM0G3519 — LP-MSPM0G3519 – Evaluierungsmodul

Das LP-MSPM0G3519 LaunchPad™ -Entwicklungskit ist ein einfach zu bedienendes Evaluierungsmodul (EVM) auf Basis des MSPM0G3519. Sie enthält alles, was Sie für den Einstieg in die Entwicklung auf der MSPM0G3519 M0+ MCU-Plattform benötigen, einschließlich einer integrierten Debug-Sonde für (...)

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Software-Entwicklungskit (SDK)

MSPM0-SDK — MSPM0 Software Development Kit (SDK)

Das MSPM0 SDK bietet eine ultimative Sammlung von Software, Tools und Dokumentation zur Beschleunigung der Entwicklung von Anwendungen für die MCU-Plattform MSPM0 in einem einzigen Softwarepaket.

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Software-Entwicklungskit (SDK)

MSPM0-SDK-DESIGN — Secure release for the MSPM0 Software Development Kit (SDK)

Secure release for the MSPM0 Software Development Kit (SDK)
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Software-Entwicklungskit (SDK)

MSPM0-SDK-DESIGN — Secure release for the MSPM0 Software Development Kit (SDK)

Secure release for the MSPM0 Software Development Kit (SDK)
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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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IDE, Konfiguration, Compiler oder Debugger

MSP-ZERO-CODE-STUDIO — Graphical development environment for designing applications for MSP microcontrollers

MSP Zero Code Studio ist eine visuelle Entwicklungsumgebung, die die Firmware-Entwicklung vereinfacht. Sie ermöglicht es, Mikrocontroller-Anwendungen in wenigen Minuten zu konfigurieren, zu entwickeln und auszuführen, ohne Programmierung oder IDE. Verfügbar als eigenständiger Download oder in der (...)

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IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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Onlineschulungen

MSPM0-ACADEMY — MSPM0™ academy

MSPM0 Academy delivers easy-to-use training modules that span a wide range of topics and LaunchPads in the MSPM0 MCU portfolio.
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Erste Schritte

CCSTUDIO-STARTHUB — Example application browser

Explore a vast library of example projects, categorized by application type, with support for multiple development environments
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MSP-MOTOR-CONTROL — MSPM0 Firmware solutions for motor control applications

MSP Motor Control ist eine Sammlung von Software, Tools und Beispielen, mit denen Sie Motoren mit MSPM0 Arm® Cortex® über M0 MCUs und beliebten Motortreiberlösungen innerhalb von maximal 30 Minuten betreiben können.

Die MSP-Motorsteuerung bietet Beispiele für unterstützte Hardwarekits zur (...)

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Erste Schritte

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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GUI für Evaluierungsmodul (EVM)

LP-MSPM0G3507-OOBE — Out-of-box experience GUI for LP-MSPM0G3507

Out-of-box experience GUI for LP-MSPM0G3507
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GUI für Evaluierungsmodul (EVM)

MSPM0-ANALOG-CONFIGURATOR — Analog Configurator for MSPM0

Der MSPM0 „Analog Configurator“ ist ein grafisches Konfigurationstool, das den Entwurf und die Bereitstellung einer analogen Signalkette mit einem MSPM0-Baustein vereinfacht und beschleunigt, ohne dass eine traditionelle Codierungsentwicklung erforderlich ist.

Das Tool verwendet eine intuitive (...)

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Software-Programmiertool

MSP-GANG-SOFTWARE — MSP-GANG Software

The MSP Gang Programmer (MSP-GANG) is a MSPM0/MSP430/MSP432 device programmer that can program up to eight identical devices at the same time.
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Software-Programmiertool

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash ist Teil des umfassenden CCStudio™-Entwicklungsökosystem von TI und ein Softwaretool zur Programmierung des integrierten Flash-Speichers von TI-Mikrocontrollern und drahtlosen Kommunikationsbausteinen sowie des integrierten Flash-Speichers für TI-Prozessoren. UniFlash bietet sowohl (...)

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