ZHCSH90A January 2015 – December 2017 VSP5324-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | VSP5324-Q1 | UNIT | |
---|---|---|---|
RGC (VQFN) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 20.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 6.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 2.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 2.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.4 | °C/W |