Produktdetails

Coprocessors 2 Dual Arm Cortex-M4 Display type 1 LCD OUT, 1 SD-DAC Protocols Ethernet PCIe 2 PCIe Gen2 Hardware accelerators 1 Audio Tracking Logic Features Multimedia Operating system Android, Linux, RTOS TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP873220-Q1, LP87332D-Q1, TPS659119-Q1, TPS65917-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
Coprocessors 2 Dual Arm Cortex-M4 Display type 1 LCD OUT, 1 SD-DAC Protocols Ethernet PCIe 2 PCIe Gen2 Hardware accelerators 1 Audio Tracking Logic Features Multimedia Operating system Android, Linux, RTOS TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP873220-Q1, LP87332D-Q1, TPS659119-Q1, TPS65917-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for infotainment applications
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • PWMSS
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
    • GPIOs when not used for video
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • Architecture designed for infotainment applications
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • PWMSS
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
    • GPIOs when not used for video
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet DRA78x Infotainment Applications Processor datasheet (Rev. H) PDF | HTML 04 Feb 2020
* Errata DRA78x Silicon Errata (Rev. B) 01 Okt 2019
Application note Integrating virtual DRM between VISION SDK and PSDK on Jacinto6 SOC PDF | HTML 05 Mai 2021
Application note IVA-HD Sharing Between VISION-SDK and PSDKLA on Jacinto6 SoC PDF | HTML 24 Aug 2020
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 06 Jan 2020
User guide DRA78x Technical Reference Manual (Rev. D) 30 Jul 2019
Application note Integrating New Cameras With Video Input Port on DRA7xx SoCs PDF | HTML 11 Jun 2019
Application note Achieving Early CAN Response on DRA7xx Devices 28 Nov 2018
Application note DRA74x_75x/DRA72x Performance (Rev. A) 31 Okt 2018
Application note Audio Post Processing Engine on Jacinto™ DRA7x Family of Devices 14 Sep 2018
Application note The Implementation of YUV422 Output for SRV 02 Aug 2018
Application note MMC DLL Tuning (Rev. B) 31 Jul 2018
Application note Integrating AUTOSAR on TI SoC: Fundamentals 18 Jun 2018
Application note ECC/EDC on TDAxx (Rev. B) 13 Jun 2018
Application note Tools and Techniques to Root Case Failures in Video Capture Subsystem 12 Jun 2018
Application note Sharing VPE Between VISIONSDK and PSDKLA 04 Mai 2018
Application note Android Boot Optimization on DRA7xx Devices (Rev. A) 13 Feb 2018
Application note Using Peripheral Boot and DFU for Rapid Development on Jacinto 6 Devices (Rev. A) 30 Nov 2017
Application note Jacinto6 Spread Spectrum Clocking Configuration (Rev. A) 27 Nov 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 07 Nov 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 03 Nov 2017
Application note Optimization of GPU-Based Surround View on TI’s TDA2x SoC 12 Sep 2017
Application note Using DSS Write-Back Pipeline for RGB-to-YUV Conversion on DRA7xx Devices 14 Aug 2017
Application note Software Guidelines to EMIF/DDR3 Configuration on DRA7xx Devices 12 Jul 2017
Application note Linux Boot Time Optimizations on DRA7xx Devices 31 Mär 2017
Application note Interfacing DRA75x and DRA74x Audio to Analog Codecs (Rev. A) 17 Feb 2017
Application note Early Splash Screen on DRA7x Devices 31 Jan 2017
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15 Dez 2016
Application note Gstreamer Migration Guidelines 26 Apr 2016
Application note Flashing Binaries to DRA7xx Factory Boards Using DFU 14 Apr 2016
Application note Tools and Techniques for Audio Debugging 13 Apr 2016
Application note Debugging Tools and Techniques With IPC3.x 30 Mär 2016
Application note Modifying Memory Usage for IPUMM Applications Loaded IPC 3.x for DRA75x, DRA74x (Rev. A) 15 Jan 2016
White paper Informational ADAS as Software Upgrade to Today’s Infotainment Systems 14 Okt 2014
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13 Aug 2014
White paper Today’s high-end infotainment soon becoming mainstream 02 Jun 2014

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

DRA78XEVM — DRA78x-Evaluierungsmodul

The Jacinto™ DRA78x evaluation module (EVM) is an evaluation platform designed to speed up development efforts and reduce time-to-market for Radio Signal Processor (RSP) applications. The EVM is based on the Jacinto DRA78x SoC, which incorporates a heterogeneous, scalable architecture (...)

Benutzerhandbuch: PDF
Debug-Tastkopf

LB-3P-TRACE32-DSP — Debug- und Trace-System Lauterbach TRACE32 für digitale Signalprozessoren (Digital Signal Processors

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

Software-Entwicklungskit (SDK)

PROCESSOR-SDK-ANDROID-AUTOMOTIVE-DRA7X

Processor SDK Linux Automotive

Processor SDK Linux Automotive is the foundational software development platform for TI's Jacinto™ DRAx family of Infotainment SoCs. The software framework allows users to develop feature-rich Infotainment solutions such as reconfigurable digital instrument (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-AUTOMOTIVE-DRA7X PROCESSOR-SDK-LINUX-AUTOMOTIVE-DRA7X

Processor SDK Linux Automotive

Processor SDK Linux Automotive is the foundational software development platform for TI's Jacinto™ DRAx family of Infotainment SoCs. The software framework allows users to develop feature-rich Infotainment solutions such as reconfigurable digital instrument (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-RTOS-AUTOMOTIVE-DRA7X

Processor SDK Linux Automotive

Processor SDK Linux Automotive is the foundational software development platform for TI's Jacinto™ DRAx family of Infotainment SoCs. The software framework allows users to develop feature-rich Infotainment solutions such as reconfigurable digital instrument (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

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IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

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Betriebssystem (BS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
Support-Software

VCTR-3P-MICROSAR — Vector MICROSAR AUTOSAR-Software für Mikrocontroller und Hochleistungscomputer (HPCs)

Die MICROSAR- und DaVinci-Produktfamilien vereinfachen die Steuergeräte-Entwicklung mit ausgefeilter Embedded-Software und leistungsstarken Entwicklungswerkzeugen für Mikrocontroller und HPCs. Mit fortschrittlicher Infrastruktursoftware schaffen Sie eine optimale Basis für Ihre Steuergeräte und (...)
Simulationsmodell

DRA78x BSDL Model

SPRM713.ZIP (9 KB) - BSDL Model
Simulationsmodell

DRA78x IBIS Model

SPRM703.ZIP (10940 KB) - IBIS Model
Simulationsmodell

DRA78x Thermal Model

SPRM704.ZIP (1 KB) - Thermal Model
Berechnungstool

CLOCKTREETOOL — Taktbaum-Tool für Sitara, Automobilanwendungen, Sichtanalytik und digitale Signalprozessoren

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCBGA (ABF) 367 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

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